|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||361/719 ; 165/804 ; 257/713 ; 361/699|
|발명자 / 주소|
|출원인 / 주소|
|인용정보||피인용 횟수 : 23 인용 특허 : 0|
In a structure for cooling an integrated circuit (IC), a hollow cylindrical member is mounted on a cold plate and receives a heat conductor therein. The heat conductor is a cylindrical member which is closed by a flat plate at one end thereof. Silicone gel fills a gap between the hollow cylindrical member and the heat conductor and allows the heat conductor to move due to the elasticity thereof. When the cold plate is fixed in place on the IC which is mounted on a printed circuit board, the heat conductor moves in matching relation to the height and incl...
A structure for cooling an integrated circuit (IC), comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a hollow cylindrical member mounted on said cold plate; a heat conductor comprising a hollow cylindrical portion and a flat portion closing one end of said hollow cylindrical portion, said hollow cylindrical portion being inserted in said hollow cylindrical member while said flat portion connected to a top surface of said IC; an elastic material injected into a gap betwe...