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특허 상세정보

Structure for cooling an integrated circuit

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20   
미국특허분류(USC) 361/719 ; 165/804 ; 257/713 ; 361/699
출원번호 US-0149558 (1993-11-09)
우선권정보 JP-0297520 (1992-11-09)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 23  인용 특허 : 0
초록

In a structure for cooling an integrated circuit (IC), a hollow cylindrical member is mounted on a cold plate and receives a heat conductor therein. The heat conductor is a cylindrical member which is closed by a flat plate at one end thereof. Silicone gel fills a gap between the hollow cylindrical member and the heat conductor and allows the heat conductor to move due to the elasticity thereof. When the cold plate is fixed in place on the IC which is mounted on a printed circuit board, the heat conductor moves in matching relation to the height and incl...

대표
청구항

A structure for cooling an integrated circuit (IC), comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a hollow cylindrical member mounted on said cold plate; a heat conductor comprising a hollow cylindrical portion and a flat portion closing one end of said hollow cylindrical portion, said hollow cylindrical portion being inserted in said hollow cylindrical member while said flat portion connected to a top surface of said IC; an elastic material injected into a gap betwe...

이 특허를 인용한 특허 피인용횟수: 23

  1. Straznicky, Ivan; Power Fardy, Richard Jude. Adjustable height liquid cooler in liquid flow through plate. USP2009047515418.
  2. Stuckey, Larry. Advanced thermal control interface. USP2014068757250.
  3. Aoki, Russell S.; Crocker, Michael T.; Carter, Daniel P.. Chamber sealing valve. USP2010117836748.
  4. Aoki,Russell S.; Crocker,Michael T.; Carter,Daniel P.. Chamber sealing valve. USP2008097418998.
  5. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E.. Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled. USP2007117298617.
  6. Campbell,Levi A.; Chu,Richard C.; Ellsworth,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E.. Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled. USP2008067385817.
  7. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E.. Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled. USP2009027486514.
  8. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E.. Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled. USP2010117830664.
  9. Messina, Gaetano P.; Mok, Lawrence S.; Yuan, Tsorng-Dih. Cooling device with multiple compliant elements. USP2004086778393.
  10. Feierbach,Gary F.. Cooling method for ICS. USP2008067385821.
  11. Bodenweber, Paul F.; Marston, Kenneth C.; Sikka, Kamal K.; Toy, Hilton T.; Werner, Randall J.; Zitz, Jeffrey A.. Cooling structure for electronic boards. USP20190110172258.
  12. Bodenweber, Paul F.; Marston, Kenneth C.; Sikka, Kamal K.; Toy, Hilton T.; Werner, Randall J.; Zitz, Jeffrey A.. Cooling structure for electronic boards. USP2017089721870.
  13. d'Amario, Rino. Electric discharge machine. USP2017069682436.
  14. Vittet, Jean-Pierre; Goumaz, Jean-Fran.cedilla.ois. Electronic module comprising cooling elements for electronic components. USP2003016504722.
  15. Kim,Sarah E.; List,R. Scott; Maveety,James G.; Myers,Alan M.; Vu,Quat T.. Electroosmotic pumps using porous frits for cooling integrated circuit stacks. USP2006087084495.
  16. Vos,David L.; Stutzman,Randall J.; Larcheveque,Jon; Urda,Eugene J.. Flow through cooling assemblies for conduction-cooled circuit modules. USP2008017324336.
  17. Toftloekke, Mikkel Block; Ratliff, Christopher; Lykke, Peter; Berk, Todd; Eriksen, André Sloth. Integrated liquid cooling system. USP2013018358505.
  18. Chrysler,Gregory M.; Prasher,Ravi. Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon. USP2008107435623.
  19. Chrysler,Gregory M.; Prasher,Ravi. Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon. USP2006016992382.
  20. Toftloekke, Mikkel Block; Lykke, Peter; Kristensen, Poul Hove. Liquid cooling system for an electronic system. USP2013048432691.
  21. Banzai Masato,JPX. Power supply device for electrical discharge machining. USP2000066080953.
  22. Sauer, Rohn; Johnson, Scott; Garcia, Ediberto R.. Scaleable parallel flow micro-channel heat exchanger and method for manufacturing same. USP2015018925623.
  23. McBain, Richard Austin; Hicks, David Arthur; Padula, Cory Frederick. Structures for holding cards incorporating electronic and/or micromachined components. USP2009047515416.