이 특허를 인용한 특허 (435)

1. Elledge, Jason B., APPARATUS FOR IN-SITU OPTICAL ENDPOINTING ON WEB-FORMAT PLANARIZING MACHINES IN MECHANICAL OR CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC-DEVICE SUBSTRATE ASSEMBLIES AND METHODS FOR MAKING A.

   상세보기
2. Elledge, Jason B., APPARATUS FOR IN-SITU OPTICAL ENDPOINTING ON WEB-FORMAT PLANARIZING MACHINES IN MECHANICAL OR CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC-DEVICE SUBSTRATE ASSEMBLIES AND METHODS FOR MAKING A.

   상세보기
3. Lugg, Paul S., Abrasive article for the deposition and polishing of a conductive material.

   상세보기
4. Muilenburg, Michael J.; Kim, Chong-Yong J.; Fizel, Jerry J.; Webb, Richard J.; Gagliardi, John J.; Pendergrass, Jr., Daniel B.; Streifel, Robert J.; Bruxvoort, Wesley J., Abrasive article having a window system for polishing wafers, and methods.

   상세보기
5. Muilenburg, Michael J.; Kim, Chong-Yong J.; Fizel, Jerry J.; Webb, Richard J.; Gagliardi, John J.; Pendergrass, Jr., Daniel B.; Streifel, Robert J.; Bruxvoort, Wesley J., Abrasive article having a window system for polishing wafers, and methods.

   상세보기
6. Manoocher Birang ; Boguslaw Swedek, Adaptive endpoint detection for chemical mechanical polishing.

   상세보기
7. Yeh Kuantai ; Chatila Ahmad ; Sharifzadeh Shahin, Alignment process compatible with chemical mechanical polishing.

   상세보기
8. Melvin,Jason; Suh,Nam P.; Oh,Hilario L., Apparatus and method for chemical mechanical polishing of substrates.

   상세보기
9. Taylor, Theodore M., Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces.

   상세보기
10. Taylor,Theodore M., Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces.

    상세보기
11. Taylor,Theodore M., Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces.

    상세보기
12. Taylor,Theodore M., Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces.

    상세보기
13. Taylor,Theodore M., Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces.

    상세보기
14. Taylor,Theodore M., Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization.

    상세보기
15. Boggs Karl E. ; Davis Kenneth M. ; Landers William F. ; Merkling ; Jr. Robert M. ; Passow Michael L. ; Stephens Jeremy K., Apparatus and method for controlling polishing of integrated circuit substrates.

    상세보기
16. Taylor, Theodore M., Apparatus and method for enhanced processing of microelectronic workpieces.

    상세보기
17. Labunsky Michael ; Nagengast Andrew ; Pant Anil, Apparatus and method for film thickness measurement integrated into a wafer load/unload unit.

    상세보기
18. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.

    상세보기
19. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.

    상세보기
20. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.

    상세보기
21. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.

    상세보기
22. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.

    상세보기
23. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.

    상세보기
24. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.

    상세보기
25. Birang Manoocher ; Pyatigorsky Grigory, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations.

    상세보기
26. Chandrasekaran,Nagasubramaniyan, Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces.

    상세보기
27. Thornton Brian ; Nagengast Andrew J. ; Boehm ; Jr. Robert G. ; Pant Anil K. ; Krusell Wilbur C., Apparatus and method for performing end point detection on a linear planarization tool.

    상세보기
28. Boyd, John M.; Lacy, Michael S., Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection.

    상세보기
29. Boyd, John M.; Lacy, Michael S., Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection.

    상세보기
30. Blalock,Guy T., Apparatus and method for removing material from microfeature workpieces.

    상세보기
31. Nikoonahad, Mehrdad; Sethuraman, Anantha R.; Zhao, Guoheng, Apparatus and methods for detecting killer particles during chemical mechanical polishing.

    상세보기
32. Nikoonahad, Mehrdad; Lee, Shing M.; Kele, Kalman; Zhao, Guoheng; Lehman, Kurt R., Apparatus and methods for performing self-clearing optical measurements.

    상세보기
33. Holzapfel Paul ; Yednak ; III Andrew ; Natalicio John ; Goudie Chad, Apparatus for cleaning workpiece surfaces and monitoring probes during workpiece processing.

    상세보기
34. Tang, Wallace T. Y., Apparatus for detection of thin films during chemical/mechanical polishing planarization.

    상세보기
35. Agarwal, Vishnu K., Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.

    상세보기
36. Elledge,Jason B., Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.

    상세보기
37. Hanawa, Hiroji; Johansson, Nils; Swedek, Bogusla W; Birang, Manoocher, Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal.

    상세보기
38. Dvir Eran,ILX ; Haimovich Eli,ILX ; Shulman Benjamin,ILX, Apparatus for optical inspection of wafers during polishing.

    상세보기
39. Eran Dvir IL; Moshe Finarov IL; Eli Haimovich ; Benjamin Shulman IL; Rony Abaron IL, Apparatus for optical inspection of wafers during polishing.

    상세보기
40. Eran Dvir IL; Moshe Finarov IL; Eli Haimovich IL; Beniamin Shulman IL, Apparatus for optical inspection of wafers during polishing.

    상세보기
41. Finarov Moshe,ILX, Apparatus for optical inspection of wafers during polishing.

    상세보기
42. Finarov, Moshe, Apparatus for optical inspection of wafers during polishing.

    상세보기
43. Finarov,Moshe, Apparatus for optical inspection of wafers during processing.

    상세보기
44. Taylor, Theodore M., Apparatus for planarizing microelectronic workpieces.

    상세보기
45. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.

    상세보기
46. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.

    상세보기
47. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.

    상세보기
48. Agarwal,Vishnu K., Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.

    상세보기
49. Ramarajan,Suresh, Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece.

    상세보기
50. Ramarajan,Suresh, Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece.

    상세보기
51. Agarwal,Vishnu K., Apparatuses for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.

    상세보기
52. Berman Michael J., Automated endpoint detection system during chemical-mechanical polishing.

    상세보기
53. Leach Michael A. (345 Sheridan #204 Palo Alto CA 94306), Block for polishing a wafer during manufacture of integrated circuits.

    상세보기
54. Sun, Tao; Medsker, Robert, CMP composition comprising surfactant.

    상세보기
55. Huang, Hung-Tsung; Yeh, Ming-Chih; Tsai, Chih-Pin, CMP composition for silicon nitride removal.

    상세보기
56. de Rege Thesauro, Francesco; Bayer, Benjamin P., CMP composition with a polymer additive for polishing noble metals.

    상세보기
57. Dockery, Kevin P.; Jia, Renhe; Dysard, Jeffrey, CMP compositions selective for oxide and nitride with high removal rate and low defectivity.

    상세보기
58. Reiss, Brian; Whitener, Glenn, CMP compositions selective for oxide and nitride with high removal rate and low defectivity.

    상세보기
59. Reiss, Brian; Willhoff, Michael; Mateja, Daniel, CMP compositions selective for oxide and nitride with high removal rate and low defectivity.

    상세보기
60. Li, Tina; Dockery, Kevin; Jia, Renhe; Dysard, Jeffrey, CMP compositions selective for oxide over polysilicon and nitride with high removal rate and low defectivity.

    상세보기
61. Fu, Lin; Grumbine, Steven, CMP compositions with low solids content and methods related thereto.

    상세보기
62. Manning, Monis J., CMP pad with composite transparent window.

    상세보기
63. Prasad, Abaneshwar, CMP pad with composite transparent window.

    상세보기
64. Allison, William; Huang, Ping; Scott, Diane; Frentzel, Richard; Kerprich, Robert, CMP pad with local area transparency.

    상세보기
65. Cheek Roger W. ; Cronin John E. ; Nadeau Douglas P. ; Rutten Matthew J. ; Wright Terrance M., CMP polishing pad backside modifications for advantageous polishing results.

    상세보기
66. Dulay,Sukhbir Singh; Leong,Thomas L.; Yang,John Jaekoyun, CMP process metrology test structures.

    상세보기
67. Boggs Karl E. ; Lin Chenting ; Nuetzel Joachim F. ; Ploessl Robert ; Ronay Maria ; Schnabel Florian ; Stephens Jeremy K., CMP process using indicator areas to determine endpoint.

    상세보기
68. Grumbine, Steven; De Rege Thesauro, Francesco, CMP system utilizing halogen adduct.

    상세보기
69. Aiyer Arun A. ; Coon Paul Derek ; Chau Henry K., CMP variable angle in situ sensor.

    상세보기
70. Castor, Terry, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.

    상세보기
71. Castor, Terry, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.

    상세보기
72. Chandrasekaran, Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.

    상세보기
73. Chandrasekaran,Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.

    상세보기
74. Chandrasekaran,Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.

    상세보기
75. Elledge,Jason B., Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces.

    상세보기
76. Elledge,Jason B., Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces.

    상세보기
77. Smith, Taber H.; Mehrotra, Vikas; White, David, Characterization and reduction of variation for integrated circuits.

    상세보기
78. Lacy, Michael S.; Boyd, John M., Chemical mechanical planarization belt assembly and method of assembly.

    상세보기
79. Bennett, Doyle E; Koppikar, Sandeep R; David, Jeffrey Drue; Swedek, Boguslaw A; Johansson, Nils, Chemical mechanical polishing apparatus with non-conductive elements.

    상세보기
80. Kimura, Norio; Wang, Huey-Ming; Kumekawa, Masayuki, Chemical mechanical polishing endpoint detection system and method.

    상세보기
81. Li Leping (Poughkeepsie NY) Barbee Steven George (Dover Plains NY) Halperin Arnold (Cortlandt Manor NY), Chemical mechanical polishing endpoint process control.

    상세보기
82. Richard J. Lebel ; Rock Nadeau ; Martin P. O'Boyle ; Paul H. Smith, Jr. ; Theodore G. van Kessel ; Hemantha K. Wickramasinghe, Chemical mechanical polishing in-situ end point system.

    상세보기
83. Redeker, Fred C.; Bajaj, Rajeev, Chemical mechanical polishing of a metal layer with polishing rate monitoring.

    상세보기
84. Redeker, Fred C.; Bajaj, Rajeev, Chemical mechanical polishing of a metal layer with polishing rate monitoring.

    상세보기
85. Pallikkara Kuttiatoor, Sudeep; Jia, Renhe; Dysard, Jeffrey, Chemical-mechanical planarization of polymer films.

    상세보기
86. Cheng, Chung-Liang; Chen, Yen-Yu; Lee, Chang-Sheng; Zhang, Wei, Chemical-mechanical planarization system.

    상세보기
87. Fu, Lin; Grumbine, Steven; Stender, Matthias, Chemical-mechanical polishing composition containing zirconia and metal oxidizer.

    상세보기
88. Kraft, Steven; Wolff, Andrew; Carter, Phillip W.; Petro, Benjamin, Cobalt dishing control agents.

    상세보기
89. Kraft, Steven; Wolff, Andrew; Carter, Phillip W.; Hayes, Kristin; Petro, Benjamin, Cobalt polishing accelerators.

    상세보기
90. Johansson, Nils; Swedek, Boguslaw A.; Birang, Manoocher, Combined eddy current sensing and optical monitoring for chemical mechanical polishing.

    상세보기
91. Johansson,Nils; Swedek,Boguslaw A.; Birang,Manoocher, Combined eddy current sensing and optical monitoring for chemical mechanical polishing.

    상세보기
92. Feeney, Paul M.; Anjur, Sriram; Dysard, Jeffrey M., Composition and method for damascene CMP.

    상세보기
93. Reiss, Brian; Clark, John; Jones, Lamon; Gilliland, Jeffrey; White, Michael, Composition and method for polishing bulk silicon.

    상세보기
94. Reiss, Brian; White, Michael; Jones, Lamon; Clark, John, Composition and method for polishing bulk silicon.

    상세보기
95. Lau, Hon Wu; Siriwardane, Haresh, Composition and method for polishing glass.

    상세보기
96. Palanisamy Chinnathambi, Selvaraj; White, Michael, Composition and method for polishing memory hard disks.

    상세보기
97. Reiss, Brian; Johns, Timothy; White, Michael; Jones, Lamon; Clark, John, Composition and method for polishing polysilicon.

    상세보기
98. Dysard, Jeffrey; Anjur, Sriram; Johns, Timothy; Chen, Zhan, Compositions and methods for polishing silicon nitride materials.

    상세보기
99. Brusic, Vlasta; Zhou, Renjie; Feeney, Paul; Thompson, Christopher, Compositions for polishing aluminum/copper and titanium in damascene structures.

    상세보기
100. Hsieh,Heng Chang; Chien,Wen Cheng, Computer integrated manufacturing control system for oxide chemical mechanical polishing.

     상세보기
101. Zhang, Jimin; Carlsson, Ingemar; Jew, Stephen; Swedek, Boguslaw A, Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing.

     상세보기
102. Cavanaugh, Mary; Kraft, Steven; Wolff, Andrew; Carter, Phillip W.; Sikma, Elise; Cross, Jeffrey; Petro, Benjamin, Corrosion inhibitors and related compositions and methods.

     상세보기
103. Swedek,Boguslaw A.; Johansson,Nils; Birang,Manoocher, Data processing for monitoring chemical mechanical polishing.

     상세보기
104. Swedek,Boguslaw A.; Johansson,Nils; Birang,Manoocher, Data processing for monitoring chemical mechanical polishing.

     상세보기
105. Shiomi,Junichi; Fujimoto,Hiroki; Nishihara,Eiji; Imamura,Atsushi, Detection of an end point of polishing a substrate.

     상세보기
106. David,Jeffrey Drue; Johansson,Nils; Birang,Manoocher; Swedek,Boguslaw A.; Carlsson,Ingemar, Determination of position of sensor measurements during polishing.

     상세보기
107. Bradl Stephan,DEX ; Heitzsch Olaf,DEX, Device and method for end-point monitoring used in the polishing of components, in particular semiconductor components.

     상세보기
108. Hofmann Jim, Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.

     상세보기
109. Hofmann, Jim, Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.

     상세보기
110. Ueno, Junichi; Sato, Kazuya; Kobayashi, Syuichi, Double-side polishing apparatus.

     상세보기
111. Bennett, Doyle E.; Osterheld, Thomas H., Eddy current gain compensation.

     상세보기
112. Hanawa, Hiroji; Johansson, Nils; Swedek, Boguslaw; Birang, Manoocher, Eddy current sensing of metal removal for chemical mechanical polishing.

     상세보기
113. Sarfaty,Moshe; Sreenivasan,Ramaswamy; Nulman,Jaim, Eddy-optic sensor for object inspection.

     상세보기
114. White, David; Smith, Taber H., Electronic design for integrated circuits based on process related variations.

     상세보기
115. Kistler, Rodney C., Embedded fiber acoustic sensor for CMP process endpoint.

     상세보기
116. Yi, Jingang; Xu, Cangshan, End point detection with imaging matching in semiconductor processing.

     상세보기
117. Swedek Boguslaw ; Wiswesser Andreas Norbert,DEX, Endpoint detection with light beams of different wavelengths.

     상세보기
118. Swedek, Boguslaw; Wiswesser, Andreas Norbert, Endpoint detection with light beams of different wavelengths.

     상세보기
119. Wiswesser,Andreas Norbert; Schoenleber,Walter, Endpoint detection with multiple light beams.

     상세보기
120. Doan Trung T., Endpoint detector and method for measuring a change in wafer thickness.

     상세보기
121. Sandhu Gurtej Singh ; Doan Trung Tri, Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconducto.

     상세보기
122. Doan Trung T., Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates.

     상세보기
123. Doan, Trung T., Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates.

     상세보기
124. Zhang, John H.; Goldberg, Cindy, Endpoint detector for a semiconductor processing station and associated methods.

     상세보기
125. Tsai Stan ; Redeker Fred C. ; Wijekoon Kapila, Endpoint monitoring with polishing rate change.

     상세보기
126. Halley, David G., Feature height measurement during CMP.

     상세보기
127. Ushio Yoshijiro,JPX ; Koyama Motoo,JPX, Film inspection method.

     상세보기
128. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.

     상세보기
129. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.

     상세보기
130. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.

     상세보기
131. Grumbine,Steven K., Gallium and chromium ions for oxide rate enhancement.

     상세보기
132. Li, Shoutian, Halide anions for metal removal rate control.

     상세보기
133. Li, Shoutian, Halide anions for metal removal rate control.

     상세보기
134. Aiyer Arun A., Heterdoyne Thickness Monitoring System.

     상세보기
135. John A. Adams ; Robert A. Eaton ; John C. Ptak, Hydrophobic optical endpoint light pipes for chemical mechanical polishing.

     상세보기
136. Halley, David G.; Barbour, Greg, In situ feature height measurement.

     상세보기
137. Sun Mei H. ; Litvak Herbert E. ; Tzeng Huey M. ; Glenn Daniel E. ; Jensen Earl M. ; Hausman Frank J. ; Zhou Lin Jun, In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link.

     상세보기
138. David Gerald Coult ; Duane Donald Wendling ; Charles William Lentz ; Bryan Phillip Segner ; Gustav Edward Derkits ; Wan-ning Wu ; Franklin Roy Dietz, In-situ automated contactless thickness measurement for wafer thinning.

     상세보기
139. Chen, Haiguang; Lee, Shing, In-situ end point detection for semiconductor wafer polishing.

     상세보기
140. Yueh William, In-situ endpoint control apparatus for semiconductor wafer polishing process.

     상세보기
141. Lehman, Kurt R.; Lee, Shing M.; Johnson, III, Walter Halmer; Fielden, John; Zhao, Guoheng; Nikoonahad, Mehrdad, In-situ metalization monitoring using eddy current and optical measurements.

     상세보기
142. Lehman, Kurt R.; Lee, Shing M.; Johnson, III, Walter Halmer; Fielden, John, In-situ metalization monitoring using eddy current measurements during the process for removing the film.

     상세보기
143. Lehman,Kurt R.; Lee,Shing M.; Johnson, III,Walter Halmer; Fielden,John, In-situ metalization monitoring using eddy current measurements during the process for removing the film.

     상세보기
144. Nannaji Saka ; Jamie Nam ; Hilario L. Oh, In-situ method and apparatus for end point detection in chemical mechanical polishing.

     상세보기
145. Saka, Nannaji; Nam, Jamie; Oh, Hilario L., In-situ method and apparatus for end point detection in chemical mechanical polishing.

     상세보기
146. Redeker Fred C. ; Birang Manoocher ; Li Shijian ; Somekh Sasson, In-situ monitoring of linear substrate polishing operations.

     상세보기
147. Redeker, Fred C.; Birang, Manoocher; Li, Shijian; Somekh, Sasson, In-situ monitoring of linear substrate polishing operations.

     상세보기
148. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.

     상세보기
149. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.

     상세보기
150. Tang Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical po.

     상세보기
151. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.

     상세보기
152. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.

     상세보기
153. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.

     상세보기
154. Swedek, Boguslaw A.; Birang, Manoocher; Johansson, Nils, Integrated endpoint detection system with optical and eddy current monitoring.

     상세보기
155. Swedek, Boguslaw A; Birang, Manoocher; Johansson, Nils, Integrated endpoint detection system with optical and eddy current monitoring.

     상세보기
156. Swedek,Boguslaw A.; Birang,Manoocher; Johansson,Nils, Integrated endpoint detection system with optical and eddy current monitoring.

     상세보기
157. Pant Anil K. ; Jairath Rahul ; Mishra Kamal ; Chadda Saket ; Krusell Wilbur C., Integrated pad and belt for chemical mechanical polishing.

     상세보기
158. Pant, Anil K.; Jairath, Rahul; Mishra, Kamal; Chadda, Saket; Krusell, Wilbur C., Integrated pad and belt for chemical mechanical polishing.

     상세보기
159. Nguyen, Khiem K.; Satitpunwaycha, Peter; Mak, Alfred W., Interferometer endpoint monitoring device.

     상세보기
160. Li, Shoutian; Carter, Phillip W.; Zhang, Jian, Iodate-containing chemical-mechanical polishing compositions and methods.

     상세보기
161. Benvegnu,Dominic J., Iso-reflectance wavelengths.

     상세보기
162. Ushio,Yoshijiro; Ueda,Takehiko, Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same.

     상세보기
163. Bibby, Jr., Thomas F. A.; Adams, John A., Learning method and apparatus for predictive determination of endpoint during chemical mechanical planarization using sparse sampling.

     상세보기
164. Redeker, Fred C.; Birang, Manoocher; Li, Shijian; Somekh, Sasson, Linear polishing sheet with window.

     상세보기
165. Redeker,Fred C.; Birang,Manoocher; Li,Shijian; Somekh,Sasson, Linear polishing sheet with window.

     상세보기
166. Sabde, Gundu M.; Hofmann, James J.; Joslyn, Michael J.; Lee, Whonchee, Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids.

     상세보기
167. Chopra, Dinesh; Meikle, Scott G., Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates.

     상세보기
168. Chopra, Dinesh; Meikle, Scott G., Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates.

     상세보기
169. Beckage, Peter J.; Edwards, Keith A.; Lukner, Ralf B.; Cho, Wonhui, Method and apparatus for detecting a process endpoint.

     상세보기
170. Wiswesser Andreas Norbert,DEX ; Pan Judon Tony ; Swedek Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.

     상세보기
171. Wiswesser, Andreas Norbert; Pan, Judon Tony; Swedek, Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.

     상세보기
172. Wiswesser, Andreas Norbert; Pan, Judon Tony; Swedek, Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.

     상세보기
173. Manoocher Birang ; Boguslaw Swedek ; Nils Johansson, Method and apparatus for detecting polishing endpoint with optical monitoring.

     상세보기
174. Sandhu Gurtej Singh, Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers.

     상세보기
175. Sandhu Gurtej Singh, Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers.

     상세보기
176. Sandhu Gurtej Singh (Boise ID), Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers.

     상세보기
177. Beckage Peter J. ; Edwards Keith A. ; Lukner Ralf B. ; Cho Wonhui, Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation.

     상세보기
178. Lin C. L.,TWX ; Wang Tin Chun,TWX, Method and apparatus for determining end point in a polishing process.

     상세보기
179. Wiswesser,Andreas Norbert; Schoenleber,Walter; Swedek,Boguslaw; Birang,Manoocher, Method and apparatus for determining polishing endpoint with multiple light sources.

     상세보기
180. Wiswesser Andreas Norbert,DEX ; Schoenleber Walter,DEX ; Swedek Boguslaw ; Birang Manoocher, Method and apparatus for determining substrate layer thickness during chemical mechanical polishing.

     상세보기
181. Robinson Karl M., Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates.

     상세보기
182. Sandhu Gurtej S., Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates.

     상세보기
183. Sandhu,Gurtej S., Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates.

     상세보기
184. Boyd, John M.; Lacy, Michael S., Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool.

     상세보기
185. Boyd, John M.; Lacy, Michael S., Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool.

     상세보기
186. John M. Boyd ; Michael S. Lacy, Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool.

     상세보기
187. Jairath Rahul ; Pecen Jiri ; Chadda Saket ; Krusell Wilbur C. ; Cutini Jerauld J. ; Engdahl Erik H., Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher.

     상세보기
188. Jairath Rahul ; Pecen Jiri ; Chadda Saket ; Krusell Wilbur C. ; Cutini Jerauld J. ; Engdahl Erik H., Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher.

     상세보기
189. Meloni Mark, Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing.

     상세보기
190. Pecen Jiri ; Chadda Saket ; Jairath Rahul ; Krusell Wilbur C., Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing.

     상세보기
191. Pecen, Jiri; Chadda, Saket; Jairath, Rahul; Krusell, Wilbur C., Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing.

     상세보기
192. Pecen Jiri ; Fielden John ; Chadda Saket ; LaComb ; Jr. Lloyd J. ; Jairath Rahul ; Krusell Wilbur C., Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing.

     상세보기
193. Kimba, Toshifumi; Nakai, Shunsuke, Method and apparatus for measuring film thickness.

     상세보기
194. Andreas Norbert Wiswesser DE; Wallter Waiter Schoenleber DE; Boguslaw Swedek, Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing.

     상세보기
195. Wiswesser Andreas Norbert,DEX ; Schoenleber Walter,DEX ; Swedek Boguslaw, Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing.

     상세보기
196. Wiswesser, Andreas Norbert; Schoenleber, Walter; Swedek, Boguslaw, Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing.

     상세보기
197. Wiswesser, Andreas Norbert; Schoenleber, Walter; Swedek, Boguslaw, Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing.

     상세보기
198. Hanawa, Hiroji; Johansson, Nils; Swedek, Boguslaw; Birang, Manoocher, Method and apparatus for monitoring a metal layer during chemical mechanical polishing.

     상세보기
199. Hanawa,Hiroji; Johansson,Nils; Swedek,Boguslaw; Birang,Manoocher, Method and apparatus for monitoring a metal layer during chemical mechanical polishing.

     상세보기
200. Ishikawa, Akira; Ushio, Yoshijiro, Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device.

     상세보기
201. Robert S. Okojie, Method and apparatus for obtaining a precision thickness in semiconductor and other wafers.

     상세보기
202. Wiswesser Andreas Norbert,DEX ; Pan Judon Tony ; Swedek Boguslaw ; Birang Manoocher, Method and apparatus for optical monitoring in chemical mechanical polishing.

     상세보기
203. Wiswesser, Andreas Norbert; Pan, Judon Tony; Swedek, Buguslaw; Birang, Manoocher, Method and apparatus for optical monitoring in chemical mechanical polishing.

     상세보기
204. Kimura, Keiichi; Miyoshi, Takashi, Method and apparatus for polishing.

     상세보기
205. Kistler, Rodney C.; Carswell, Andrew, Method and apparatus for removing material from microfeature workpieces.

     상세보기
206. Kistler, Rodney C.; Carswell, Andrew, Method and apparatus for removing material from microfeature workpieces.

     상세보기
207. Kistler,Rodney C.; Carswell,Andrew, Method and apparatus for removing material from microfeature workpieces.

     상세보기
208. Sandhu Gurtej Singh ; Doan Trung Tri, Method and apparatus for selectively conditioning a polished pad used in planarizng substrates.

     상세보기
209. Thomas Frederick Allen Bibby, Jr. ; John A. Adams, Method and apparatus for using optical reflection data to obtain a continuous predictive signal during CMP.

     상세보기
210. Moore, Scott E., Method and apparatus for wireless transfer of chemical-mechanical planarization measurements.

     상세보기
211. Moore, Scott E., Method and apparatus for wireless transfer of chemical-mechanical planarization measurements.

     상세보기
212. Moore, Scott E., Method and apparatus for wireless transfer of chemical-mechanical planarization measurements.

     상세보기
213. Moore, Scott E., Method and apparatus for wireless transfer of chemical-mechanical planarization measurements.

     상세보기
214. Moore, Scott E., Method and apparatus for wireless transfer of chemical-mechanical planarization measurements.

     상세보기
215. Birang, Manoocher; Swedek, Boguslaw A.; Kim, Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.

     상세보기
216. Birang,Manoocher; Swedek,Boguslaw A.; Kim,Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.

     상세보기
217. Leach Michael A., Method and structure for polishing a wafer during manufacture of integrated circuits.

     상세보기
218. Leach Michael A. (345 Sheridan #204 Palo Alto CA 94306), Method and structure for polishing a wafer during manufacture of integrated circuits.

     상세보기
219. Finarov, Moshe, Method and system for endpoint detection.

     상세보기
220. Finarov, Moshe, Method and system for endpoint detection.

     상세보기
221. Finarov, Moshe, Method and system for endpoint detection.

     상세보기
222. Finarov, Moshe, Method and system for endpoint detection.

     상세보기
223. Finarov,Moshe, Method and system for endpoint detection.

     상세보기
224. White, David, Method and system for handling process related variations for integrated circuits based upon reflections.

     상세보기
225. Haggart, Jr., David Weston; Glashauser, Walter, Method for determining an endpoint and semiconductor wafer.

     상세보기
226. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Method for in-situ endpoint detection for chemical mechanical polishing operations.

     상세보기
227. Strasbaugh, Alan, Method for making a polishing pad with built-in optical sensor.

     상세보기
228. Jones, Jeremy; Sevilla, Roland K., Method for manufacturing a polishing pad having a compressed translucent region.

     상세보기
229. Hanawa, Hiroji; Johansson, Nils; Swedek, Boguslaw; Birang, Manoocher, Method for monitoring a metal layer during chemical mechanical polishing using a phase difference signal.

     상세보기
230. Chen, Hsueh-Chung; Chen, Chien-Hung; Wu, Juan-Yuan, Method for monitoring a semiconductor wafer in a chemical mechanical polishing process.

     상세보기
231. Wiswesser,Andreas Norbert; Schoenleber,Walter; Swedek,Boguslaw, Method for monitoring a substrate during chemical mechanical polishing.

     상세보기
232. Taylor,Theodore M., Method for planarizing microelectronic workpieces.

     상세보기
233. Anderson, II, Robert L.; Charatan, Robert, Method of and platen for controlling removal rate characteristics in chemical mechanical planarization.

     상세보기
234. Yang Ming-Cheng,TWX ; Shau Feng-Yeu,TWX ; Huang Cheng-Sung,TWX ; Yi Champion,TWX, Method of detecting end point and monitoring uniformity in chemical-mechanical polishing operation.

     상세보기
235. Chen Hsueh-Chung,TWX, Method of determining real time removal rate for polishing.

     상세보기
236. Swedek,Boguslaw A.; Birang,Manoocher, Method of forming a polishing pad for endpoint detection.

     상세보기
237. Birang Manoocher ; Gleason Allan ; Guthrie William L., Method of forming a transparent window in a polishing pad.

     상세보기
238. Birang, Manoocher; Gleason, Allan; Guthrie, William L., Method of forming a transparent window in a polishing pad.

     상세보기
239. Wiswesser, Andreas Norbert; Oshana, Ramiel; Hughes, Kerry F.; Rohde, Jay; Huo, David Datong; Benvegnu, Dominic J., Method of making and apparatus having polishing pad with window.

     상세보기
240. Nakata, Kazunari, Method of manufacturing a semiconductor device.

     상세보기
241. Dunton, Samuel V.; Nagahara, Ron; Galvez, Pepito C., Method of testing the processing of a semiconductor wafer on a CMP apparatus.

     상세보기
242. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical mechanical planarization of microelectronic substrates.

     상세보기
243. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.

     상세보기
244. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.

     상세보기
245. Blalock,Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.

     상세보기
246. Lu, Jin, Methods and apparatuses for removing polysilicon from semiconductor workpieces.

     상세보기
247. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.

     상세보기
248. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.

     상세보기
249. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.

     상세보기
250. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.

     상세보기
251. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.

     상세보기
252. Elledge, Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.

     상세보기
253. Elledge,Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.

     상세보기
254. Elledge,Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.

     상세보기
255. Moore,Carter; Folkes,Elon; Castor,Terry, Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.

     상세보기
256. Laursen,Thomas; Quarantello,Justin; Stotts,Thomas; Franzen,Paul, Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization.

     상세보기
257. Laursen,Thomas; Kasprzyk,Karl; Reynolds,Steven; Franzen,Paul; Quarantello,Justin, Methods for monitoring a chemical mechanical planarization process of a metal layer using an in-situ eddy current measuring system.

     상세보기
258. Taylor,Theodore M., Methods for planarizing microelectronic workpieces.

     상세보기
259. Moore,Carter; Folkes,Elon; Castor,Terry, Methods for planarizing workpieces, e.g., microelectronic workpieces.

     상세보기
260. Elledge,Jason B., Methods of manufacturing carrier heads for polishing micro-device workpieces.

     상세보기
261. Reiss, Brian; Nalaskowski, Jakub; Lam, Viet; Jia, Renhe; Dysard, Jeffrey, Mixed abrasive polishing compositions.

     상세보기
262. Sugiyama, Yoshikazu; Ohuchi, Yasushi, Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer.

     상세보기
263. Hanawa,Hiroji; Johansson,Nils; Swedek,Boguslaw; Birang,Manoocher, Monitoring a metal layer during chemical mechanical polishing.

     상세보기
264. Tsai, Stan D.; Chang, Shou-Sung; Chen, Liang-Yuh, Multi-layer polishing pad.

     상세보기
265. Mrzyglod, Brian; Nair, Jayakrishnan; Blake, Garrett, Multi-layer polishing pad for CMP.

     상세보기
266. Duboust, Alain; Chang, Shou-Sung; Lu, Wei; Neo, Siew; Wang, Yan; Manens, Antoine P.; Moon, Yongsik, Multi-layer polishing pad for low-pressure polishing.

     상세보기
267. Tolles, Robert D., Multilayer polishing pad and method of making.

     상세보기
268. Weldon, Matthew; Laursen, Thomas; Grief, Malcolm; Holzapfel, Paul; Meloni, Mark A.; Eaton, Robert, Multiprobe detection system for chemical-mechanical planarization tool.

     상세보기
269. Weldon, Matthew; Laursen, Thomas; Grief, Malcolm; Holzapfel, Paul; Meloni, Mark A.; Eaton, Robert, Multiprobe detection system for chemical-mechanical planarization tool.

     상세보기
270. Handa Hirohisa,JPX, On-the-fly optical interference measurement device, machining device provided with the measurement device, and machine tool suited to on-the-fly optical measurement.

     상세보기
271. Adams, Bret W.; Swedek, Boguslaw A.; Bajaj, Rajeev; Nanjangud, Savitha; Wiswesser, Andreas Norbert; Tsai, Stan D.; Chan, David A.; Redeker, Fred C.; Birang, Manoocher, Optical monitoring in a two-step chemical mechanical polishing process.

     상세보기
272. Adams, Bret W.; Swedek, Boguslaw A.; Bajaj, Rajeev; Nanjangud, Savitha; Wiswesser, Andreas Norbert; Tsai, Stan D.; Chan, David A.; Redeker, Fred C.; Birang, Manoocher, Optical monitoring in a two-step chemical mechanical polishing process.

     상세보기
273. Yagi Takeshi,JPX, Optical polishing apparatus and methods.

     상세보기
274. Schietinger, Charles W.; Hoang, Ahn N., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.

     상세보기
275. Schietinger, Charles W.; Hoang, Anh N.; Bakin, Dmitry V., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.

     상세보기
276. Schietinger, Charles W.; Hoang, Anh N.; Bakin, Dmitry V., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.

     상세보기
277. Schietinger,Charles W.; Hoang,Anh N.; Bakin,Dmitry V., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.

     상세보기
278. Herbert E. Litvak, Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment.

     상세보기
279. Litvak Herbert E., Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment.

     상세보기
280. Litvak Herbert E., Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment.

     상세보기
281. Randolph E. Treur ; John M. Boyd ; Stephan H. Wolf, Optical view port for chemical mechanical planarization endpoint detection.

     상세보기
282. Treur Randolph E. ; Boyd John M. ; Wolf Stephan H., Optical view port for chemical mechanical planarization endpoint detection.

     상세보기
283. Martin, Michael H.; Crump, Brett, Planarity diagnostic system, E.G., for microelectronic component test systems.

     상세보기
284. Martin,Michael H.; Crump,Brett, Planarity diagnostic system, E.G., for microelectronic component test systems.

     상세보기
285. Martin,Michael H.; Crump,Brett, Planarity diagnostic system, e.g., for microelectronic component test systems.

     상세보기
286. Martin,Michael H.; Crump,Brett, Planarity diagnostic system, e.g., for microelectronic component test systems.

     상세보기
287. Scott E. Moore, Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates.

     상세보기
288. Moore, Scott E., Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates.

     상세보기
289. Moore, Scott E., Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates.

     상세보기
290. Joslyn, Michael J., Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces.

     상세보기
291. Joslyn,Michael J., Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces.

     상세보기
292. Wright, David Q., Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies.

     상세보기
293. Aaron T. Bartlett, Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies.

     상세보기
294. Taylor, Theodore M.; Chandrasekaran, Nagasubramaniyan, Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions.

     상세보기
295. Taylor,Theodore M.; Chandrasekaran,Nagasubramaniyan, Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions.

     상세보기
296. David,Jeffrey Drue, Platen and head rotation rates for monitoring chemical mechanical polishing.

     상세보기
297. David,Jeffrey Drue, Platen and head rotation rates for monitoring chemical mechanical polishing.

     상세보기
298. Schultz,Stephen C.; Herb,John D.; Marquardt,Dave, Platen and manifold for polishing workpieces.

     상세보기
299. Kobayashi,Yoichi; Mitani,Ryuichiro, Polished state monitoring apparatus and polishing apparatus using the same.

     상세보기
300. Kimba, Toshifumi, Polishing apparatus.

     상세보기
301. Kimura, Norio; Isobe, Hideji; Shimizu, Kazuo; Osawa, Hiroyuki, Polishing apparatus.

     상세보기
302. Kimura, Norio; Isobe, Hideji; Shimizu, Kazuo; Osawa, Hiroyuki, Polishing apparatus.

     상세보기
303. Kimura,Norio; Isobe,Hideji; Shimizu,Kazuo; Osawa,Hiroyuki, Polishing apparatus.

     상세보기
304. Hiyama Hirokuni,JPX ; Wada Yutaka,JPX, Polishing apparatus including thickness or flatness detector.

     상세보기
305. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing assembly with a window.

     상세보기
306. Akira Ihsikawa JP; Tatsuya Senga JP; Akira Miyaji JP; Yoshijiro Ushio JP, Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method.

     상세보기
307. Carter, Phillip W.; Johns, Timothy, Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.

     상세보기
308. Carter,Phillip W.; Johns,Timothy P., Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.

     상세보기
309. Dysard, Jeffrey M.; Johns, Timothy P., Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.

     상세보기
310. Dysard, Jeffrey M.; Johns, Timothy P., Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.

     상세보기
311. Dysard, Jeffrey; Anjur, Sriram; Grumbine, Steven; White, Daniela; Ward, William, Polishing composition and method utilizing abrasive particles treated with an aminosilane.

     상세보기
312. Grumbine, Steven; Li, Shoutian; Ward, William; Singh, Pankaj; Dysard, Jeffrey, Polishing composition and method utilizing abrasive particles treated with an aminosilane.

     상세보기
313. Reiss, Brian; Sauter Van Ness, Dana; Lam, Viet; Jia, Renhe, Polishing composition containing cationic polymer additive.

     상세보기
314. Reiss, Brian; Sauter Van Ness, Dana; Lam, Viet; Hains, Alexander; Kraft, Steven; Jia, Renhe, Polishing composition containing ceria abrasive.

     상세보기
315. Dysard, Jeffrey M.; Feeney, Paul M.; Anjur, Sriram P.; Johns, Timothy P.; Xin, Yun Biao; Wang, Li, Polishing composition containing polyether amine.

     상세보기
316. Dysard, Jeffrey M.; Feeney, Paul M.; Anjur, Sriram P.; Johns, Timothy P.; Xin, Yun-Biao; Wang, Li, Polishing composition containing polyether amine.

     상세보기
317. Lau, Hon Wu; White, Michael, Polishing composition for edge roll-off improvement.

     상세보기
318. Palanisamy Chinnathambi, Selvaraj; Siriwardane, Haresh, Polishing composition for nickel-phosphorous-coated memory disks.

     상세보기
319. Dickenscheid Wolfgang,DEX ; Springer Goetz,DEX, Polishing device and polishing cloth for semiconductor substrates.

     상세보기
320. Sevilla, Roland K; Hicks, James A.; Jones, Jeremy, Polishing disk with end-point detection port.

     상세보기
321. Elledge, Jason B., Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.

     상세보기
322. Kitajima,Tomohiko; Yasuhara,Gen, Polishing method and apparatus.

     상세보기
323. Cheng, Chih-Hsien; Liu, Yuh-Turng, Polishing pad.

     상세보기
324. Benvegnu, Dominic J.; David, Jeffrey Drue; Swedek, Bogdan, Polishing pad assembly with glass or crystalline window.

     상세보기
325. Benvegnu,Dominic J.; David,Jeffrey Drue; Swedek,Bogdan, Polishing pad assembly with glass or crystalline window.

     상세보기
326. Newell, Kelly J., Polishing pad comprising a filled translucent region.

     상세보기
327. Prasad,Abaneshwar, Polishing pad comprising hydrophobic region and endpoint detection port.

     상세보기
328. Dunn,Freddie L., Polishing pad conditioners having abrasives and brush elements, and associated systems and methods.

     상세보기
329. Swedek, Boguslaw A.; Birang, Manoocher, Polishing pad for endpoint detection and related methods.

     상세보기
330. Swedek, Boguslaw A.; Birang, Manoocher, Polishing pad for endpoint detection and related methods.

     상세보기
331. Birang, Manoocher; Gleason, Allan, Polishing pad for in-situ endpoint detection.

     상세보기
332. Shih,Wen Chang; Chang,Yung Chung; Chu,Min Kuei, Polishing pad having grooved window therein and method of forming the same.

     상세보기
333. Barbour, Greg, Polishing pad sensor assembly with a damping pad.

     상세보기
334. Aiyer Arun A., Polishing pad thinning to optically access a semiconductor wafer surface.

     상세보기
335. Fruitman, Clinton O.; Meloni, Mark A.; Gopalan, Periya; Yednak, III, Andrew, Polishing pad window for a chemical mechanical polishing tool.

     상세보기
336. Yang, Charles Chiun-Chieh; Herb, John D.; Schultz, Stephen C., Polishing pad window for a chemical-mechanical polishing tool.

     상세보기
337. Halley, David G.; Barbour, Gregory L.; Smedley, Ben; Wolf, Stephen H., Polishing pad with built-in optical sensor.

     상세보기
338. Halley,David G.; Barbour,Gregory L.; Smedley,Ben; Wolf,Stephen H., Polishing pad with built-in optical sensor.

     상세보기
339. Halley,David G.; Barbour,Gregory L.; Smedley,Ben; Wolf,Stephen H., Polishing pad with built-in optical sensor.

     상세보기
340. Prasad, Abaneshwar, Polishing pad with light-stable light-transmitting region.

     상세보기
341. Prasad, Abaneshwar, Polishing pad with microporous regions.

     상세보기
342. Barbour, Greg, Polishing pad with optical sensor.

     상세보기
343. Turner,Kyle A.; Beeler,Jeffrey L.; Newell,Kelly J., Polishing pad with recessed window.

     상세보기
344. Wiswesser, Andreas Norbert; Swedek, Boguslaw A., Polishing pad with transparent window.

     상세보기
345. Tolles, Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.

     상세보기
346. Tolles, Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.

     상세보기
347. Tolles,Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.

     상세보기
348. Swedek, Boguslaw A.; Birang, Manoocher, Polishing pad with two-section window having recess.

     상세보기
349. Wiswesser,Andreas Norbert, Polishing pad with window.

     상세보기
350. Wiswesser,Andreas Norbert, Polishing pad with window.

     상세보기
351. Wiswesser,Andreas Norbert; Oshana,Ramiel; Hughes,Kerry F.; Rohde,Jay; Huo,David Datong; Benvegnu,Dominic J., Polishing pad with window.

     상세보기
352. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing pad with window and method of fabricating a window in a polishing pad.

     상세보기
353. Bottema,Brian E.; Abraham,Stephen F.; Pamatat,Alex P., Polishing pad, a polishing apparatus, and a process for using the polishing pad.

     상세보기
354. Bottema,Brian E.; Abraham,Stephen F.; Pamatat,Alex P., Polishing pad, a polishing apparatus, and a process for using the polishing pad.

     상세보기
355. Lim, Young-Sam; Lee, Dong-Jun; Kim, Nam-Soo; Moon, Sung-Taek; Kang, Kyoung-Moon; So, Jae-Hyun, Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting.

     상세보기
356. Birang,Manoocher; Swedek,Boguslaw A., Polishing pads useful for endpoint detection in chemical mechanical polishing.

     상세보기
357. Matsukawa,Eiji, Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device.

     상세보기
358. Benvegnu, Dominic J.; David, Jeffrey Drue; Swedek, Bogdan, Polishing system with optical head.

     상세보기
359. Zhou,Renjie; Grumbine,Steven K.; Zhang,Jian; Cherian,Isaac K., Polymeric inhibitors for enhanced planarization.

     상세보기
360. Naguib Sant, Nevin, Polypyrrolidone polishing composition and method.

     상세보기
361. Miller Anton Johann, Process of manufacturing an intergrated circuit having an interferometrically profiled mounting film.

     상세보기
362. Kazuo Ishizaki JP; Tatsuo Joji JP; Yoshifumi Ohtsu JP; Hiroyuki Itoh JP, Processing apparatus and method.

     상세보기
363. Chandrasekaran,Nagasubramaniyan, Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces.

     상세보기
364. Chandrasekaran,Nagasubramaniyan, Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces.

     상세보기
365. Taylor, Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.

     상세보기
366. Taylor, Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.

     상세보기
367. Taylor,Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.

     상세보기
368. Miyaji Akira,JPX ; Arai Takashi,JPX ; Yagi Takeshi,JPX, Semiconductor wafer polishing apparatus.

     상세보기
369. Pant Anil K. ; Breivogel Joseph R. ; Young Douglas W. ; Jairath Rahul ; Engdahl Erik H., Sensors for a linear polisher.

     상세보기
370. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods.

     상세보기
371. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods.

     상세보기
372. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods.

     상세보기
373. Swedek,Boguslaw A.; Birang,Manoocher, Signal improvement in eddy current sensing.

     상세보기
374. Tzeng Huey M., Signal processing for in situ monitoring of the formation or removal of a transparent layer.

     상세보기
375. Sikma, Elise; Paw, Witold; Petro, Benjamin; Cross, Jeffrey; Whitener, Glenn, Slurry for chemical mechanical polishing of cobalt.

     상세보기
376. Allison, William; Scott, Diane; Kerprich, Robert; Huang, Ping; Frentzel, Richard, Soft polishing pad for polishing a semiconductor substrate.

     상세보기
377. Benvegnu, Dominic J.; David, Jeffrey Drue; Swedek, Bogdan, Spectrum based endpointing for chemical mechanical polishing.

     상세보기
378. Benvegnu,Dominic J.; David,Jeffrey Drue; Swedek,Bogdan, Spectrum based endpointing for chemical mechanical polishing.

     상세보기
379. Birang,Manoocher; David,Jeffrey Drue; Swedek,Boguslaw A., Substrate edge detection.

     상세보기
380. Kimba, Toshifumi; Nakai, Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.

     상세보기
381. Kimba, Toshifumi; Nakai, Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.

     상세보기
382. Kimba,Toshifumi; Nakai,Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.

     상세보기
383. Kimba,Toshifumi; Nakai,Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.

     상세보기
384. Wiswesser,Andreas Norbert; Birang,Manoocher; Swedek,Boguslaw A., Substrate monitoring during chemical mechanical polishing.

     상세보기
385. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.

     상세보기
386. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.

     상세보기
387. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.

     상세보기
388. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.

     상세보기
389. Honda Katsuo,JPX, Surface grinding method and apparatus.

     상세보기
390. Taylor,Travis R.; Yi,Jingang; Norton,Peter Richard, System and method for in situ characterization and maintenance of polishing pad smoothness in chemical mechanical polishing.

     상세보기
391. Swedek,Boguslaw A; Johansson,Nils; Wiswesser,Andreas Norbert; Birang,Manoocher, System and method for in-line metal profile measurement.

     상세보기
392. Bartov,Avishay, System and method for measuring thin film thickness variations and for compensating for the variations.

     상세보기
393. Lund Douglas E., System and method of automatically polishing semiconductor wafers.

     상세보기
394. Katz, Vladimir; Mitchell, Bella, System and method of broad band optical end point detection for film change indication.

     상세보기
395. Katz,Vladimir; Mitchell,Bella, System and method of broad band optical end point detection for film change indication.

     상세보기
396. Swedek,Boguslaw A.; Birang,Manoocher, System for endpoint detection with polishing pad.

     상세보기
397. Amartur, Sundar, System for in-situ monitoring of removal rate/thickness of top layer during planarization.

     상세보기
398. Klein, Rita J., System for planarizing microelectronic substrates having apertures.

     상세보기
399. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.

     상세보기
400. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.

     상세보기
401. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.

     상세보기
402. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.

     상세보기
403. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.

     상세보기
404. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.

     상세보기
405. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.

     상세보기
406. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.

     상세보기
407. Sandhu, Gurtej S.; Doan, Trung Tri, System for real-time control of semiconductor wafer polishing.

     상세보기
408. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing including heater.

     상세보기
409. Sandhu Gurtej S. (Boise ID) Doan Trung Tri (Boise ID), System for real-time control of semiconductor wafer polishing including optical monitoring.

     상세보기
410. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing including optical montoring.

     상세보기
411. Elledge,Jason B., Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.

     상세보기
412. Elledge,Jason B., Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.

     상세보기
413. Elledge, Jason B.; Chandrasekaran, Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.

     상세보기
414. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.

     상세보기
415. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.

     상세보기
416. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.

     상세보기
417. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.

     상세보기
418. Bastian, Joseph A.; Reukauf, Jeremey T., Systems and methods for removing microfeature workpiece surface defects.

     상세보기
419. Bastian,Joseph A.; Reukauf,Jeremey T., Systems and methods for removing microfeature workpiece surface defects.

     상세보기
420. Taylor, Theodore M.; Carswell, Andrew, Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture.

     상세보기
421. Moore,Carter; Folkes,Elon; Castor,Terry, Systems for planarizing workpieces, e.g., microelectronic workpieces.

     상세보기
422. Wang, Xinhui; Gu, Yingru; Li, Leping, Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system.

     상세보기
423. Miller, John Michael; Wills, Gonzalo; Tian, Lu; O'Leary, Michael, Thin film total internal reflection diffraction grating for single polarization or dual polarization.

     상세보기
424. Chen,Zhan; Vacassy,Robert; Bayer,Benjamin; Khanna,Dinesh, Tunable selectivity slurries in CMP applications.

     상세보기
425. Cangshan Xu ; Brian S. Lombardo, Unsupported chemical mechanical polishing belt.

     상세보기
426. Brusic, Vlasta; Jenkins, Richard Jon; Thompson, Christopher C., Use of CMP for aluminum mirror and solar cell fabrication.

     상세보기
427. Krusell Wilbur C. ; Nagengast Andrew J. ; Pant Anil K., Use of zeta potential during chemical mechanical polishing for end point detection.

     상세보기
428. Palou-Rivera, Ignasi; Swedek, Boguslaw A.; Karuppiah, Lakshmanan, Wafer edge characterization by successive radius measurements.

     상세보기
429. Bajaj Rajeev ; Litvak Herbert E. ; Surana Rahul K. ; Jew Stephen C. ; Pecen Jiri, Wafer polishing device with movable window.

     상세보기
430. Bajaj Rajeev ; Litvak Herbert E. ; Surana Rahul K. ; Jew Stephen C. ; Pecen Jiri, Wafer polishing device with movable window.

     상세보기
431. Brouillette, Donald W.; Ference, Thomas G.; Linde, Harold G.; Hibbs, Michael S.; Mendelson, Ronald L., Wafer thickness control during backside grind.

     상세보기
432. Brouillette,Donald W.; Ference,Thomas G.; Linde,Harold G; Hibbs,Michael S.; Mendelson,Ronald L., Wafer thickness control during backside grind.

     상세보기
433. Donald W. Brouillette ; Thomas G. Ference ; Harold G. Linde ; Michael S. Hibbs ; Ronald L. Mendelson, Wafer thickness control during backside grind.

     상세보기
434. Reiss, Brian, Wet-process ceria compositions for polishing substrates, and methods related thereto.

     상세보기
435. Reiss, Brian; Dysard, Jeffrey; Shekhar, Sairam, Wet-process ceria compositions for polishing substrates, and methods related thereto.

     상세보기
더보기