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Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-035/28
출원번호 US-0222150 (1994-04-01)
발명자 / 주소
  • Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (Mechanicsburg PA)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 71  인용 특허 : 0

초록 ▼

A configuration of solid state thermoelectric heat transfer or removal elements is provided to enhance the rate and amount of heat removal from electrical and electronic circuit devices. By rotating the thermoelectric heat transfer modules ninety degrees and by disposing them between the interdigita

대표청구항 ▼

An apparatus for cooling an electronic device, said apparatus comprising: a cold plate for contacting said electronic device, said cold plate having a plurality of flat-faced surface protrusions on the side thereof opposite the side for contacting said electronic device; a heat removal plate having

이 특허를 인용한 특허 (71)

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