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Double-sided oscillator package and method of coupling components thereto 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-025/16
  • H01L-023/52
  • H01L-023/04
출원번호 US-0160008 (1993-11-30)
발명자 / 주소
  • Kotzan Mark E. (Arlington Heights IL) Knecht Thomas A. (Algonquin IL)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 38  인용 특허 : 0

초록

A double-sided oscillator package and method of coupling components thereto. A package 100 having an open-top receptacle adapted to receive electronic components and an open-bottom receptacle 114 adapted to receive a piezoelectric element and a cover 116 for hermetically sealing the open-bottom rece

대표청구항

A double-sided temperature compensated oscillator package, comprising: a platform including a central portion and an outer portion; sidewalls extending substantially upwardly and substantially downwardly from the outer portion of the platform, the upwardly extending sidewalls terminate at a surface

이 특허를 인용한 특허 (38)

  1. Kirkpatrick,Peter E.; Finot,Marc, Apparatus and method for heating micro-components mounted on a substrate.
  2. Brand J. Michael, Apparatus for filling a gap between spaced layers of a semiconductor.
  3. Brand J. Michael, Apparatus for filling a gap between spaced layers of a semiconductor.
  4. Brand, J. Michael, Apparatus for filling a gap between spaced layers of a semiconductor.
  5. J. Michael Brand, Apparatus for filling a gap between spaced layers of a semiconductor.
  6. Suzuki, Toshio; Kanayama, Masami; Hattori, Akiyoshi; Kitou, Masanori, Ceramic package with brazing material near seal member.
  7. Suzuki, Toshio; Kanayama, Masami; Hattori, Akiyoshi; Kitou, Masanori, Ceramic package with brazing material near seal member.
  8. Hatanaka Hidefumi,JPX, Crystal oscillator.
  9. Biernacki, John, Crystal resonator based oscillator formed by attaching two separate housings.
  10. Rubach, Robert W., Dual crystal package.
  11. Sutliff, Richard N.; Alhayek, Iyad; Rathore, Ammar Yasser; Adamski, Jaroslaw, Dual-function connection pads for TCXO integrated circuit.
  12. Fry Steven J., Low profile integrated oscillator having a stepped cavity.
  13. Fry Steven J., Low profile ovenized oscillator packing having a high thermal conductivity substrate.
  14. Mao, Jianhong, MEMS oscillator and manufacturing method thereof.
  15. Hsieh,Wen Lo, Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blank.
  16. Brand J. Michael, Method and apparatus for filling a gap between spaced layers of a semiconductor.
  17. Brand J. Michael, Method and apparatus for filling a gap between spaced layers of a semiconductor.
  18. J. Michael Brand, Method and apparatus for filling a gap between spaced layers of a semiconductor.
  19. Akram Salman ; Wark James M., Method and apparatus for underfill of bumped or raised die.
  20. Akram Salman ; Wark James M., Method and apparatus for underfill of bumped or raised die.
  21. Brand, J. Michael, Method for filling a gap between spaced layers of a semiconductor.
  22. Akram Salman ; Wark James M., Method of production an underfill of a bumped or raised die using a barrier adjacent to the sidewall of a semiconductor device.
  23. Fry, Steven J., Miniature ovenized crystal oscillator.
  24. Clark Roger J. ; Shniper Samuel ; Li Jacob M. ; Lane David ; Boser Otmar, Oven-heated crystal resonator and oscillator assembly.
  25. Stolpman, James L., Ovenized crystal oscillator assembly.
  26. Stolpman, James L.; McCracken, Jeffrey A., Ovenized crystal oscillator assembly.
  27. Iizuka, Minoru; Kojo, Takuya, Piezoelectric vibration device.
  28. Iizuka, Minoru; Kojo, Takuya, Piezoelectric vibration device.
  29. Haswell,Geoffrey; Fawcett,Simon William; Holdsworth,Paul Reece; Bowles,Stephen John; Smart,David Matthew; Garcia Hernandez,Miguel Jesus; Chavez Dominguez,Juan Antonio; Turo Peroy,Antonio; Salazar Soler,Jordi, Power generator.
  30. Harima, Hidenori; Mizumura, Hiroaki, Surface-mount crystal oscillator having an opened portion of the sidewalls.
  31. Hatanaka Hidefumi,JPX ; Sasagawa Ryouma,JPX ; Yonemura Hideomi,JPX ; Hayashi Naoki,JPX, Surface-mount type crystal oscillator.
  32. Marlin Luff, Temperature compensated crystal oscillator assembled on crystal base.
  33. Leighton,Keith R., Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.
  34. Salman Akram ; James M. Wark, Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of flip chip.
  35. Salman Akram ; James M. Wark, Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of slip chip.
  36. Akram, Salman; Wark, James M., Underfill of a bumped or raised die utilizing barrier adjacent to the side wall of a flip-chip.
  37. Akram Salman ; Wark James M., Underfill of bumped or raised die using a barrier adjacent to the sidewall of semiconductor device.
  38. Jiang, Tongbi, Underfill process.
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