[특허]Semiconductor wafer polisher and method

Semiconductor wafer polisher and method 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-021/465
출원번호	US-0214969 (1994-03-18)
발명자 / 주소	Desai Ankur H. (St. Peters MO) Wisnieski Michael S. (O\Fallon MO) Golland David I. (Chesterfield MO)
출원인 / 주소	MEMC Electronic Materials, Inc. (St. Peters MO 02)
인용정보	피인용 횟수 : 49 인용 특허 : 0

초록 ▼

A semiconductor wafer polisher of the present invention for polishing at least one semiconductor wafer to flatten a first face of the wafer and reduce the thickness of the wafer from an initial thickness t1 to a predetermined final thickness t2. The polisher comprises a first surface including a polishing surface portion, a second surface including a second surface portion, and a wafer carrier for holding the semiconductor wafer between the polishing surface portion and the second surface portion. At least one polishing limiter is between the first and second surfaces for limiting the reduction in thickness of the wafer. The wafer carrier and polishing limiter are integrally formed such that the polishing limiter and wafer carrier constitute a single unitary piece. The polishing limiter has at least one rubbing surface adapted for rubbing against one of the first and second surfaces and is sized and configured such that the rubbing surface is spaced axially from the one of the first and second surfaces when the semiconductor wafer has the thickness t1 and such that the rubbing surface rubs against the one of the first and second surfaces and the polishing limiter extends from the second surface to the first surface when the semiconductor wafer has the thickness t2. The polishing limiter has a greater resistance to polishing than that of the semiconductor wafer such that the polishing limiter prevents the polishing surface and the second surface portion from further moving axially toward each other when the polishing limiter extends from the second surface to the first surface to prevent the wafer from being reduced in thickness beyond the thickness t2.

대표청구항 ▼

A semiconductor wafer polisher for polishing at least one semiconductor wafer, the wafer having first and second opposite faces, the polisher being adapted to polish the first face of the semiconductor wafer to flatten the first face and reduce the thickness of the wafer from an initial thickness t1 to a final thickness t2, the final thickness t2 being thinner than the initial thickness t1, the polisher comprising: a first table having a first plate and a first surface on the first plate, the first surface including a planar first surface portion adapted to abut the first face of the semiconductor wafer; a second surface including a planar second surface portion adapted to abut the second face of the semiconductor wafer; at least one of the first and second surfaces being rotatable about an axis to effectuate relative rotation between the planar first and second surface portions, the first and second surface portions lying in respective parallel planes; the first surface portion comprising a planar polishing surface, the relative rotation between the first and second surfaces effectuating relative rotation between the polishing surface and the first face of the semiconductor wafer for polishing the first face; the planar polishing surface and the second surface portion being urged toward each other to press the first face of the semiconductor wafer and the polishing surface against each other such that the planar polishing surface rubs against the first face of the semiconductor wafer upon rotation of the polishing surface relative to the semiconductor wafer to wear against the first face of the semiconductor wafer, the polishing surface and the second surface portion moving axially toward each other as the semiconductor wafer is reduced in thickness; a wafer carrier for holding the semiconductor wafer between the polishing surface and the second surface portion; a polishing limiter integrally formed with the wafer carrier such that the polishing limiter and wafer carrier constitute a single unitary piece, the polishing limiter is between the first and second surfaces for limiting the reduction in thickness of the wafer and has at least one rubbing surface adapted for rubbing against one of the first and second surfaces, the polishing limiter being sized and configured such that the rubbing surface is spaced axially from said one of the first and second surfaces when the semiconductor wafer has the thickness t1 and such that the rubbing surface rubs against said one of the first and second surfaces and the polishing limiter extends from the second surface to the first surface when the semiconductor wafer has the thickness t2, the polishing limiter having a greater resistance to polishing than that of the semiconductor wafer such that the polishing limiter prevents the polishing surface and the second surface portion from further moving axially toward each other when the polishing limiter extends from the second surface to the first surface to prevent the wafer from being reduced in thickness beyond the thickness t2.

이 특허를 인용한 특허 (49)

Hardy, L. Charles; Kranz, Heather K.; Wood, Thomas E.; Kaisaki, David A.; Gagliardi, John J.; Clark, John C.; Savu, Patricia M.; Clark, Philip G., Compositions and methods for modifying a surface suited for semiconductor fabrication.
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Horiguchi, Akira; Isobe, Ken; Tanaka, Heigo; Fukushima, Tomio; Murata, Kiyohide; Takeda, Tsunco; Uzu, Yoshiaki; Matsumoto, Hiroshi, Double side polishing method and apparatus.
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Horiguchi, Akira; Isobe, Ken; Tanaka, Heigo; Fukushima, Tomio; Murata, Kiyohide; Takeda, Tsuneo; Uzu, Yoshiaki; Matsumoto, Hiroshi, Double side polishing method and apparatus.
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Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
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Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
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Duescher, Wayne O., Fixed-spindle and floating-platen abrasive system using spherical mounts.
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Duescher, Wayne O., Fixed-spindle floating-platen workpiece loader apparatus.
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Kamijima Akifumi,JPX, Grinding method of microelectronic device.
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Krishnan, Sandeep; Moy, Keng; Gurary, Alexander I.; King, Matthew; Boguslavskiy, Vadim; Krommenhoek, Steven, Keyed spindle.
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Krishnan, Sandeep; Moy, Keng; Gurary, Alexander I.; King, Matthew; Boguslavskiy, Vadim; Krommenhoek, Steven, Keyed spindle.
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Krishnan, Sandeep; Moy, Keng; Gurary, Alexander I.; King, Matthew; Boguslavskiy, Vadim; Krommenhoek, Steven, Keyed wafer carrier.
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Krishnan, Sandeep; Moy, Keng; Gurary, Alexander I.; King, Matthew; Boguslavskiy, Vadim; Krommenhoek, Steven, Keyed wafer carrier.
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Bex,Brian L.; Chen,David K., Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier.
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Guoqiang David Zhang ; Yun-Biao Xin ; Henry F. Erk, Method and apparatus for a wafer carrier having an insert.
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Suzuki,Shoji; Adachi,Koji; Mori,Richard Shigetoshi, Method and apparatus for polishing a workpiece.
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Grabbe, Alexis; Bjelopavlic, Mick; Hull, Ashley S.; Haler, Michele L.; Zhang, Guoqiang (David); Erk, Henry F.; Xin, Yun-Biao, Method and apparatus for processing a semiconductor wafer using novel final polishing method.
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Bauer, Petra; Pfaffinger, Alexander; Royer, Christian, Method for determining fittings for constant tables of automatic placement machines.
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Schwandner, Juergen, Method for the double-side polishing of a semiconductor wafer.
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Zhang David ; Vogelgesang Ralph V. ; Erk Henry F., Method of conditioning wafer polishing pads.
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Kai Fumitaka,JPX ; Maeda Masahiko,JPX ; Kawate Kenji,JPX, Method of making semiconductor wafers.
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Bruxvoort Wesley J. ; Culler Scott R. ; Ho Kwok-Lun ; Kaisaki David A. ; Kessel Carl R. ; Klun Thomas P. ; Kranz Heather K. ; Messner Robert P. ; Webb Richard J. ; Williams Julia P., Method of modifying an exposed surface of a semiconductor wafer.
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Kaisaki David A. ; Kranz Heather K. ; Wood Thomas E. ; Hardy L. Charles, Method of planarizing the upper surface of a semiconductor wafer.
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Krishnan, Sandeep; Moy, Keng; Gurary, Alexander I.; King, Matthew; Boguslavskiy, Vadim; Krommenhoek, Steven, Multi-keyed spindle.
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Krishnan, Sandeep; Moy, Keng; Gurary, Alexander I.; King, Matthew; Boguslavskiy, Vadim; Krommenhoek, Steven, Multi-keyed wafer carrier.
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Suzuki Junpei,JPX ; Kunii Yutaka,JPX, Planetary gear system parallel planer.
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Kann,Gunther; Thurner,Manfred; Wajand,Karl Heinz; Deser,Armin; Schnappauf,Markus, Process for producing a semiconductor wafer.
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Wenski, Guido; Heier, Gerhard; Winkler, Wolfgang; Altmann, Thomas, Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process.
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Sandhu, Gurtej Singh; Yu, Chris Chang, Semiconductor wafer for improved chemical-mechanical polishing over large area features.
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Guido Wenski DE; Thomas Altmann DE; Ernst Feuchtinger DE; Willibald Bernwinkler DE; Wolfgang Winkler DE; Gerhard Heier DE, Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer.
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Wenski, Guido; Altmann, Thomas; Feuchtinger, Ernst; Bernwinkler, Willibald; Winkler, Wolfgang; Heier, Gerhard, Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer.
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Krishnan, Sandeep; Moy, Keng; Gurary, Alexander I.; King, Matthew; Boguslavskiy, Vadim; Krommenhoek, Steven, Spindle key.
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Krishnan, Sandeep; Moy, Keng; Gurary, Alexander I.; King, Matthew; Boguslavskiy, Vadim; Krommenhoek, Steven, Spindle key.
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Chiou Hung-Wen,TWX ; Chen Lai-Juh,TWX, Temperature compensated chemical mechanical polishing to achieve uniform removal rates.
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Duescher, Wayne O., Three-point fixed-spindle floating-platen abrasive system.
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Duescher, Wayne O., Three-point spindle-supported floating abrasive platen.
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Fisher ; Jr. Thomas Robert ; Gustafson Carol Elaine Christine ; Landers William Francis ; Minunni ; Jr. John Carlo ; Sandwick Thomas Edwin ; Ticknor Adam Dan, Vertical polishing tool and method.
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Bjelopavlic,Mick; Grabbe,Alexis; Haler,Michele; Ragan,Tracy M., Wafer carrier.
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Chang, Chung-Ying; Yang, Tzu-Ching, Wafer carrier.
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Chang, Chung-Ying; Yang, Tzu-Ching; Chang, Chia-Sheng, Wafer carrier.
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Gurary, Alexander I.; Moy, Keng; Chang, Chenghung Paul, Wafer carrier having pockets.
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Gurary, Alexander I.; Moy, Keng; Chang, Chenghung Paul, Wafer carrier having pockets.
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Gurary, Alexander I.; Moy, Keng; Chang, Paul, Wafer carrier having pockets.
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Gurary, Alexander I.; Moy, Keng; Chang, Paul, Wafer carrier having pockets.
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Krishnan, Sandeep; Moy, Keng, Wafer carrier having pockets.
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Krishnan, Sandeep; Moorkannaiah, Raghu, Wafer carrier with a 14-pocket configuration.
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Krishnan, Sandeep; Moy, Keng, Wafer carrier with a 31-pocket configuration.
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Gurary, Alexander; Deshpande, Mandar; Parekh, Aniruddh; Rashkovsky, Yuliy, Wafer carrier with a multi-pocket configuration.
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Gurary, Alexander; Deshpande, Mandar; Parekh, Aniruddh; Rashkovsky, Yuliy, Wafer carrier with a multi-pocket configuration.
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Duescher, Wayne O., Workpiece spindles supported floating abrasive platen.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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연합인증

Semiconductor wafer polisher and method 원문보기

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Semiconductor wafer polisher and method 원문보기

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이 특허를 인용한 특허 (49)

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