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Apparatus and method for cooling heat generating electronic components in a cabinet 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05R-007/20
출원번호 US-0215376 (1994-03-21)
발명자 / 주소
  • Gourdine Meredith C. (Houston TX)
출원인 / 주소
  • Energy Innovations, Inc. (Houston TX 02)
인용정보 피인용 횟수 : 73  인용 특허 : 0

초록 ▼

Electronic components in a cabinet are cooled by enclosing and isolating predetermined heat generating electronic components which may include those with heat sinks from other electronic components in the cabinet and providing a dedicated air flow pathway to conduct a stream of air from the cabinet

대표청구항 ▼

A method of cooling electronic components within a cabinet comprising the steps of: enclosing at least one predetermined heat generating electronic component inside a cabinet to isolate it from other electronic components in the cabinet; providing an isolated air flow pathway to conduct air from the

이 특허를 인용한 특허 (73)

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  3. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
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  11. Tambe, Atul, Apparatus for externally changing the direction of air flowing through electronic equipment.
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  18. Mallia, Michael; Fulton, James, Cabinet for electronic equipment.
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  29. Wu, Chun-Ming, Condensing device and thermal module using same.
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  30. Fedorov, Andrei G., Confining/focusing vortex flow transmission structure, mass spectrometry systems, and methods of transmitting particles, droplets, and ions.
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  31. Mochizuki Masataka,JPX ; Mashiko Koichi,JPX ; Goto Kazuhiko,JPX ; Saito Yuji,JPX, Cooler for electronic devices.
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  32. Mochizuki Masataka,JPX ; Mashiko Koichi,JPX ; Goto Kazuhiko,JPX ; Saito Yuji,JPX ; Eguchi Katsuo,JPX ; Nagaki Yoshihiro,JPX ; Takamiya Akihiro,JPX ; Nguyen Thang Toan,JPX, Cooler for electronic devices.
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  33. Yatougo, Isamu; Suwada, Mutumi; Katsumata, Takaaki, Cooling device for electronic unit.
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  34. Yatougo, Isamu; Suwada, Mutumi; Katsumata, Takaaki, Cooling device for electronic unit.
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  35. Le, Thoai-Thai; Gerstmeier, Guenter; Ma, David SuitWai; Wang, Tao, Cooling hood for circuit board.
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  37. Greco, David, Cooling system for electronic devices.
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  38. Kang, Joon; Cho, Jin-hyun, Cooling unit and display apparatus having the same.
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  39. Dauksher, Walter J., Device for enhancing the local cooling of electronic packages subject to laminar air flow.
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  40. Chen, Chin-Ping, Device to convey the cool air from an air-conditioner into a computer.
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  46. Melgaard, Hans L., Enclosure and method for temperature-sensitive components.
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  61. Hoffmann, Christopher J.; Barber, Jim; Snell, Rodney, Mobile broadband communications system, such as a deployable self-contained portable system.
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  63. Nishimura,Yoshifumi, Once-through forced air-cooled heat sink for a projection display apparatus.
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  64. Heule, Stefan; Sologubenko, Alexandr, Room air conditioner having a liquid-to-air heat exchanging device with peltier elements.
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  67. Walter Nicolai DE; Adam Pawlowski DE, Switch cupboard with devices for cooling the hot air inside.
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  68. Mahalingam, Raghavendran; Heffington, Samuel N.; Glezer, Ari; Lutz, Ronald, Synthetic jet ejector for the thermal management of PCI cards.
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  69. Gregory W. Pautsch ; Kent T. McDaniel ; Eric Dwayne Lakin ; James Joseph Jirak, System and method for cooling electronic components.
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  71. Howard,Scott Douglas; Irwin,Philip Warwick, System for cooling environmentally sealed enclosures.
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  72. Huettner, Cary Michael; Justin, Jeffrey L.; O'Connell, Michael Desmond; Peters, Kenneth Robert; Vande Corput, Gregory Scott, System, method and apparatus for noise and heat suppression, and for managing cables in a computer system.
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  73. East, W. Joe; Weiss, Elliot, Thermal transfer devices with fluid-porous thermally conductive core.
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