이 특허를 인용한 특허 (40)

1. Park, Allen; Chang, Ellis, Alteration for wafer inspection.

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2. Reimer Ernest M.,CAX ; Hearn Paul,CAX ; Hermanto Ivi,CAX, Apparatus and method for automated visual inspection of objects.

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3. Reitan Ronald C. (Stillwater MN), Automated image quality control.

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4. Kurada, Satya; Babulnath, Raghav; Ng, Kwok; Gao, Lisheng, Based sampling and binning for yield critical defects.

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5. Saidin, Zain K.; Xiong, Yalin; Glasser, Lance; Hess, Carl; Preil, Moshe E., Computer-implemented methods for detecting defects in reticle design data.

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6. Florence, Glenn; Park, Allen; Rose, Peter, Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects.

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7. Park, Allen; Chang, Ellis, Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan.

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8. Choi, SunYong; Pae, YeonHo; Chang, Ellis, Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer.

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9. Su, Bo; Verma, Gaurav; Du, Hong; Shi, Rui-fang; Andrews, Scott, Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer.

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10. Kulkarni, Ashok V.; Chen, Chien-Huei (Adam), Design-based inspection using repeating structures.

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11. Huang, Junqing; Zhang, Yong; Chen, Stephanie; Luo, Tao; Gao, Lisheng; Wallingford, Richard, Detecting defects on a wafer.

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12. Lang, Jun; Chen, Kan; Gao, Lisheng; Huang, Junqing, Detecting defects on a wafer.

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13. Wu, Kenong; Gao, Lisheng; Chen, Grace Hsiu-Ling; Shortt, David W., Detecting defects on a wafer using defect-specific and multi-channel information.

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14. Wu, Kenong; Wu, Meng-Che; Gao, Lisheng, Detecting defects on a wafer using defect-specific information.

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15. Chu, Xing; Lauber, Jan A.; Runyon, J. Rex, Detecting defects on a wafer using template image matching.

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16. Ramachandran, Vijayakumar, Determining a position of inspection system output in design data space.

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17. Chang, Ellis; Van Riet, Michael J.; Park, Allen; Zafar, Khurram; Bhattacharyya, Santosh, Determining design coordinates for wafer defects.

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18. Kulkarni, Ashok V.; Chen, Chien-Huei Adam, Dynamic care areas.

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19. Jayaraman, Thirupurasundari; Babulnath, Raghav, Dynamic design attributes for wafer inspection.

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20. Böttger, Frank; Häuptle, Martin, Large-scale lyophilization device.

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21. Hodgson Allan S. ; Barrow Catherine R. ; Arnold Jessica M., Method for bakery product measurement.

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22. Xiong, Yalin; Hess, Carl, Methods and systems for classifying defects detected on a reticle.

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23. Kekare, Sagar A.; Peterson, Ingrid B.; Preil, Moshe E., Methods and systems for detecting defects in a reticle design pattern.

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24. Peterson, Ingrid B.; Yum, Ed, Methods and systems for detecting defects in a reticle design pattern.

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25. Chen, Chien-Huei (Adam); Xiong, Yan; Zhang, Jianxin; Chang, Ellis; Fang, Tsung-Pao, Methods and systems for determining a defect criticality index for defects on wafers.

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26. Kulkarni, Ashok; Duffy, Brian; Maayah, Kais; Rouse, Gordon; Shifrin, Eugene, Methods and systems for determining a position of inspection data in design data space.

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27. Xiong, Yan, Methods and systems for generating an inspection process for a wafer.

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28. Park, Allen; Rose, Peter; Chang, Ellis; Duffy, Brian; McCord, Mark; Abbott, Gordon, Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions.

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29. Kulkarni, Ashok; Duffy, Brian; Maayah, Kais; Rouse, Gordon, Methods and systems for utilizing design data in combination with inspection data.

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30. Kulkarni, Ashok; Duffy, Brian; Maayah, Kais; Rouse, Gordon, Methods and systems for utilizing design data in combination with inspection data.

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31. Zafar, Khurram; Kekare, Sagar; Chang, Ellis; Park, Allen; Rose, Peter, Methods and systems for utilizing design data in combination with inspection data.

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32. Zafar, Khurram; Kekare, Sagar; Chang, Ellis; Park, Allen; Rose, Peter, Methods and systems for utilizing design data in combination with inspection data.

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33. Bhaskar, Kris; McCord, Mark; Bhattacharyya, Santosh; Liang, Ardis; Wallingford, Richard; Altendorfer, Hubert; Maayah, Kais, Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer.

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34. Bhaskar, Kris; McCord, Mark; Bhattacharyya, Santosh; Liang, Ardis; Wallingford, Richard; Altendorfer, Hubert; Maayah, Kais, Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer.

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35. Verma, Gaurav; Glasser, Lance; Preil, Moshe E., Methods, systems, and carrier media for evaluating reticle layout data.

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36. Peterson,Ingrid B.; Von den Hoff,Mike; Wiley,Jim, Qualifying patterns, patterning processes, or patterning apparatus in the fabrication of microlithographic patterns.

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37. Luo, Tao; Zhang, Yong; Chen, Stephanie, Segmentation for wafer inspection.

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38. Alexander, Emily H.; Welch, Jerimiah G., System and method for acquiring images of medication preparations.

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39. Duffy, Brian; Kulkarni, Ashok, Systems and methods for creating inspection recipes.

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40. Gochar, Jr., Joseph P., Vision system with reflective device for industrial parts.

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