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Package for semiconductor elements having thermal dissipation means 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
  • H01L-023/12
  • H05K-005/00
출원번호 US-0000596 (1993-01-05)
우선권정보 JP-0324796 (1990-11-27)
발명자 / 주소
  • Kurokawa Yasuhiro (Tokyo JPX)
출원인 / 주소
  • Nec Corporation (Tokyo JPX 03)
인용정보 피인용 횟수 : 61  인용 특허 : 0

초록 ▼

A package for one or a plurality of semiconductor elements comprises a package substrate, at least one semiconductor element mounted on the package substrate having an active layer in a surface which faces away from the package substrate, a thin pliable electrically insulating resin layer applied to

대표청구항 ▼

A package for at least one semiconductor element, comprising: a package substrate, said at least one semiconductor element being mounted on the package substrate and having a first surface bonded to said substrate and a second surface facing away from the package substrate, said second surface havin

이 특허를 인용한 특허 (61)

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