이 특허를 인용한 특허 (184)

1. Chung,Young Sir; Baird,Robert W.; Durlam,Mark A.; Engel,Bradley N., 3-D inductor and transformer devices in MRAM embedded integrated circuits.

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2. Daley, Douglas M.; Erturk, Mete; Gordon, Edward J., BEOL wiring structures that include an on-chip inductor and an on-chip capacitor, and design structures for a radiofrequency integrated circuit.

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3. Hamada, Yasuhiro; Kishimoto, Shuya; Maruhashi, Kenichi, Bias circuit and method of manufacturing the same.

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4. Ker Ming-Dou,TWX, Charged device mode ESD protection circuit.

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5. Lin, Mou-Shiung, Chip structure with a passive device and method for forming the same.

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6. Irfan M. Rahim, Circuit structure including a passive element formed within a grid array substrate and method for making the same.

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7. Schrom, Gerhard; Hazucha, Peter; De, Vivek K.; Karnik, Tanay, DC-DC converter switching transistor current measurement technique.

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8. Schrom, Gerhard; Hazucha, Peter; De, Vivek; Karnik, Tanay, DC-DC converter switching transistor current measurement technique.

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9. Schrom, Gerhard; Hazucha, Peter; De, Vivek; Karnik, Tanay, DC-DC converter switching transistor current measurement technique.

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10. Smith, David M., Defected ground plane inductor.

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11. Chen, Shuxian; Richter, Fangyun; Jensen, Bradley; Liu, Yowjuang (Bill), Density transition zones for integrated circuits.

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12. Pon,Harry Q., EMI and noise shielding for multi-metal layer high frequency integrated circuit processes.

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13. Kordic, Srdjan; Roussel, C?line; Inard, Alain, Electrical connection device between two tracks of an integrated circuit.

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14. Zhang,Ligang; Pietruszynski,David; Thomsen,Axel; Smith,Kevin G., Electromagnetic shielding structure.

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15. Sasaki, Toshiya; Uchiyama, Kazuyoshi; Kawaguchi, Masahiko; Amaya, Keishiro; Tamezawa, Eita, Electronic component having a coil conductor with photosensitive conductive paste.

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16. Wong, Robert C.; Demm, Ernst H.; Leung, Pak; Hirsch, Alexander M., Generation of metal holes by via mutation.

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17. Wen Wen-Ying,TWX ; Chen Chih-Ming,TWX, High Q inductor and its forming method.

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18. Acosta, Raul E.; Lund, Jennifer L.; Groves, Robert A.; Rosner, Joanna; Cordes, Steven A.; Carasso, Melanie L., High Q inductor with faraday shield and dielectric well buried in substrate.

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19. Acosta, Raul E.; Lund, Jennifer L.; Groves, Robert A.; Rosner, Joanna; Cordes, Steven A.; Carasso, Melanie L., High Q inductor with faraday shield and dielectric well buried in substrate.

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20. Zabaco, Jorge, High current, low equivalent series resistance printed circuit board coil for power transfer application.

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21. Zabaco, Jorge, High current, low equivalent series resistance printed circuit board coil for power transfer application.

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22. Nakatani, Toshifumi, High frequency semiconductor device.

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23. Lin, Mou-Shiung, High performance system-on-chip inductor using post passivation process.

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24. Lin, Mou-Shing, High performance system-on-chip using post passivation process.

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25. Lin, Mou-Shiung, High performance system-on-chip using post passivation process.

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26. Donald S. Gardner, Inductor for integrated circuit.

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27. Abadeer, Wagdi; Groves, Robert A.; Hansen, Patrick, Inductor for integrated circuits.

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28. Harris, Edward Belden; Merchant, Sailesh Mansinh; Steiner, Kurt George; Vitkavage, Susan Clay, Inductor formed in an integrated circuit.

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29. Harris, Edward Belden; Merchant, Sailesh Mansinh; Steiner, Kurt George; Vitkavage, Susan Clay, Inductor formed in an integrated circuit.

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30. Harris,Edward Belden; Merchant,Sailesh Mansinh; Steiner,Kurt George; Vitkavage,Susan Clay, Inductor formed in an integrated circuit.

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31. Lin, Hsiao-Chu; Lee, Sheng-Yuan, Inductor structure.

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32. Tamata,Mitsuru; Hamaguchi,Mutsumi, Inductor, resonant circuit, semiconductor integrated circuit, oscillator, and communication apparatus.

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33. Gardner,Donald S., Inductors for integrated circuits.

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34. Gardner,Donald S., Inductors for integrated circuits.

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35. Duncan, Ralph; Kwan, Tom W., Integrated VCO having an improved tuning range over process and temperature variations.

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36. Duncan,Ralph; Kwan,Tom W., Integrated VCO having an improved tuning range over process and temperature variations.

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37. Grzegorek Andrew Z. ; McFarland William J., Integrated circuit compatible planar inductors with increased Q.

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38. Guruswami M. Sridharan ; Kartik M. Sridharan, Integrated circuit die having an interference shield.

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39. Sridharan,Guruswami M.; Sridharan,Kartik M., Integrated circuit die having an interference shield.

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40. Lin, Yu-Ling; Yen, Hsiao-Tsung; Chen, Ho-Hsiang; Jou, Chewn-Pu, Integrated circuit ground shielding structure.

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41. Burghartz Joachim Norbert ; Edelstein Daniel Charles ; Jahnes Christopher Vincent ; Uzoh Cyprian Emeka, Integrated circuit inductor.

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42. Pitts, Robert L.; Baldwin, Greg C., Integrated circuit inductor with integrated vias.

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43. Pitts,Robert L.; Baldwin,Greg C., Integrated circuit inductor with integrated vias.

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44. Sidhu,Lakhbeer S.; Rahim,Irfan, Integrated circuit inductors.

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45. Gillespie, Timothy; Knight, Peter, Integrated circuit inductors having high quality factors.

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46. Wei,Derrick C.; Shi,Ying; Smith,Kevin G.; Proffitt,Steven P.; Thomsen,Axel; Pietruszynski,David M.; Zhang,Ligang, Integrated circuit package configuration incorporating shielded circuit element structure.

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47. Lin, Yaojian; Marimuthu, Pandi Chelvam, Integrated circuit package system with post-passivation interconnection and integration.

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48. Lin, Yaojin; Marimuthu, Pandi Chelvam, Integrated circuit package system with post-passivation interconnection and integration.

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49. Marimuthu, Pandi Chelvam; Frye, Robert Charles; Lin, Yaojian, Integrated circuit stacking system with integrated passive components.

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50. Burghartz Joachim Norbert ; Edelstein Daniel Charles ; Jahnes Christopher Vincent ; Uzoh Cyprian Emeka, Integrated circuit toroidal inductor.

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51. Lowther Rex Everett, Integrated circuit with an improved inductor structure and method of fabrication.

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52. Waggoner Charles D. ; Imbruglia Antonio,ITX ; Zambrano Raffaele,ITX, Integrated circuit with improved electrostatic discharge protection including multi-level inductor.

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53. Ding, Weiqi; Shumarayev, Sergey; Wong, Wilson; Atesoglu, Ali; Ippili, Sharat Babu, Integrated circuits with configurable inductors.

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54. Gardner, Donald S., Integrated inductor.

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55. Gardner,Donald S., Integrated inductor.

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56. Ko, Ching-Chung; Lee, Tung-Hsing; Chan, Kuei-Ti; Cheng, Tao; Yang, Ming-Tzong, Integrated inductor.

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57. Crawford, Ankur Mohan; Gardner, Donald S., Integrated inductor having magnetic layer.

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58. Merrill Richard Billings ; Lee Tsung-Wen, Integrated inductor with filled etch.

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59. Chatzopoulos, Alkiviades; Bontzios, Giorgos, Integrated or printed margarita shaped inductor.

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60. Lin, Yaojian; Cao, Haijing; Frye, Robert Charles; Marimuthu, Pandi Chelvam, Integrated passive device system.

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61. Lin, Yaojian; Cao, Haijing; Zhang, Qing; Chen, Kang; Fang, Jianmin, Integrated passive devices.

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62. Chang, James Y. C., Integrated spiral inductor.

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63. Gardner, Donald S., Integrated transformer.

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64. Gardner, Donald S., Integrated transformer.

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65. Gardner, Donald S., Integrated transformer.

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66. Gardner, Donald S., Integrated transformer.

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67. Gardner, Donald S., Integrated transformer.

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68. Gardner, Donald S., Integrated transformer.

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69. Gardner,Donald S., Integrated transformer.

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70. Gardner,Donald S., Integrated transformer.

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71. Oda Noriaki,JPX, Interconnect wiring with sidewalls and inter-wiring insulation composed of fluorine.

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72. Behzad, Arya R., Large gain range, high linearity, low noise MOS VGA.

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73. Behzad, Arya R., Large gain range, high linearity, low noise MOS VGA.

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74. Behzad,Arya R., Large gain range, high linearity, low noise MOS VGA.

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75. Mosley, Larry E.; Hendricks, Clive R., Low resistance inductors, methods of assembling same, and systems containing same.

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76. Crawford, Ankur Mohan; Gardner, Donald S., Magnetic layer processing.

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77. Gardner,Donald S., Magnetic layer processing.

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78. Cooney, III, Edward C.; Dang, Dinh; DeMuynck, David A.; McTaggart, Sarah A.; Milo, Gary L.; Roma, Melissa J.; Thompson, Jeffrey L.; Weeks, Thomas W., Metal wires of a stacked inductor.

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79. Zhang,Ligang, Method and structure for forming relatively dense conductive layers.

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80. Lauterbach,Christl; Paulus,Christian, Method for fabricating a microelectronic circuit including applying metal over and thickening the integrated coil to increase conductivity.

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81. Lin, Mou-Shiung; Lee, Jin-Yuan, Method for making high-performance RF integrated circuits.

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82. Lin, Mou-Shiung; Lee, Jin-Yuan, Method for making high-performance RF integrated circuits.

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83. Yoon, Jun Bo; Han, Chul Hi; Yoon, Eui Sik; Kim, Choong Ki, Method for manufacturing a semiconductor device having a metal layer floating over a substrate.

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84. Capocelli Piero,ITX ; Zambrano Raffaele,ITX ; Pio Federico,ITX ; Riva Carlo,ITX, Method for realizing magnetic circuits in an integrated circuit.

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85. Hanson David A., Method for reducing via inductance in an electronic assembly and article.

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86. Won,Seok Jun, Method of fabricating a semiconductor device having dual stacked MIM capacitor.

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87. Kim, Nam Joo, Method of fabricating an inductor for a semiconductor device.

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88. Chen Wei-Fan,TWX, Method of fabricating on-chip inductor.

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89. Harris,Edward B.; Downey,Stephen W., Method of forming a spiral inductor in a semiconductor substrate.

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90. Alford Ronald C. ; Stengel Robert E. ; Weisman Douglas H. ; Marlin George W., Method of forming a three-dimensional integrated inductor.

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91. Burghartz Joachim Norbert ; Edelstein Daniel Charles ; Jahnes Christopher Vincent ; Uzoh Cyprian Emeka, Method of forming an integrated circuit spiral inductor with ferromagnetic liner.

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92. Lin, Yaojian; Frye, Robert C., Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD).

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93. Lin, Yaojian; Frye, Robert C., Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD).

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94. Lin, Yaojian; Frye, Robert C., Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD).

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95. Lin, Yaojian; Frye, Robert Charles, Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD).

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96. Gardner,Donald S., Method of making an integrated inductor.

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97. Gardner,Donald S., Method of making an integrated inductor.

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98. Sia, Choon-Beng; Yeo, Kiat Seng; Chu, Shao-fu Sanford; Ng, Cheng Yeow; Chew, Kok Wai; Goh, Wang Ling, Method of manufacturing 3-D spiral stacked inductor on semiconductor material.

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99. Sasaki,Toshiya; Uchiyama,Kazuyoshi; Kawaguchi,Masahiko; Amaya,Keishiro; Tamezawa,Eita, Method of manufacturing an electronic component including an inter-line insulating layer and a conductor pattern.

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100. Lee Jin Hyo,KRX ; Rhee Heung Soo,KRX ; Yu Hyun Kyu,KRX ; Kim Bo Woo,KRX ; Nam Kee Soo,KRX, Method of manufacturing inductor device on a silicon substrate thereof.

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101. Wong, Robert C.; Demm, Ernst H.; Leung, Pak; Hirsch, Alexander M., Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation.

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102. Gardner, Donald S., Methods for fabricating inductor for integrated circuit or integrated circuit package.

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103. Zhao Ji ; Teng Chih Sieh, Methods for making VLSI capacitors and high Q VLSI inductors using metal-filled via plugs.

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104. Bothra, Subhas, Methods for making semiconductor inductor.

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105. Daley, Douglas M.; Erturk, Mete; Gordon, Edward J., Methods of fabricating a BEOL wiring structure containing an on-chip inductor and an on-chip capacitor.

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106. Miller Dennis Brian ; O'Malley Grace M. ; Kemper Brian R., Microelectronic assembly with connection to a buried electrical element, and method for forming same.

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107. Miller Dennis Brian ; O'Malley Grace M. ; Kemper Brian R., Microelectronic assembly with connection to a buried electrical element, and method for forming same.

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108. Ma Jun ; Liang Han-Bin Kuo ; Ngo David Quoc-Hung ; Cheng Shih King ; Spears Edward T. ; Yeung Bruce R., Monolithic RF mixed signal IC with power amplification.

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109. Nasserbakht Gitty N., Monolithic inductor.

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110. Basteres, Laurent; Mhani, Ahmed; Valentin, Fran.cedilla.ois; Karam, Jean-Michel, Monolithic integrated circuit incorporating an inductive component and process for fabricating such an integrated circuit.

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111. Laurent Basteres FR; Ahmed Mhani FR; Fran.cedilla.ois Valentin FR; Jean-Michel Karam FR, Monolithic integrated circuit incorporating an inductive component and process for fabricating such an integrated circuit.

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112. Person Herman R. (Columbus NE) Adelman Jeffrey T. (Columbus NE) Tschosik Bruce A. (Yankton SD) Veik Thomas L. (Columbus NE) Zwick Scott D. (Columbus NE), Monolithic multilayer ultra thin chip inductors and method for making same.

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113. Chaudhry, Samir; Layman, Paul Arthur; Thomson, J. Ross; Laradji, Mohamed; Griglione, Michelle D., Multi-layer inductor formed in a semiconductor substrate.

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114. Ping Liou TW, Multi-level spiral inductor structure having high inductance (L) and high quality factor (Q).

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115. Chang, James Y. C., Multi-track integrated circuit inductor.

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116. Chang, James Y. C., Multi-track integrated spiral inductor.

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117. Stephane Beaussart ; Wayne Mack Struble, Multilayer spiral inductor and integrated circuits incorporating the same.

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118. Choudhury Ratan K. ; Kapoor Ashok K. ; Menon Satish, Multilevel metallization structure for integrated circuit I/O lines for increased current capacity and ESD protection.

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119. Ronald L. Bentley, Multiple level spiral inductors used to form a filter in a printed circuit board.

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120. Eldredge, Adam B.; Hara, Susumu, Mutual inductance circuits.

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121. Daley, Douglas M.; Erturk, Mete; Gordon, Edward J., On-chip capacitors with a variable capacitance for a radiofrequency integrated circuit.

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122. Daley, Douglas M.; Erturk, Mete; Gordon, Edward J., On-chip capacitors with a variable capacitance for a radiofrequency integrated circuit.

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123. Daley, Douglas M.; Erturk, Mete; Gordon, Edward J., On-chip capacitors with a variable capacitance for a radiofrequency integrated circuit.

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124. Liu,Q Z; Zhao,Bin; Howard,David, On-chip inductors.

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125. Correale ; Jr. Anthony, On-chip power distribution for improved decoupling.

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126. Chiu,Pei Ju, On-chip transformer balun.

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127. Gardner, Donald S.; Hazucha, Peter; Schrom, Gerhard, On-die micro-transformer structures with magnetic materials.

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128. Gardner, Donald S.; Hazucha, Peter; Schrom, Gerhard, On-die micro-transformer structures with magnetic materials.

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129. Ullmann, Andreas; Knobloch, Alexander; Krumm, Jurgen, Organic electronic circuit.

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130. Lowther Rex E. ; Young William R., Parasitic current barriers.

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131. Lin, Mou-Shiung; Chou, Chiu-Ming; Chou, Chien-Kang, Post passivation interconnection process and structures.

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132. Lin, Mou-Shiung; Chou, Chiu-Ming; Chou, Chien-Kang, Post passivation interconnection structures.

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133. Mei, Shaoning; Ju, Shaofu; Zhu, Jifeng, Preparation method of three-dimensional integrated inductor-capacitor structure.

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134. Kim,Han; Min,Byoung Youl; Kim,Young Woo; Lee,Young Jae; Ryu,Chang Myung, Printed circuit board having three-dimensional spiral inductor and method of fabricating same.

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135. Van Roosmalen Marcel Wilhelm Rudolf Martin,NLX ; Verreck Maurice,NLX, Q inductor with multiple metallization levels.

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136. Makoto Nonaka JP, Resistor element comprising peripheral contacts.

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137. Zhang,Ligang, Self-shielding inductor.

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138. Lee Sheng-Hann, Self-shielding inductor for multi-layer semiconductor integrated circuits.

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139. Anzai,Kunio, Semiconductor apparatus with improved yield.

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140. Nakayama,Fumitaka; Morikawa,Masatoshi; Hoshino,Yutaka; Uchiyama,Tetsuo, Semiconductor device and manufacturing the same.

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141. Lin, Yaojian, Semiconductor device and method of forming IPD on molded substrate.

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142. Lin, Yaojian, Semiconductor device and method of forming an inductor on polymer matrix composite substrate.

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143. Lin, Yaojian, Semiconductor device and method of forming an inductor on polymer matrix composite substrate.

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144. Won,Seok Jun, Semiconductor device having dual stacked MIM capacitor and method of fabricating the same.

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145. Kajiyama, Takeshi, Semiconductor device having wiring line with hole, and manufacturing method thereof.

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146. Nakayama,Fumitaka; Morikawa,Masatoshi; Hoshino,Yutaka; Uchiyama,Tetsuo, Semiconductor device including multiple wiring layers and circuits operating in different frequency bands.

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147. Motsiff, William T.; Shapiro, Michael J., Semiconductor device with internal heat dissipation.

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148. Yegnashankaran, Visvamohan, Semiconductor die with an integrated inductor.

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149. Bothra, Subhas, Semiconductor inductor and methods for making the same.

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150. Mizushima Kazuyuki,JPX, Semiconductor integrated circuit device having multi-level wiring structure without dot pattern.

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151. Johnson, Eric; Leung, Chester; Yu, Bo; Qian, Yin; Hatzilambrou, Mark; Doan, My The, Single damascene method for RF IC passive component integration in copper interconnect process.

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152. Harris,Edward B.; Downey,Stephen W., Spiral inductor formed in a semiconductor substrate.

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153. Nabeshima, Yutaka; Kajiyama, Masaoki; Matsunaga, Tomohiro; Iwadate, Hidenori, Spiral planar inductor and manufacturing method thereof.

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154. Yen, Hsiao-Tsung; Lin, Yu-Ling; Lu, Ying-Ta; Chen, Huan-Neng; Chen, Ho-Hsiang, Structure and method for a transformer with magnetic features.

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155. Yen, Hsiao-Tsung; Lin, Yu-Ling; Lu, Ying-Ta; Chen, Huan-Neng; Chen, Ho-Hsiang, Structure and method for a transformer with magnetic features.

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156. Yen, Hsiao-Tsung; Lin, Yu-Ling; Lu, Ying-Ta; Chen, Huan-Neng; Chen, Ho-Hsiang, Structure for a transformer with magnetic features.

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157. Burghartz Joachim Norbert ; Jenkins Keith Aelwyn ; Soyuer Mehmet, Substrate contact for integrated spiral inductors.

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158. Zhang,Ligang, Surface inductor.

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159. Lowther, Rex Everett; Young, William R., Symmetric inducting device for an integrated circuit having a ground shield.

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160. Lowther, Rex Everett; Young, William R., Symmetric inducting device for an integrated circuit having a ground shield.

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161. Lowther,Rex Everett; Young,William R., Symmetric inducting device for an integrated circuit having a ground shield.

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162. Lowther,Rex Everett; Young,William R., Symmetric inducting device for an integrated circuit having a ground shield.

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163. Khorramabadi, Haideh, System and method for linearizing a CMOS differential pair.

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164. Khorramabadi,Haideh, System and method for linearizing a CMOS differential pair.

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165. Khorramabadi,Haideh, System and method for linearizing a CMOS differential pair.

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166. Ralph Duncan ; Tom W. Kwan, System and method for narrow band PLL tuning.

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167. Chaudhry, Samir; Layman, Paul Arthur; Thomson, J. Ross; Laradji, Mohamed; Griglione, Michelle D., Thin film multi-layer high Q transformer formed in a semiconductor substrate.

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168. Kim, Jonghae; Gu, Shiqun; Henderson, Brian Matthew; Toms, Thomas R.; Chua-Eoan, Lew G.; Bazarjani, Seyfollah S.; Nowak, Matthew, Three dimensional inductor and transformer.

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169. Kim, Jonghae; Gu, Shiqun; Henderson, Brian Matthew; Toms, Thomas R.; Chua-Eoan, Lew G.; Bazarjani, Seyfollah S.; Nowak, Matthew, Three dimensional inductor, transformer and radio frequency amplifier.

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170. Liou Ping,TWX, Three-dimension inductor structure in integrated circuit technology.

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171. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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172. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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173. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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174. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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175. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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176. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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177. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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178. Lin,Mou Shiung, Top layers of metal for high performance IC's.

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179. Marty Michel,FRX ; Jaouen Herve,FRX, Transformer for integrated circuits.

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180. Coolbaugh,Douglas D.; Edelstein,Daniel C.; Groves,Robert A.; He,Zhong Xiang, Tri-metal and dual-metal stacked inductors.

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181. Zhao Ji ; Teng Chih Sieh, VLSI capacitors and high Q VLSI inductors using metal-filled via plugs.

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182. Maeda,Masakatsu, Voltage controlled oscillator apparatus.

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183. Subramanian, Krupakar M., Voltage-controlled semiconductor inductor and method.

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184. Subramanian,Krupakar M., Voltage-controlled semiconductor inductor and method.

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