[특허]Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon

Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0317614 (1994-09-26)
우선권정보	JP-0065732 (1992-03-24); JP-0239561 (1992-09-08)
발명자 / 주소	Matsushima Hitoshi (Ryugasaki JPX) Komatu Toshihiro (Ibaraki JPX) Kondou Yoshihiro (Hadano JPX) Hatada Toshio (Tsuchiura JPX) Iwai Susumu (Hadano JPX) Honma Tetsuro (Hadano JPX) Iino Toshiki (Ibaraki
출원인 / 주소	Hitachi, Ltd. (Tokyo JPX 03)
인용정보	피인용 횟수 : 49 인용 특허 : 0

초록 ▼

A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.

대표청구항 ▼

A jet cooling apparatus for cooling electronic equipment, in combination with an electronic equipment to be cooled, said electronic equipment including a plurality of electronic printed circuit boards mounted on a part of the electronic equipment, semiconductor devices, which are heat generating members, being mounted on the printed circuit boards and the printed circuit boards being stacked at predetermined intervals with respect to one another in a stacking direction, said cooling apparatus serving to cool the semiconductor devices by supplying cooling airflows to said electronic printed circuit boards, and said jet cooling apparatus comprising: a body located at least substantially entirely to the side of said stacked electronic printed circuit boards as seen in a cross sectional view of said body and said stacked electronic printed circuit boards taken in said stacking direction, and said body having walls defining a substantially flat three dimensional space therein, the walls being spaced from edges of the stacked electronic printed circuit boards; an air supply fan, mounted to one of the walls of said body on a side thereof opposite another wall of said body facing said edges of the stacked electronic printed circuit boards as seen in said cross sectional view; and a plurality of jet cooling means positioned in parallel to each other at said another wall of said body facing said circuit boards, for allowing, the air having passed through the space from the air supply fan to be flown out therethrough to be supplied to the semiconductor devices, each of said jet cooling means having at least one elongated aperture.

이 특허를 인용한 특허 (49)

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Yun Song Wang CN; Tong S Chen TW; Kuang Shin Lin TW, Apparatus and method for user-mediated control of CPU temperature in notebook computers.
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Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
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Yang, Wei; Zhang, Chunbo; Eickhoff, Steven J; Gu, Alex, Blowerless heat exchanger based on micro-jet entrainment.
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Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
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Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
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Sasaki Tomiya,JPX ; Iwasaki Hideo,JPX, Circuit board cooling apparatus.
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Toru Kaneko JP, Circuit board cooling apparatus with air guide plates.
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Ganrot, Lars T., Computer cooling system.
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Larson,Thane M.; Brooks,Michael A., Computer cooling system and method.
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Tracy, Mark S.; Yin, Memphis-Zhihong, Computer thermal dissipation system and method.
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Crane ; Jr. Stanford W. ; Krishnapura Lakshminarasimha ; Behar Moises ; Dutta Arindum ; Link Kevin J. ; Ahearn Bill, Cooling system for semiconductor die carrier.
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Scofield William Harold, Device and method for dissipating thermal energy of electronic circuit components.
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Fujiya, Hiromitsu; Kimura, Hideki; Makabe, Eiji, Electronic apparatus.
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Hao-Der, Cheng; Chan, Hung-Chou, Electronic device and cooling system thereof.
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Yoshikawa Minoru,JPX, Electronic device cooling system having guides for guiding a flow of the air evenly.
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Lofland Steve ; Nelson Daryl James ; Pollard ; II Lloyd L. ; Webb James Stacker ; Noble Scott L., Fan duct module.
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Noble, Scott L., Fan duct module.
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Yang, Wei; Hilton, Leonard; Gu, Yuandong; Park, Jong, Fin fabrication process for entrainment heat sink.
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Avinoam Livni IL, Forced convection cooling system for electronic equipment.
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Gu, Yuandong; Yang, Wei, Heat sink fin including angular dimples.
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Hofmann,Wilfried, Heat-exchanging device.
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Charles W. Frank, Jr. ; Thomas D. Hanan ; Wally Szeremeta, Integrated computer module with airflow accelerator.
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Hornung,Craig Warren; Leidy,Jim, Memory cooler.
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Tatsuhito H?riuchi JP; Yoshiharu Takasaki JP; Kazuo Osaki JP, Power source containing rechargeable batteries.
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Chen, Shih Tsung, Quickly detached cooling fan mounting bracket for computer.
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Hamilton, Harold E.; Conroy, Chad M.; Bloch, Brian R., Shutters for burn-in-board connector openings.
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Stalley Anthony Donald (Ascot GBX), Stackable electronic equipment assembly with improved circuit board cooling arrangement.
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Mahalingam, Raghavendran; Heffington, Samuel N.; Glezer, Ari; Lutz, Ronald, Synthetic jet ejector for the thermal management of PCI cards.
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Dey, Subhrajit; Moeleker, Petrus Joannes Joseph; Balan, Chellappa, System and method for cooling electronic systems.
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Roth, Jason Todd, System and method of cooling and ventilating for an electronics cabinet.
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Jones, Lee M.; Heffington, Samuel N.; Mahalingam, Raghavendran, Thermal management of very small form factor projectors with synthetic jets.
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Jones, Lee M.; Heffington, Samuel N.; Mahalingam, Raghavendran, Thermal management of very small form factor projectors with synthetic jets.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
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연합인증

Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon 원문보기

초록 ▼

대표청구항 ▼

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이 특허를 인용한 특허 (49)

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Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon 원문보기

초록 ▼

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연구과제 타임라인

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이 특허를 인용한 특허 (49)

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