[특허]Microelectronics inspection system

Microelectronics inspection system 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01B-011/24
출원번호	US-0025442 (1993-03-01)
발명자 / 주소	Siu Bernard (732 N. Diamond Bar Blvd. Diamond Bar CA 91765)
인용정보	피인용 횟수 : 42 인용 특허 : 0

초록 ▼

The present invention is directed to an improved system for inspection of microelectronic assemblies, including chips and interconnection elements such as wires, ball bonds, and wedge bonds contained therein. This system includes a high speed illumination subsystem, a dual magneification video camera sensor subsystem, a commercial machine vision system supported by a video display and printer, a three dimensional transport stage for moving the microcircuit under inspection, and a computer controller for operational control under unique software of all of the above system elements. The illumination subsystem includes formation of multiple light rings starting with light generated by a tungsten lamp, collimation by a condenser lens, then passage through a liquid crystal light valve having a plurality of circular active transmission areas. A projector lens receives both rings of light and projects the larger ring on an ellipsoidal reflector which redirects the light onto the microcircuit at a large off-verical axis angle which has been found to provide optimal contrast for rounded bodies such a wires and ball bonds. The projector lens also focuses the more narrow beam of light on a torroidal Fresnel lens mounted above the microcircuit, and which also redirects the beam at a smaller off-vertical axis angle which has been found provide optimal contrast for wedge shaped bonds. By alternating the light transmission through each of these rings at high speed, defective reflective signatures of interconnect wires, ball bonds, bond wedges and microcircuit chips can be captured by the an objective lens and mirror reflected to the light responsive camera system.

대표청구항 ▼

A system for inspection of microelectronic assemblies having internal microcircuit chips with terminals electrically connected by wire bonding means to circuit conductive traces on a mounting substrate, wherein chip bodies and interconnection elements including wires, ball bonds, and bond wedges which may be visually discriminated against similar reflective backgrounds, comprising: a plurality of concentric light ring source means for illumination of said chips and interconnection elements placed under the center of each said concentric light ring; a plurality of focusing means for directing each said light ring source at a predetermined angle of incidence relative to said microcircuit so that optimal contrast is obtained between reflections from said chip bodies and interconnection elements and similar background trace reflections (;), wherein said focusing means comprise: at least one said focusing means for directing a first said light ring at an illumination angle off vertical which is sufficiently large so as to separate the reflection from rounded inspection objects from conductor background traces made of a similar material; at least a second said focusing means directing a second said light ring at an illumination angle off vertical which is sufficiently small so as to separate the reflection from inspection objects having variable sloped surfaces from substrate background traces made of a similar material; and first switching means for simultaneously directing said first and second said light rings so as to separate the reflection from inspection objects having flat body surfaces from other substrate and inspection object background reflections; first optical means for collecting said light reflections from said chip bodies and interconnection elements emanating along a fixed axis through the concentric centers of both said ring lights and for redirecting said reflections for viewing, said first optical means comprising: second optical turning means for directing said collected reflections away from said concentric center; a plurality of magnification camera means, each having a separate input magnification lens means, for substantially simultaneous conversion of optical images into electronic signals; third optical beam splitting means for separating said reflected light from said second optical turning means into a separate optical beams directed to each said input magnification means; and second switching means for activating any selected one or more said camera means to convert said light into said electronic signals; and viewing means for visual inspection of said chip bodies and interconnection elements in order to determine bonding defects.

이 특허를 인용한 특허 (42)

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Microelectronics inspection system 원문보기

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Microelectronics inspection system 원문보기

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이 특허를 인용한 특허 (42)

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