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Apparatus and method for cooling electronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0111106 (1993-08-24)
발명자 / 주소
  • Chao Shun-Lung (Plano TX) McEwin
  • Jr. Louis W. (Plano TX)
출원인 / 주소
  • Convex Computer Corporation (Richardson TX 02)
인용정보 피인용 횟수 : 75  인용 특허 : 0

초록 ▼

A heat transfer assembly 11 is disclosed for transferring heat from a heat generating electronic device 15 or computer chip to ambient air. The heat transfer assembly 11 is comprised of a heat pipe 20 mounted perpendicular to a heat generating electronic device 15. The heat transfer assembly 11 is d

대표청구항 ▼

A heat transfer device, said device mountable to a heat generating electrical device, said transfer device comprising: a heat pipe having a proximal end for mating with the electrical device and a sealed distal end; fin means retained to said heat pipe by an outward pressure exerted on said fin mean

이 특허를 인용한 특허 (75)

  1. Bhatia Rakesh, Airflow heat exchanger for a portable computing device and docking station.
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  4. Johnson James E. ; Darcy Ronald J., Apparatus capable of high power dissipation during burn-in of a device under test.
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  68. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Wick having liquid superheat tolerance and being resistant to back-conduction, evaporator employing a liquid superheat tolerant wick, and loop heat pipe incorporating same.
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  71. Hul-Chun, Hsu, Wick structure of heat pipes.
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  73. Vanderaa, Joel D.; Grunig, Christina A.; Hurd, Ronald F., Wireless communication adapter for field devices.
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