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Heat exchanger for electronic equipment 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/02
출원번호 US-0186989 (1994-01-26)
발명자 / 주소
  • Burward-Hoy Trevor (Cupertino CA)
출원인 / 주소
  • Sun Microsystems, Inc. (Mountain View CA 02)
인용정보 피인용 횟수 : 53  인용 특허 : 0

초록

A heat transfer apparatus is disclosed. The heat transfer apparatus includes a heat pipe containing heat transfer liquid. Disposed in the heat pipe is a centrifugal rotor assembly having fixed magnets on the rotor blades. A magnetic field is generated by a magnetic coil assembly that surrounds the h

대표청구항

A heat transfer apparatus, comprising: a heat pipe containing a heat transfer liquid; a magnetic coil surrounding the heat pipe, the magnetic coil for producing a magnetic field when an electric current is supplied to the magnetic coil, the magnetic field passing through the heat pipe; and an agitat

이 특허를 인용한 특허 (53)

  1. Sanjay K. Roy, Active cold plate/heat sink.
  2. Senyk, Borys S.; Moresco, Larry L., Apparatus for cooling a computer.
  3. Goldowsky Michael Philip ; Chiu George Liang-Tai ; Mok Lawrence Shungwei ; Ellis Arthur W., Contactless hermetic pump.
  4. Joshi,Shrikant M.; Bhatti,Mohinder S.; Reyzin,Ilya E.; Johnson,Russell S., Cooling assembly with spirally wound fin.
  5. Koga,Shinya; Matsuda,Toshihiko; Niwatsukino,Kyo; Sakai,Toshisuke; Kubota,Toshiyuki; Hirose,Masashi; Narakino,Shigeru; Aizono,Yoshimitsu; Kasahara,Kazuyuki, Cooling device and an electronic apparatus including the same.
  6. Niwatsukino, Kyo; Hirose, Masashi; Narakino, Shigeru; Aizono, Yoshimitsu; Kasahara, Kazuyuki; Koga, Shinya; Sakai, Toshisuke; Kubota, Toshiyuki, Cooling device and an electronic apparatus including the same.
  7. Tonosaki, Minehiro; Kato, Eisaku; Ohmi, Motosuke; Yajima, Takashi, Cooling device, electronic apparatus and acoustic apparatus, and method for producing the cooling device.
  8. Eriksen, André Sloth, Cooling system for a computer system.
  9. Eriksen, André Sloth, Cooling system for a computer system.
  10. Eriksen, André Sloth, Cooling system for a computer system.
  11. Eriksen, André Sloth, Cooling system for a computer system.
  12. Eriksen, André Sloth, Cooling system for a computer system.
  13. Eriksen, André Sloth, Cooling system for a computer system.
  14. Suzuki Masahiro,JPX, Cooling system for electronic packages.
  15. Suzuki Masahiro,JPX, Cooling system for electronic packages.
  16. Suzuki, Masahiro, Cooling system for electronic packages.
  17. Wang, Hao, Dissipation utilizing flow of refrigerant.
  18. Wang, Hao, Dissipation utilizing flow of refrigerant.
  19. Wang, Hao, Dissipation utilizing flow of refrigerant.
  20. Holahan, Maurice F.; Kline, Eric V.; Krystek, Paul N.; Rasmussen, Michael R.; Sinha, Arvind K.; Zins, Stephen M., Dual magnetically coupled rotor heat exchanger.
  21. Holahan, Maurice F.; Kline, Eric V.; Krystek, Paul N.; Rasmussen, Michael R.; Sinha, Arvind K.; Zins, Stephen M., Duplex flexible heat exchanger.
  22. Tsenter Boris, Electrochemical heat exchanger.
  23. Tsenter Boris, Electrochemical heat exchanger.
  24. Wang, Hao, Evaporation-condensation systems and methods for their manufacture and use.
  25. Cho, Kyung-il; Song, In-seob; Ha, Byeoung Ju; Son, Sang-young; Yun, Hayong; Kang, Sung-gyu, Flat evaporator.
  26. Lyon, Geoff Sean, Fluid heat exchange systems.
  27. Lyon, Geoff Sean, Fluid heat exchange systems.
  28. Lyon, Geoff Sean, Fluid heat exchange systems.
  29. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  30. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  31. Chin, Te-Hsuan; Tsai, Shui-Fa, Heat dissipation device and electronic system.
  32. Katsui, Tadashi, Heat sink and information processor using heat sink.
  33. Tadashi Katsui JP, Heat sink and information processor using heat sink.
  34. Tadashi Katsui JP, Heat sink and information processor using heat sink.
  35. Furukawa Yuichi,JPX ; Sumitani Mitsugu,JPX ; Ito Tomio,JPX, Heat sink for portable electronic devices.
  36. Furukawa Yuichi,JPX ; Sumitani Mitsugu,JPX ; Ito Tomio,JPX, Heat sink for portable electronic devices.
  37. Tsoi, Vadim; Henningsson, Uno; Hong, Yuping; Peng, Feng; Yang, Hua; Li, Haipeng, Heat spreading device and method with sectioning forming multiple chambers.
  38. Lee Sui Yung,TWX ; Hsu Chien-hung,TWX, Heat-radiating structure.
  39. Roy,Sanjay K., Impeller driven active heat sink.
  40. Senyk, Borys S.; Moresco, Larry L., Method and an apparatus for cooling a computer.
  41. Senyk, Borys S.; Moresco, Larry L., Method and an apparatus for cooling a computer.
  42. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
  43. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
  44. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  45. Farrow, Timothy Samuel; June, Michael Sean; Makley, Albert Vincent, Minimal fluid forced convective heat sink for high power computers.
  46. Van Brocklin Andrew L. ; Bausch James F. ; Sterner John R., Multi-mode heat transfer using a thermal heat pipe valve.
  47. Huang Bin-Juine,TWX, Network-type heat pipe device.
  48. McCutchen, Wilmot H., Radial counterflow steam stripper.
  49. McCutchen, Wilmot H., Radial counterflow steam stripper.
  50. Mounioloux, Stephen, Radiator with integrated pump for actively cooling electronic devices.
  51. Wang, Hao, Thin film systems and methods for using same.
  52. McCutchen, Wilmot H.; McCutchen, David J., Vapor vortex heat sink.
  53. McCutchen, Wilmot H.; McCutchen, David J., Vapor vortex heat sink.
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