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Electrical interconnect using particle enhanced joining of metal surfaces 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-023/68
  • H05K-001/14
출원번호 US-0148907 (1993-11-08)
발명자 / 주소
  • Difrancesco Louis (Hayward CA)
출원인 / 주소
  • Particle Interconnect Inc. (Hayward CA 02)
인용정보 피인용 횟수 : 103  인용 특허 : 0

초록 ▼

A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on

대표청구항 ▼

An integrated circuit carrier, comprising: a terminal array formed on a surface of said integrated circuit carrier, said terminal array including individual contact elements, each contact element having base metal contact layer, including associated particles having a hardness greater than that of s

이 특허를 인용한 특허 (103)

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