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Cooling structure for power supply device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0257707 (1994-06-10)
우선권정보 JP-0257628 (1993-09-20)
발명자 / 주소
  • Katooka Masao (Kawanishi JPX) Kawashima Yoshimasa (Kobe JPX) Sakurada Makoto (Yao JPX) Makitani Atsushi (Toyonaka JPX)
출원인 / 주소
  • Sansha Electric Manufacturing Company, Ltd. (Osaka JPX 03)
인용정보 피인용 횟수 : 56  인용 특허 : 0

초록

A power supply device includes power semiconductor devices generating Joule\s heat by themselves and circuit components generating no considerable heat by themselves but, as a group, generate a slight rise in temperature, which are included in a power supply circuit of the device. A structure is arr

대표청구항

A power supply device comprising: a housing including first and second side walls facing each other, said first sidewall having spaced air inlet and outlet ports formed therein, said second side wall having two spaced openings formed therein; a cooling structure comprising: partition means extending

이 특허를 인용한 특허 (56)

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