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Coated abrasive containing erodable agglomerates 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-001/00
  • B24D-011/00
출원번호 US-0831083 (1992-02-05)
발명자 / 주소
  • Cosmano Richard J. (St. Paul MN) Duwell Ernest J. (St. Paul MN)
출원인 / 주소
  • Minnesota Mining and Manufacturing Company (St. Paul MN 02)
인용정보 피인용 횟수 : 43  인용 특허 : 0

초록

Coated abrasive article comprising a backing bearing on at least one major surface thereof erodable agglomerates and abrasive grains, wherein the erodable agglomerates consist essentially of a grinding aid, and optionally, a binder. The erodable agglomerates can be above, between, or beneath the abr

대표청구항

A coated abrasive article comprising a backing bearing on and adhered to at least one major surface of said backing a multiplicity of erodable agglomerates and a multiplicity of abrasive grains, wherein said erodable agglomerates consist essentially of a grinding aid, said grinding aid having a Mohs

이 특허를 인용한 특허 (43)

  1. Puzemis, Mary J.; Tian, Yinggang; Rehrig, Paul W.; Khaund, Arup K.; Pearlman, John, Abrasive article and method of forming.
  2. Tian, Yinggang; Khaund, Arup K.; Pearlman, John, Abrasive article and method of forming.
  3. Tian, Yinggang; Khaund, Arup K.; Subramanian, Krishnamoorthy; Pearlman, John, Abrasive article and method of forming.
  4. Tian, Yinggang; Khaund, Arup K.; Subramanian, Krishnamoorthy; Pearlman, John, Abrasive article and method of forming.
  5. Tian, Yinggang; Pearlman, John J.; Brosnan, Maureen A.; Khaund, Arup K., Abrasive article and method of forming.
  6. Tian, Yinggang; Pearlman, John J.; Brosnan, Maureen A.; Khaund, Arup K., Abrasive article and method of forming.
  7. Tian, Yinggang; Rehrig, Paul W.; Khaund, Arup K., Abrasive article and method of forming.
  8. Tian, Yinggang; Rehrig, Paul W.; Khaund, Arup K.; Jain, Avanti M.; Che, Wei; Liebelt, Susanne; Tesi, Vincent, Abrasive article and method of forming.
  9. Tian, Yinggang; Rehrig, Paul W.; Khaund, Arup K.; Jain, Avanti; Che, Wei; Liebelt, Susanne; Tési, Vincent, Abrasive article and method of forming.
  10. Gagliardi John J., Abrasive article with embossed isolation layer and methods of making and using.
  11. John J. Gagliardi, Abrasive article with embossed isolation layer and methods of making and using.
  12. Gagliardi John J. ; Chesley Jason A., Abrasive article with integrally molded front surface protrusions containing a grinding aid and methods of making and using.
  13. Gagliardi John J., Abrasive article with separately formed front surface protrusions containing a grinding aid and methods of making and using.
  14. Gagliardi John J., Abrasive article with separately formed front surface protrusions containing a grinding aid and methods of making and using.
  15. Seth, Anuj, Abrasive articles including a blend of abrasive grains and method of forming same.
  16. Liebelt, Susanne; Tesi, Vincent; Bennigsen-Mackiewicz, Theodor Von, Abrasive articles including abrasive particles bonded to an elongated body.
  17. Liebelt, Susanne; Tesi, Vincent; Bennigsen-Mackiewicz, Theodor Von, Abrasive articles including abrasive particles bonded to an elongated body.
  18. Liebelt, Susanne; Tesi, Vincent; von Bennigsen-Mackiewicz, Theodor, Abrasive articles including abrasive particles bonded to an elongated body.
  19. Tian, Yinggang; Ding, Ran; Liebelt, Susanne; Subramanian, Krishnamoorthy, Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof.
  20. Rehrig, Paul W.; Tian, Yinggang; Khaund, Arup K., Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof.
  21. Chuda, Katarzyna; Latournerie, Jérôme; Garnier, Patrick, Abrasive products including active fillers.
  22. Culler Scott R. ; Mucci Michael V., Abrasive slurries and abrasive articles comprising multiple abrasive particle grades.
  23. Wood, William P.; McArdle, James L., Agglomerate abrasive grain and a method of making the same.
  24. Zhai, Jianchang; Meng, Xia; Xu, Huanming, Anti-clogging mesh abrasive cloth.
  25. Nishio Mikio,JPX, Apparatus for polishing substrate using resin film or multilayer polishing pad.
  26. Zimmer Jerry W., CVD diamond coated substrate for polishing pad conditioning head and method for making same.
  27. Slutz,David E.; Finke,Steven J., CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same.
  28. McArdle, James L.; Culler, Scott R.; Wood, William P., Ceramic aggregate particles.
  29. James Tait Elder, Coated abrasive tool and construction method.
  30. Benedict Harold W. ; Bange Donna W. ; Heacox Gary L. ; Trudeau Timothy J., Coated abrasives and methods of preparation.
  31. Ma, Jingwen; DeVoe, Robert J.; Hine, Andrew M.; Thurber, Ernest L.; Kincaid, Don H., Coated substrate with energy curable cyanate resin.
  32. Imai Tomoyasu,JPX ; Mukai Ryohei,JPX ; Soma Shinji,JPX ; Kasuga Tomoyuki,JPX ; Ninomiya Takanori,JPX, Grinding wheel.
  33. Wu, Tian-Yeu, Low magnetic chemical mechanical polishing conditioner.
  34. Carpentier Louis R. ; Daul Thomas J. ; Dimberg Alan P. ; Dobrzynski Steven J. ; Kent David A. ; Vangsness Jeffrey D. ; Whealon William J., Marked abrasive article.
  35. Lindholm Gene O. (River Falls WI) Follensbee Robert A. (Cottage Grove MN), Method for the polishing and finishing of optical lenses.
  36. Culler, Scott R.; McArdle, James L.; Nelson, Jeffrey W.; Wallace, John T., Method of making an abrasive agglomerate particle.
  37. Culler, Scott R.; McArdle, James L.; Nelson, Jeffrey W.; Wallace, John T., Method of making an agglomerate particle.
  38. McArdle, James L.; Nelson, Jeffrey W.; Culler, Scott R.; Wallace, John T., Method of making ceramic aggregate particles.
  39. Dudovicz, Walter, Polishing silicon wafers.
  40. Dudovicz, Walter, Polishing silicon wafers.
  41. Gorokhovsky, Vladimir, Protective coating for abrasive dental tools and burs.
  42. Okuda,Yuji; Jimbo,Naoyuki; Majima,Kazutaka; Tsuji,Masahiro; Takagi,Hideki; Ishikawa,Shigeharu; Yasuda,Hiroyuki, Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer.
  43. Ueoka Isao,JPX ; Sugawara Jun,JPX ; Mizoguchi Akira,JPX ; Oshita Hideo,JPX ; Yamanaka Masaaki,JPX ; Ogawa Hideki,JPX ; Urakawa Nobuo,JPX ; Yoshinaga Hirotoshi,JPX, Wire-saw and its manufacturing method.
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