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Method and apparatus for electrolytic plating 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-005/22
출원번호 US-0179520 (1994-01-10)
발명자 / 주소
  • Keeney Harold M. (Whitehall PA) Van Anglen Erik S. (Quakertown PA) Forand James L. (Whitehall PA)
출원인 / 주소
  • Electroplating Technologies, Inc. (Northampton PA 02)
인용정보 피인용 횟수 : 33  인용 특허 : 0

초록

A resilient dielectric wiper blade is mounted between a cathodic workpiece and an anode to wipe bubbles of hydrogen from the surface, sever dendritic material, if such is present as the coating thickens, and to remove a surface layer of partially depleted electrolytic solution and replace with fresh

대표청구항

A method of electrolytic coating comprising: (a) spacing an anode and a cathodic workpiece in close proximity to each other with a dielectric spacer material in the form of a series of thin substantially planar laterally extended contact blades mounted between said anode and cathodic workpiece withi

이 특허를 인용한 특허 (33)

  1. Forand James L., Anode basket for continuous electroplating.
  2. Uzoh Cyprian E., Apparatus and method to enhance hole fill in sub-micron plating.
  3. Patton, Evan E.; Fetters, Wayne, Apparatus for electroplating copper onto semiconductor wafer.
  4. Ralph A. Barrese ; Allen H. Hopkins ; John J. Konrad ; Donald L. Putman ; David A. Space, Jr., Apparatus for preventing drag-out.
  5. Evan E. Patton ; Wayne Fetters, Clamshell apparatus for electrochemically treating semiconductor wafers.
  6. Patton Evan E. ; Fetters Wayne, Clamshell apparatus for electrochemically treating semiconductor wafers.
  7. Zielke, Darrell W., Continuous plating system and method with mask registration.
  8. Zielke, Darrell W., Continuous plating system and method with mask registration.
  9. Zielke, Darrell W., Continuous plating system and method with mask registration.
  10. Zielke, Darrell W., Continuous plating system and method with mask registration.
  11. Evan E. Patton ; Wayne Fetters, Dual channel rotary union.
  12. Contolini Robert J. ; Reid Jonathan ; Patton Evan ; Feng Jingbin ; Taatjes Steve ; Dukovic John Owen, Electric potential shaping apparatus for holding a semiconductor wafer during electroplating.
  13. Contolini Robert J. ; Reid Jonathan ; Patton Evan ; Feng Jingbin ; Taatjes Steve ; Dukovic John Owen, Electric potential shaping method for electroplating.
  14. Reid Jonathan David ; Contolini Robert J. ; Dukovic John Owen, Electroplating anode including membrane partition system and method of preventing passivation of same.
  15. Broadbent Eliot K., Electroplating system with shields for varying thickness profile of deposited layer.
  16. Reid, Jonathan David; Contolini, Robert J.; Dukovic, John Owen, Membrane partition system for plating of wafers.
  17. Forand James L., Method and apparatus for electrochemical processing.
  18. Forand, James L.; Keeney, Harold M.; Van Anglen, Marilyn M.; Van Anglen, Erik S., Method and apparatus for electrochemical processing.
  19. Reid Jonathan David ; Taatjes Steve, Method and apparatus for treating surface including virtual anode.
  20. Mayer, Steven T.; Drewery, John S., Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation.
  21. Mayer,Steven T.; Reid,Jonathan D.; Rea,Mark L.; Emesh,Ismail T.; Meinhold,Henner W.; Drewery,John S., Method for planar electroplating.
  22. Patton Evan E. ; Fetters Wayne, Method of depositing metal layer.
  23. Reid, Jonathan; Varadarajan, Sesha; Emekli, Ugur, Methods and apparatus for depositing copper on tungsten.
  24. Reid, Jonathan; Varadarajan, Sesha; Emekli, Ugur, Methods and apparatus for depositing copper on tungsten.
  25. Mayer, Steven T.; Porter, David W., Modulated metal removal using localized wet etching.
  26. Reynolds H. Vincent, Plating cell with rotary wiper and megasonic transducer.
  27. Bredemus, Alex; Dalquist, Kurt; Gronlund, Patrick J.; Meyer, Ray; Deaner, Michael J., Reduced visibility insect screen.
  28. Pylkki,Russell John; Gronlund,Patrick Jerome; Williams,Rodney Kieth; Heikkila,Kurt E., Reduced visibility insect screen.
  29. Mayer, Steven T.; Drewery, John S.; Hill, Richard S.; Archer, Timothy M.; Kepten, Avishai, Selective electrochemical accelerator removal.
  30. Mayer, Steven T.; Drewery, John; Hill, Richard S.; Archer, Timothy; Kepten, Avishai, Selective electrochemical accelerator removal.
  31. Mayer, Steven T.; Stowell, Marshall R.; Drewery, John S.; Hill, Richard S.; Archer, Timothy M.; Kepten, Avishai, Selective electrochemical accelerator removal.
  32. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
  33. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
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