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Two-phase component cooler 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/02
출원번호 US-0120153 (1993-09-10)
발명자 / 주소
  • Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL)
출원인 / 주소
  • Aavid Laboratories (S. Lancaster MA 02)
인용정보 피인용 횟수 : 38  인용 특허 : 23

초록

A two-phase liquid cooling system has a container structure that has at least one wall with sufficient flexibility that the wall expands as the coolant vapor expands thereby maintaining the internal container pressure substantially the same as the ambient environmental pressure. Coolant boiling over

대표청구항

Apparatus for cooling a heat dissipating component, the apparatus operating in an environment with an ambient pressure over a temperature range, the apparatus comprising: a hermetic enclosure having an interior with an internal pressure, a first thermally conductive wall in contact with the componen

이 특허에 인용된 특허 (23)

  1. Berenholz Jack (Lexington MA) Bowman John K. (Brighton MA), Air cooled heat exchanger for multi-chip assemblies.
  2. Novotny Shlomo D. (Wayland MA), Bellows heat pipe apparatus for cooling systems.
  3. Peterson George P. (College Station TX) Oktay Sevgin (Poughkeepsie NY), Bellows heat pipe for thermal control of electronic components.
  4. Lowenstein Andrew (Princeton NJ), Bladder thermosyphon.
  5. Okada Sadayuki (Katsuta JPX) Sonobe Hisao (Naka JPX), Constant pressure type ebullient cooling equipment.
  6. Hisano Katsumi (Kanagawa) Sasaki Tomiya (Kanagawa) Ishizuka Masaru (Kanagawa JPX), Cooling apparatus.
  7. Meyer ; IV George A. (Conestoga PA), Cooling plate with internal expandable heat pipe.
  8. Hamburgen William R. (Menlo Park CA), Evaporator having etched fiber nucleation sites and method of fabricating same.
  9. Jean Amigo (No. 18 ; Alley S ; Lane 19 ; Nu-Chung Rd. I-Lan City TWX), Flexible heat transfer device.
  10. Tousignant Lew A. (St. Paul MN), Flow-through heat transfer apparatus with movable thermal via.
  11. Parro James (R.D. 2 ; Sadler Rd. Skaneateles NY 13152), Heat exchange method using natural flow of heat exchange medium.
  12. Parro James (R.D. 2 ; Sadler Rd. Skaneateles NY 13152), Heat exchange method using natural flow of heat exchange medium.
  13. Steffen James E. (Woodbury MN) Grannis Vaughn B. (Inver Grove Heights MN) Schroder Frank S. (Afton MN), Heat exchanger.
  14. Koizumi Hisao (Zushi JPX), Heat transfer apparatus.
  15. Tousignant Lew A. (St. Paul MN), Heat transfer bag with thermal via.
  16. Svetlik Harvey E. (Dallas TX), Heat transfer device and method of manufacture.
  17. Tousignant Lew A. (St. Paul MN) Hoopman Timothy L. (River Falls WI) Thompson Kenneth C. (Stillwater MN), Jet impingment plate and method of making.
  18. Smolley Robert (Portuguese Bend CA), Liquid cooled high density packaging for high speed circuits.
  19. Huffman Fred N. (Sudbury MA), Pressure balanced heat pipe.
  20. Tousignant Lew A. (St. Paul MN) Maddox Douglas E. (Minneapolis MN) Headrick Larry G. (Oakdale MN), Semi-rigid heat transfer devices.
  21. Danielson Richard D. (Hastings MN) Hesselroth David A. (St. Paul Park MN) Stein ; Jr. Ralph J. (So. St. Paul MN), Thermal transfer bag.
  22. Eastman George Y. (Lancaster PA), Unfurlable heat pipe.
  23. Shanker Bangalore J. (Santa Clara CA) Belani Jagdish G. (Cupertino CA), Use of a heat pipe integrated with the IC package for improving thermal performance.

이 특허를 인용한 특허 (38)

  1. Bhatia Rakesh, Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station.
  2. Nagashima, James; Ward, Terence G., Apparatus and method for mounting a power module.
  3. Bhatia Rakesh, Apparatus for cooling electronic components within a computer system enclosure.
  4. Li,Jia Hao, Bubble cycling heat exchanger.
  5. Davis Dwight Maclaren ; Gossett Keith Alan, Composite heat sink.
  6. Hiroyuki Osakabe JP; Kiyoshi Kawaguchi JP; Masahiko Suzuki JP; Shigeru Kadota JP, Cooling apparatus boiling and condensing refrigerant.
  7. Terao Tadayoshi,JPX ; Kobayashi Kazuo,JPX ; Tanaka Hiroshi,JPX ; Kawaguchi Kiyoshi,JPX, Cooling apparatus for high-temperature medium by boiling and condensing refrigerant.
  8. Yamamoto Masaaki,JPX ; Niekawa Jun,JPX ; Ueki Tatuhiko,JPX ; Ikeda Masami,JPX ; Sasaki Ken,JPX, Cooling device with heat pipe.
  9. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
  10. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
  11. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
  12. Miyazaki, Ryuuji; Suzuki, Masumi; Hirano, Minoru, Cooling unit.
  13. Miyazaki,Ryuuji; Suzuki,Masumi; Hirano,Minoru, Cooling unit.
  14. Ohashi Shigeo,JPX ; Hatada Toshio,JPX ; Tanaka Shinji,JPX, Cooling unit for electronic equipment.
  15. Jia Hao Li TW, Cylindrical heat radiator.
  16. Rakesh Bhatia ; Karen Regis, Fan based heat exchanger.
  17. Bhatia Rakesh, Flat fan heat exchanger and use thereof in a computing device.
  18. Duval, Jean, Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device.
  19. Bhatia Rakesh, Heat exchanger for a portable computing device and docking station.
  20. Rakesh Bhatia, Heat exchanger for a portable computing device and docking station.
  21. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  22. Moroz,Paul; Hamelin,Thomas, Method and apparatus for efficient temperature control using a contact volume.
  23. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  24. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  25. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
  26. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
  27. Pang, Yi, Solar energy system.
  28. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  29. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  30. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.
  31. Lu Chun-Hsin,TWX, Thermal module.
  32. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  33. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  34. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  35. Gilley Michael D. ; Webb Ralph L., Thermoelectric refrigerator with evaporating/condensing heat exchanger.
  36. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  37. Siu, Wing Ming, Vapor augmented heatsink with multi-wick structure.
  38. Tuma, Phillip E., Variable position cooling apparatus.
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