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특허 상세정보

Integral heat sink interface

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-023/02    H02B-001/04    H02B-001/20   
미국특허분류(USC) 257/712 ; 257/713 ; 257/717 ; 257/718
출원번호 US-0083430 (1993-06-28)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 43  인용 특허 : 0
초록

An apparatus comprises a thermal energy generating device and a thermal energy dissipating device having a reduced thermal resistance of the interface between the two. The reduction is achieved by interposing a xylylene polymer layer between the two contact surfaces and applying a surface pressure sufficient to deform the xylylene polymer layer into the surface irregularities of the two surfaces. A reduction in the thermal resistance comparable to that which may be achieved by the use of a silicone grease or an indium foil may be realized if the layer is...

대표
청구항

An apparatus from which thermal energy is to be removed, comprising: a thermal energy generating device having a first surface from which thermal energy is to be removed, Said first surface having surface irregularities; a thermal energy dissipating device having a second surface to which thermal energy is to be transferred, said second surface having surface irregularities, said second surface compressively attached to said first surface of said thermal energy generating device defining an interface having air gaps of a measurable thickness therebetween...

이 특허를 인용한 특허 피인용횟수: 43

  1. Mhadeshwar, Ashish B.; Norton, Daniel; Perry, Robert James; Glaser, Paul; Pastecki, Patrick Edward. Catalytic alcohol dehydrogenation heat sink for mobile application. USP2015028961891.
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  6. Schoenstein, Paul G.; Sitler, Benjamin L.; Reamey, Robert H.; Vogdes, Christine E.. Dissipation of heat from a circuit board having bare silicon chips mounted thereon. USP2003036531771.
  7. Sagal, E. Mikhail; Panek, Jeffrey; McCullough, Kevin A.. Elastomeric heat sink with a pressure sensitive adhesive backing. USP2005056886625.
  8. Lan, Tian; Gajina, Kenji. Electric equipment and air conditioner. USP2016129516786.
  9. McCullough, Kevin A.; Sagal, E. Mikhail; Miller, James D.. Flexible glove-like heat sink. USP2003046547001.
  10. McCutcheon, Jeffrey W.; Narum, Timothy N.; Soo, Philip P.; Liu, Yaoqi J.. Flexible heat sink. USP2005076919504.
  11. McCutcheon,Jeffrey W.; Narum,Timothy N.; Soo,Philip P.; Liu,Yaoqi J.. Flexible heat sink. USP2008077399919.
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  13. Yamaguchi Akio,JPX. Heat conductor. USP2000046046907.
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  16. Hsu Hul Chun,TWX. Heat transfer interface. USP2001116324060.
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  18. Norton, Daniel G.; Perry, Robert J.. High capacity heat sink. USP2013078496201.
  19. McCullough, Kevin A.; Miller, James D.; Sagal, Mikhail. Injection moldable elastomeric gasket. USP2003056557859.
  20. Kalyanasundaram, Nagarajan; Heresztyn, Amaury. Liquid crystal switching barrier thermal control. USP2015129223167.
  21. Hardwick, John C.. Lossless audio coder. USP2004016675148.
  22. Wall Charles B. ; Peeples Johnston W. ; Craps Terry ; DiGiacomo Robert. Method and apparatus for cooling an integrated circuit device. USP2000046054676.
  23. McCullough,Kevin A.. Method of applying phase change thermal interface materials. USP2006037013555.
  24. Wieloch Christopher J. ; Babinski Thomas E. ; Mather John C.. Method of making a multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area. USP2001036200407.
  25. Foster, Jon S.. Method of manufacturing athermally conductive drive belt. USP2009047521009.
  26. Hoivik, Nils D.; Linderman, Ryan. Method of obtaining enhanced localized thermal interface regions by particle stacking. USP2011017876565.
  27. Hoivik,Nils D.; Linderman,Ryan. Method of obtaining enhanced localized thermal interface regions by particle stacking. USP2008077394657.
  28. Pope, Benjamin J.; Myers, Scott A.; Chowdhury, Ihtesham H.. Parallel heat spreader. USP2017069674986.
  29. Wary John ; Beach William F. ; Olson Roger A.. Parylene polymer layers. USP1999035879808.
  30. McCullough, Kevin A.. Print thermally conductive interface assembly. USP2004106803328.
  31. Vinciarelli, Patrizio; Curhan, Jeffrey A.. Protective coating for an electronic device. USP2005096940022.
  32. Panek, Jeffrey. Structure and method of attaching a heat transfer part having a compressible interface. USP2005056896045.
  33. Yi, John; Tea, Fu-Weng. Temperature control of an integrated circuit. USP2003116647310.
  34. Blanco, Jr., Richard Lidio. Thermal contact arrangement. USP2012078215012.
  35. Blanco, Jr.,Richard Lidio. Thermal contact arrangement. USP2008107433191.
  36. Bailey,Sean Ashley; Blanco, Jr.,Richard Lidio; Edwards,David; Guha,Supratik; Hillman,Michael David; Martin,Yves C.; Mort,Phillip Lee; Schmidt,Roger; Singh,Prabjit; Smith,Ronald Jack; Tice,Gregory L.; van Kessel,Theodore Gerard. Thermal interface apparatus. USP2008107440281.
  37. Hendry, Ian; Sumpter, Anthony Graham. Thermal management of graphics processing units. USP2013098525840.
  38. David L. Edwards ; Glenn G. Daves ; Shaji Farooq ; Sushumna Iruvanti ; Frank L. Pompeo. Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof. USP2002096444496.
  39. Edwards David L. ; Daves Glenn G. ; Farooq Shaji ; Iruvanti Sushumna ; Pompeo Frank L.. Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof. USP2001086275381.
  40. Foster, Jon S.. Thermally conductive drive belt. USP2005076919115.
  41. Sagal, E. Mikhail. Thermally conductive elastomeric heat dissipation assembly with snap-in heat transfer conduit. USP2003116651732.
  42. McCullough, Kevin A.. Thermally conductive silk-screenable interface material. USP2004126828672.
  43. McCullough, Kevin A.. Thermally conductive silk-screenable interface material. USP2003046555486.