$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Double-sided wafer scrubber with a wet submersing silicon wafer indexer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • A47L-025/00
  • B65H-003/08
출원번호 US-0982830 (1992-11-30)
발명자 / 주소
  • Lutz Rick A. (San Jose CA)
출원인 / 주소
  • Ontrak Systems, Inc. (Milpitas CA 02)
인용정보 피인용 횟수 : 40  인용 특허 : 0

초록

An embodiment of the present invention is a wet indexer for receiving a cassette of wafers from a previous processing station that have not been allowed to dry. The wet indexer then keeps the wafers submersed in processing solution before and during indexed transmission to later cleaning stations.

대표청구항

A wet indexer, comprising: a tank for holding a processing solution and for accepting a cassette of wafers from a previous processing station and for pre-soaking said wafers in said processing solution while said wafers are in a queue waiting for transfer to a subsequent stage; wafer outlet means in

이 특허를 인용한 특허 (40)

  1. Goudie Chad ; Natalicio John ; Olsen Greg ; Shurtliff Eric, Apparatus for rinsing wafers in the context of a combined cleaning rinsing and drying system.
  2. Bowman Mike L. ; Hempel Gene ; Karlsrud Chris ; Root Franklin D., Arrangements for wafer polishing.
  3. La Tho Le ; Venkatkrishnan Subramanian ; Ramsbey Mark T. ; Thomas Jack F. ; Early Kathleen, Backside wafer polishing for improved photolithography.
  4. Leach Michael A. (345 Sheridan #204 Palo Alto CA 94306), Block for polishing a wafer during manufacture of integrated circuits.
  5. Gockel Thomas R. ; Olson Lorin ; Ryle Lynn ; Whitelaw Brett A., Brush assembly apparatus.
  6. Gockel Thomas R. ; Olson Lorin ; Ryle Lynn ; Whitelaw Brett A. ; Ravkin Michael, Brush assembly apparatus.
  7. Vail Jim ; Wallis Mike, Brush interflow distributor.
  8. Lebel Richard J. ; Maurer Frederic ; Nadeau Rock ; Smith ; Jr. Paul H. ; Wickramasinghe Hemantha K. ; van Kessel Theodore G., Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement.
  9. Jose R. Gonzalez-Martin ; Chris Karlsrud, Cleaning station integral with polishing machine for semiconductor wafers.
  10. Jose R. Gonzalez-Martin ; Chris Karlsrud ; Robert Allen ; Toby Jordan ; Craig Howard ; Arthur Hamer ; Jeff Cunnane ; Periya Gopalan ; Bill Thornton ; Jon MacErnie ; Fernando Calderon, Combined CMP and wafer cleaning apparatus and associated methods.
  11. La Tho Le ; Venkatkrishnan Subramanian N. ; Ramsbey Mark T. ; Thomas Jack F. ; Early Kathleen Regina, Doubled-sided wafer scrubbing for improved photolithography.
  12. Gonzalez-Martin Jose R. ; Karlsrud Chris ; Allen Robert ; Jordan Toby ; Howard Craig ; Hamer Arthur ; Cunnane Jeff ; Gopalan Periya ; Thornton Bill ; MacErnie Jon ; Calderon Fernando, Integral machine for polishing, cleaning, rinsing and drying workpieces.
  13. Gonzalez-Martin, Jose R.; Karlsrud, Chris, Load and unload station for semiconductor wafers.
  14. Jose R. Gonzalez-Martin ; Chris Karlsrud ; Robert Allen ; Toby Jordan ; Craig Howard ; Arthur Hamer ; Jeff Cunnane ; Periya Gopalan ; Bill Thornton ; Jon MacErnie ; Fernando Calderon, Mapping system for semiconductor wafer cassettes.
  15. Krusell Wilbur C. ; Thrasher David L. ; Ryle Lynn S., Megasonic bath.
  16. Leach Michael A., Method and structure for polishing a wafer during manufacture of integrated circuits.
  17. Leach Michael A. (345 Sheridan #204 Palo Alto CA 94306), Method and structure for polishing a wafer during manufacture of integrated circuits.
  18. Nakano Masami (Fukushima-ken JPX) Uchiyama Isao (Fukushima-ken JPX) Takamatsu Hiroyuki (Shirakawa JPX), Method of cleaning semiconductor wafers.
  19. Stephens Donald Edgar ; Jones Oliver David ; Miller ; III Hugo John, Method of cleaning semiconductor wafers and other substrates.
  20. Ngo Minh Van ; Wang Fei, Method of forming copper interconnects with reduced in-line diffusion.
  21. Spina John A. ; DePoint ; Jr. John ; Juskiewicz Marion T., Method of storing and dispensing thin, flimsy objects.
  22. Peterson Glenn E. ; Shurtliff Eric, Methods and apparatus for cleaning and drying wafers.
  23. Jim Vail ; Mike Wallis, Methods for applying fluid through a brush interflow distributor.
  24. Na'im, Nazman; Boo, Yeong Yih, Post polish disk cleaning process.
  25. Huang Ying-Shih,TWX, Post-CMP cleaner apparatus and method.
  26. Huang Ying-Shih,TWX, Post-CMP cleaner apparatus and method.
  27. Gupta Anand ; Karlsrud Chris ; Gopalan Periya ; Trojan Daniel R. ; Cunnane Jeffrey B. ; MacErnie Jon R., Post-CMP wet-HF cleaning station.
  28. Bonsdorf, Grit; Dickenscheid, Wolfgang, Process and device for cleaning a semiconductor wafer.
  29. Simmons Mark A. (San Jose CA) Krusell Wilbur C. (San Jose CA), Process for brush cleaning.
  30. Gonzalez-Martin Jose R. ; Karlsrud Chris, Robot assisted method of polishing, cleaning and drying workpieces.
  31. Gonzalez-Martin, Jose R.; Karlsrud, Chris, Robotic method of transferring workpieces to and from workstations.
  32. Simmons Mark A. ; McGrath Martin J. ; Thrasher David L., Scrubber control system.
  33. Mokuo, Shori, Substrate processing apparatus and substrate processing method.
  34. Thrasher David L. ; Ryle Lynn S. ; Ruppell Robert M. ; Hearne John S. ; Krussell Wilbur C. ; Youre Gary D., Substrate processing system.
  35. Andreas Michael T. ; Walker Michael A., Surface cleaning apparatus.
  36. Andreas Michael T. ; Walker Michael A., Surface cleaning apparatus and method.
  37. Hessburg Merilly Ann ; Lindsley Timothy John ; Darrow David Craig ; Sheffield John Edgar, System and method for hydrodynamic loading and unloading of objects into and out of substantially touchless hydrodynamic transport systems.
  38. Liu, Zhi (Lewis); Kashkoush, Ismail; Lee, Hanjoo, Systems and methods for drying a rotating substrate.
  39. Donald Edgar Stephens ; Oliver David Jones ; Hugo John Miller, III, Wafer cleaning apparatus.
  40. Jones Oliver David ; Vail Jim, Wafer cleaning apparatus.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로