$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method for planarization 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/463
출원번호 US-0188498 (1994-01-28)
발명자 / 주소
  • Paranjpe Ajit P. (Plano TX)
출원인 / 주소
  • Texas Instruments Incorporated (Dallas TX 02)
인용정보 피인용 횟수 : 85  인용 특허 : 0

초록 ▼

A method for planarization of the upper surface of a semiconductor wafer. A wafer with features formed thereon is loaded into the apparatus after having been coated with an interlevel dielectric. Thereafter, the wafer is subjected to suitably elevated temperature while a uniform elevated pressure is

대표청구항 ▼

A method for both global and local planarization of a surface of a semiconductor wafer having features formed thereon, the method comprising the steps of: a. filling the spaces between said features with an interlevel dielectric material to form a locally planarized surface; b. coating the wafer wit

이 특허를 인용한 특허 (85)

  1. Uchida, Takeshi; Matsuzawa, Jun; Hoshino, Tetsuya; Kamigata, Yasuo; Terazaki, Hiroki; Honma, Yoshio; Kondoh, Seiichi, Abrasive liquid for metal and method for polishing.
    상세보기
  2. Uchida, Takeshi; Matsuzawa, Jun; Hoshino, Tetsuya; Kamigata, Yasuo; Terazaki, Hiroki; Honma, Yoshio; Kondoh, Seiichi, Abrasive liquid for metal and method for polishing.
    상세보기
  3. Uchida, Takeshi; Matsuzawa, Jun; Hoshino, Tetsuya; Kamigata, Yasuo; Terazaki, Hiroki; Honma, Yoshio; Kondoh, Seiichi, Abrasive liquid for metal and method for polishing.
    상세보기
  4. Uchida, Takeshi; Matsuzawa, Jun; Hoshino, Tetsuya; Kamigata, Yasuo; Terazaki, Hiroki; Honma, Yoshio; Kondoh, Seiichi, Abrasive liquid for metal and method for polishing.
    상세보기
  5. Trent T. Ward, Apparatus and method for reducing removal forces for CMP pads.
    상세보기
  6. Ward Trent T., Apparatus and method for reducing removal forces for CMP pads.
    상세보기
  7. Ward, Trent T., Apparatus and method for reducing removal forces for CMP pads.
    상세보기
  8. Ward, Trent T., Apparatus and method for reducing removal forces for CMP pads.
    상세보기
  9. Ward, Trent T., Apparatus and method for reducing removal forces for CMP pads.
    상세보기
  10. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
    상세보기
  11. McCutcheon, Jeremy; Lamb, III, James E., Automated process and apparatus for planarization of topographical surfaces.
    상세보기
  12. Conti Michael ; White Lawrence W. ; Tate William R. ; Able Stephen D., Check valve cartridge for fluid pump.
    상세보기
  13. McCutcheon, Jeremy W.; Brown, Robert D., Contact planarization apparatus.
    상세보기
  14. Endisch, Denis H.; Drage, James S., Contact planarization using nanoporous silica materials.
    상세보기
  15. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
    상세보기
  16. Blalock Guy T. ; Stroupe Hugh E. ; Gordon Brian F., Deadhesion method and mechanism for wafer processing.
    상세보기
  17. Blalock, Guy T.; Stroupe, Hugh E.; Gordon, Brian F., Deadhesion method and mechanism for wafer processing.
    상세보기
  18. Blalock, Guy T.; Stroupe, Hugh E.; Gordon, Brian F., Deadhesion method and mechanism for wafer processing.
    상세보기
  19. Prybyla Judith Ann ; Taylor Gary Newton, Device fabrication involving planarization.
    상세보기
  20. Sreenivasan,Sidlgata V., Eliminating printability of sub-resolution defects in imprint lithography.
    상세보기
  21. Wang,David C.; Xu,Frank Y., Etching technique to planarize a multi-layer structure.
    상세보기
  22. Choi,Byung Jin; Meissl,Mario J.; Sreenivasan,Sidlagata V.; Watts,Michael P. C., Formation of discontinuous films during an imprint lithography process.
    상세보기
  23. Robinson Karl M., Formation of planar dielectric layers using liquid interfaces.
    상세보기
  24. Robinson, Karl M., Formation of planar dielectric layers using liquid interfaces.
    상세보기
  25. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
    상세보기
  26. Blalock Guy, Global planarization method and apparatus.
    상세보기
  27. Blalock Guy, Global planarization method and apparatus.
    상세보기
  28. Blalock Guy, Global planarization method and apparatus.
    상세보기
  29. Blalock, Guy, Global planarization method and apparatus.
    상세보기
  30. Jones, William D., High pressure fourier transform infrared cell.
    상세보기
  31. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
    상세보기
  32. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
    상세보기
  33. Sreenivasan, Sidlgata V.; Choi, Byung-Jin, Imprinting of partial fields at the edge of the wafer.
    상세보기
  34. Chou,Stephen Y., Laser assisted direct imprint lithography.
    상세보기
  35. Chou,Stephen Y., Lithographic apparatus for molding ultrafine features.
    상세보기
  36. Givens John H., Method and apparatus for forming features in holes, trenches and other voids in the manufacturing of microelectronic devices.
    상세보기
  37. Chou, Stephen Y., Method and apparatus for high density nanostructures.
    상세보기
  38. Chou, Stephen Y., Method and apparatus for high density nanostructures.
    상세보기
  39. Choi, Byung-Jin; Sreenivasan, Sidlgata V., Method and system for double-sided patterning of substrates.
    상세보기
  40. Blalock, Guy T.; Stroupe, Hugh E.; Carroll, Lynn J., Method for applying uniform pressurized film across wafer.
    상세보기
  41. Blalock, Guy T.; Stroupe, Hugh E.; Carroll, Lynn J., Method for applying uniform pressurized film across wafer.
    상세보기
  42. Blalock, Guy T.; Stroupe, Hugh E.; Carroll, Lynn J., Method for applying uniform pressurized film across wafer.
    상세보기
  43. Nakagawa,Hideo; Sasago,Masaru; Endo,Masayuki; Hirai,Yoshihiko, Method for fabricating semiconductor device.
    상세보기
  44. Takagi Mikio,JPX, Method for producing semiconductor device and production apparatus of semiconductor device.
    상세보기
  45. Ward,Trent T., Method for reducing removal forces for CMP pads.
    상세보기
  46. Beitel, Gerhard; Ahlstedt, Mattias; Hartner, Walter; Schindler, Günther; Kastner, Marcus; Weinrich, Volker, Method for removing structures.
    상세보기
  47. Sreenivasan, Sidlgata V.; McMackin, Ian M.; Melliar-Smith, Christopher Mark; Choi, Byung-Jin, Method of concurrently patterning a substrate having a plurality of fields and a plurality of alignment marks.
    상세보기
  48. LaBrake,Dwayne L., Method of controlling the critical dimension of structures formed on a substrate.
    상세보기
  49. Christopher David Dobson GB, Method of filling a recess.
    상세보기
  50. Sreenivasan,Sidlgata V., Method of forming a recessed structure employing a reverse tone process.
    상세보기
  51. Vidusek,David A.; Sreenivasan,Sidlgata V.; Wang,David C., Method of forming an in-situ recessed structure.
    상세보기
  52. Sreenivasan,Sidlgata V., Method of forming stepped structures employing imprint lithography.
    상세보기
  53. Chou, Stephen Y.; Yu, Zhaoning; Wu, Wei, Method of making an article comprising nanoscale patterns with reduced edge roughness.
    상세보기
  54. Calveley Peter Braden,NZX, Method of patterning a metal layer.
    상세보기
  55. Miller,Michael N.; Stacey,Nicholas A., Method of patterning surfaces while providing greater control of recess anisotropy.
    상세보기
  56. Matsuda Tetsuo (Poughkeepsie NY) Okumura Katsuya (Poughkeepsie NY), Method of planarizing a semiconductor workpiece surface.
    상세보기
  57. Sreenivasan, Sidlgata V.; Watts, Michael P. C., Method to arrange features on a substrate to replicate features having minimal dimensional variability.
    상세보기
  58. Marsh, Eugene P., Methods for planarization of non-planar surfaces in device fabrication.
    상세보기
  59. Sreenivasan, Sidlgata V., Pattern reversal employing thick residual layers.
    상세보기
  60. Sreenivasan, Sidlgata V.; Schumaker, Philip D., Patterning a plurality of fields on a substrate to compensate for differing evaporation times.
    상세보기
  61. Stacey,Nicholas A.; Sreenivasan,Sidlgata V.; Miller,Michael N., Patterning substrates employing multi-film layers defining etch-differential interfaces.
    상세보기
  62. Choi, Byung-Jin; Sreenivasan, Sidlgata V., Patterning substrates employing multiple chucks.
    상세보기
  63. Shih,Wu Sheng; Lamb, III,James E.; Minzey Snook,Juliet Ann; Daffron,Mark G., Planarization method for multi-layer lithography processing.
    상세보기
  64. Eugene P. Marsh, Planarization of non-planar surfaces in device fabrication.
    상세보기
  65. Marsh Eugene P., Planarization of non-planar surfaces in device fabrication.
    상세보기
  66. Doan Trung T. ; Blalock Guy T. ; Durcan Mark ; Meikle Scott G., Planarization process for semiconductor substrates.
    상세보기
  67. Doan, Trung T.; Blalock, Guy T.; Durcan, Mark; Meikle, Scott G., Planarization process for semiconductor substrates.
    상세보기
  68. Sreenivasan,Sidlgata V., Positive tone bi-layer imprint lithography method.
    상세보기
  69. Sreenivasan, Sidlgata V., Positive tone bi-layer method.
    상세보기
  70. Jeffrey P. Gambino ; William F. Landers, Process of removing CMP scratches by BPSG reflow and integrated circuit chip formed thereby.
    상세보기
  71. Sreenivasan,Sidlgata V.; Stacey,Nicholas A., Reverse tone patterning on surfaces having planarity perturbations.
    상세보기
  72. Schmid, Gerard M.; Stacey, Nicholas A; Resnick, Douglas J.; Voisin, Ronald D.; Myron, Lawrence J., Self-aligned process for fabricating imprint templates containing variously etched features.
    상세보기
  73. Bai, Dongshun; Shao, Xie; Fowler, Michelle; Tang, Tingji, Self-leveling planarization materials for microelectronic topography.
    상세보기
  74. Cathey David A. ; Durcan Mark, Semiconductor processing method using high pressure liquid media treatment.
    상세보기
  75. David A. Cathey ; Mark Durcan, Semiconductor processing method using high pressure liquid media treatment.
    상세보기
  76. Huang Yuan-Chang (Hsin-chu TWX), Spin-on-glass etchback planarization process using an oxygen plasma to remove an etchback polymer residue.
    상세보기
  77. Sreenivasan, Sidlgata V.; Choi, Byung J.; Schumaker, Norman E.; Voisin, Ronald D.; Watts, Michael P. C.; Meissl, Mario J., Step and repeat imprint lithography processes.
    상세보기
  78. Moore,Scott E., System and method for filling openings in semiconductor products.
    상세보기
  79. Moore, Scott E., System for filling openings in semiconductor products.
    상세보기
  80. Moore, Scott E., System for filling openings in semiconductor products.
    상세보기
  81. Moore,Scott E., System for filling openings in semiconductor products.
    상세보기
  82. GanapathiSubramanian, Mahadevan; Choi, Byung-Jin; Miller, Michael N.; Stacey, Nicholas A., Technique for separating a mold from solidified imprinting material.
    상세보기
  83. Selinidis, Kosta S.; Choi, Byung-Jin; Schmid, Gerard M.; Thompson, Ecron D.; McMackin, Ian Matthew, Template having alignment marks formed of contrast material.
    상세보기
  84. Sreenivasan, Sidlgata V.; Schumaker, Philip D.; McMackin, Ian M., Tessellated patterns in imprint lithography.
    상세보기
  85. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로