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Apparatus and method of electroplating 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-005/08
  • C25D-005/48
  • C25D-017/00
출원번호 US-0192853 (1994-02-07)
우선권정보 JP-0071379 (1993-03-30)
발명자 / 주소
  • Kosaki Katsuya (Itami JPX)
출원인 / 주소
  • Mitsubishi Denki Kabushiki Kaisha (Tokyo JPX 03)
인용정보 피인용 횟수 : 83  인용 특허 : 0

초록 ▼

An electroplating apparatus includes a casing having a large opening at the bottom, a substrate being electroplated in the casing, a plating solution injector penetrating through an upper part of the casing for introducing a plating solution into the casing, an exhaust port penetrating through an up

대표청구항 ▼

An electroplating method comprising: circulating a plating solution through a closed circulation path including a plating solution storage tank and a pump while not electroplating; after washing the inside of a casing with water, introducing an inert gas into the casing and draining the water from t

이 특허를 인용한 특허 (83)

  1. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.
    상세보기
  2. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
    상세보기
  3. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
    상세보기
  4. Ting Chiu H. ; Holtkamp William H. ; Ko Wen C., Apparatus and method utilizing an electrode adapter for customized contact placement on a wafer.
    상세보기
  5. Hanson,Kyle M., Apparatus and methods for electrochemical processing of microelectronic workpieces.
    상세보기
  6. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
    상세보기
  7. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
    상세보기
  8. Akram, Salman; Hembree, David R., Apparatus for continuous processing of semiconductor wafers.
    상세보기
  9. Woodruff Daniel J. ; Hanson Kyle M., Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member.
    상세보기
  10. Robert W. Batz, Jr. ; Scot Conrady ; Thomas L. Ritzdorf, Apparatus for high deposition rate solder electroplating on a microelectronic workpiece.
    상세보기
  11. Woodruff, Daniel J.; Hanson, Kyle M.; Oberlitner, Thomas H.; Chen, LinLin; Pedersen, John M.; Zila, Vladimir, Apparatus for processing the surface of a microelectronic workpiece.
    상세보기
  12. Pedersen, John M.; Erickson, James J., Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing.
    상세보기
  13. Pedersen,John M.; Erickson,James J., Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing.
    상세보기
  14. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.
    상세보기
  15. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
    상세보기
  16. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
    상세보기
  17. Patton Evan E. ; Fetters Wayne, Clamshell apparatus for electrochemically treating semiconductor wafers.
    상세보기
  18. Wytman Joseph, Compliant wafer chuck.
    상세보기
  19. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
    상세보기
  20. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
    상세보기
  21. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
    상세보기
  22. Batz, Jr., Robert W.; Pedersen, John M.; Klocke, John L.; Chen, LinLin, Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces.
    상세보기
  23. Batz, Jr., Robert W.; Pedersen, John M.; Klocke, John L.; Chen, LinLin, Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces.
    상세보기
  24. Batz, Jr.,Robert W.; Pedersen,John M.; Klocke,John L.; Chen,LinLin, Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces.
    상세보기
  25. Jiang,Tongbi; Li,Li, Device having contact pad with a conductive layer and a conductive passivation layer.
    상세보기
  26. Pedersen, John M.; Willey, Jeremy; Woodruff, Daniel J., Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces.
    상세보기
  27. Evan E. Patton ; Wayne Fetters, Dual channel rotary union.
    상세보기
  28. Nakano, Hiroshi; Itabashi, Takeyuki; Akahoshi, Haruo, Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device.
    상세보기
  29. Contolini Robert J. ; Reid Jonathan ; Patton Evan ; Feng Jingbin ; Taatjes Steve ; Dukovic John Owen, Electric potential shaping apparatus for holding a semiconductor wafer during electroplating.
    상세보기
  30. Contolini Robert J. ; Reid Jonathan ; Patton Evan ; Feng Jingbin ; Taatjes Steve ; Dukovic John Owen, Electric potential shaping method for electroplating.
    상세보기
  31. Yezdi Dordi ; Joe Stevens ; Roy Edwards ; Bob Lowrance ; Michael Sugarman ; Mark Denome, Electro-chemical deposition cell for face-up processing of single semiconductor substrates.
    상세보기
  32. Chandrasekhar, Prasanna; Zay, Brian J.; Modes, Sr., Richard; LaRosa, Anthony; Hobin, Kyle, Electrochemical deposition apparatus and methods of using the same.
    상세보기
  33. Chandrasekhar, Prasanna; Zay, Brian J.; Laganis, Edward J.; Romanov, Vasily V.; LaRosa, Anthony J., Electrochromic eyewear.
    상세보기
  34. Reid Jonathan David ; Contolini Robert J. ; Dukovic John Owen, Electroplating anode including membrane partition system and method of preventing passivation of same.
    상세보기
  35. Metzger, Hubert F., Electroplating apparatus.
    상세보기
  36. Toyoda, Yoshihiko; Hayashi, Kiyoshi, Electroplating apparatus.
    상세보기
  37. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
    상세보기
  38. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
    상세보기
  39. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating reactor.
    상세보기
  40. Broadbent Eliot K., Electroplating system with shields for varying thickness profile of deposited layer.
    상세보기
  41. Ting Chiu H. ; Holtkamp William H., Integrated vacuum and plating cluster system.
    상세보기
  42. Ting Chiu H. ; Holtkamp William H. ; Brodowski Richard W. ; Wytman Joseph B., Introducing and reclaiming liquid in a wafer processing chamber.
    상세보기
  43. Akram Salman ; Hembree David R., Method and apparatus for continuous processing of semiconductor wafers.
    상세보기
  44. Akram Salman ; Hembree David R., Method and apparatus for continuous processing of semiconductor wafers.
    상세보기
  45. Akram Salman ; Hembree David R., Method and apparatus for continuous processing of semiconductor wafers.
    상세보기
  46. Ting Chiu H. ; Holtkamp William H., Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate.
    상세보기
  47. Reid Jonathan David ; Taatjes Steve, Method and apparatus for treating surface including virtual anode.
    상세보기
  48. Akram, Salman; Hembree, David R., Method for continuous processing of semiconductor wafers.
    상세보기
  49. Jiang, Tongbi; Li, Li, Method for electroless plating a contact pad.
    상세보기
  50. Jiang, Tongbi; Li, Li, Method for electroless plating a contact pad.
    상세보기
  51. Batz, Jr., Robert W.; Conrady, Scot; Ritzdorf, Thomas L., Method for high deposition rate solder electroplating on a microelectronic workpiece.
    상세보기
  52. Pedersen,John M.; Erickson,James J., Method for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing.
    상세보기
  53. Patton Evan E. ; Fetters Wayne, Method of depositing metal layer.
    상세보기
  54. Wytman, Joseph, Method of processing a wafer using a compliant wafer chuck.
    상세보기
  55. Woodruff Daniel J. ; Hanson Kyle M. ; Oberlitner Thomas H. ; Chen LinLin ; Pedersen John M. ; Zila Vladimir,CAX, Methods and apparatus for processing the surface of a microelectronic workpiece.
    상세보기
  56. Woodruff Daniel J. ; Hanson Kyle M. ; Oberlitner Thomas H. ; Chen LinLin ; Pedersen John M. ; Zila Vladimir,CAX, Methods and apparatus for processing the surface of a microelectronic workpiece.
    상세보기
  57. Woodruff, Daniel J.; Hanson, Kyle M.; Oberlitner, Thomas H.; Chen, LinLin; Pedersen, John M.; Zila, Vladimir, Methods and apparatus for processing the surface of a microelectronic workpiece.
    상세보기
  58. Woodruff, Daniel J.; Hanson, Kyle M.; Oberlitner, Thomas H.; Chen, LinLin; Pedersen, John M.; Zila, Vladimir, Methods and apparatus for processing the surface of a microelectronic workpiece.
    상세보기
  59. Hanson, Kyle M.; Koziol, Jurek K.; Pedersen, John M.; Zmaj, Michal A., Microelectronic workpiece holders and contact assemblies for use therewith.
    상세보기
  60. Ting Chiu H. ; Holtkamp William H., Multiple station processing chamber and method for depositing and/or removing material on a substrate.
    상세보기
  61. Sendai,Satoshi; Tomioka,Kenya; Tsuda,Katsumi; Kumekawa,Masayuki; Mishima,Koji, Plating apparatus and method.
    상세보기
  62. Takeuchi Hiromitsu,JPX ; Tsunekawa Yoshiki,JPX ; Okumiya Masahiro,JPX, Plating method.
    상세보기
  63. Schmidt,Wayne J.; Berner,Robert W.; Woodruff,Daniel J., Plating system for semiconductor materials.
    상세보기
  64. Chandrasekhar, Prasanna; Chai, Yanjie, Potentiostat/galvanostat with digital interface.
    상세보기
  65. Ting Chiu H. ; Holtkamp William H. ; Ko Wen C. ; Lowery Kenneth J. ; Cho Peter, Process chamber and method for depositing and/or removing material on a substrate.
    상세보기
  66. Woodruff Daniel J. ; Hanson Kyle M., Reactor assembly and method of assembly.
    상세보기
  67. Woodruff Daniel J. ; Hanson Kyle M., Reactor vessel having improved cup anode and conductor assembly.
    상세보기
  68. Daniel J. Woodruff ; Kyle M. Hanson, Reactor vessel having improved cup, anode and conductor assembly.
    상세보기
  69. Daniel J. Woodruff ; Kyle M. Hanson, Reactor vessel having improved cup, anode and conductor assembly.
    상세보기
  70. Woodruff Daniel J. ; Hanson Kyle M., Reactor vessel having improved cup, anode and conductor assembly.
    상세보기
  71. Woodruff, Daniel J.; Hanson, Kyle M., Reactor vessel having improved cup, anode and conductor assembly.
    상세보기
  72. Daniel J. Woodruff ; Kyle M. Hanson, Reactor vessel having improved cup, anode, and conductor assembly.
    상세보기
  73. Arken David M. ; Chiu Andrew ; Fatula ; Jr. Joseph John ; Hitzfield Robert William ; Hsiao Wen-Chien David ; Hsiao Yiping, Rotary plater with radially distributed plating solution.
    상세보기
  74. Ting Chiu H. ; Holtkamp William H. ; Ko Wen C., Rotating anode for a wafer processing chamber.
    상세보기
  75. Akram Salman ; Hembree David R., Rotating system and method for electrodepositing materials on semiconductor wafers.
    상세보기
  76. Akram Salman ; Hembree David R., Rotating system for electrochemical treatment of semiconductor wafers.
    상세보기
  77. Thie, William; Boyd, John M.; Dordi, Yezdi; Redeker, Fritz C., Simultaneous electroless plating of two substrates.
    상세보기
  78. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
    상세보기
  79. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
    상세보기
  80. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
    상세보기
  81. Joseph Wytman, Two-piece chuck.
    상세보기
  82. Chandrasekhar, Prasanna, Variable-emittance electrochromic devices and methods of preparing the same.
    상세보기
  83. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.
    상세보기

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