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Selective metallization process 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G03F-007/00
출원번호 US-0111640 (1993-08-25)
발명자 / 주소
  • Calabrese Gary S. (North Andover MA) Calvert Jeffrey M. (Burke VA) Chen Mu-San (Ellicott MD) Dressick Walter J. (Fort Washington MD) Dulcey Charles S. (Washington DC) Georger
  • Jr. Jacque H. (Holden
출원인 / 주소
  • Shipley Company, L.L.C. (Marlborough MA 02)
인용정보 피인용 횟수 : 30  인용 특허 : 0

초록

The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate re

대표청구항

A process for patterning a substrate in a selective pattern, said process comprising the steps of: (a) providing a prepared substrate having a resist coating with a relief image therein defining recesses which bare the substrate surface within said recesses and a film of ligating groups capable of b

이 특허를 인용한 특허 (30)

  1. Florio, Steven M.; Calabrese, Gary S.; Doubrava, Jeffrey, Capture compounds for electronic plating compositions and electronic packaging device manufacture.
  2. Thorn Charles Edwin ; Polakovic Frank ; Mosolf Charles A., Carbon containing composition for electroplating.
  3. Klueppel David Anton ; Markovich Voya R. ; Miller Thomas Richard ; Wells Timothy L. ; Wilson William Earl, Circuitized semiconductor structure and method for producing such.
  4. Narang Subhash, Conservatively printed displays and methods relating to same.
  5. Sharma Sunity ; Annavajjula Durga ; Bhasin Kuldip,INX ; Narang Subhash ; Nigam Asutosh, Deposition of substances on a surface.
  6. Hirai,Toshimitsu, Device, method of manufacturing the same, electro-optic device, and electronic equipment.
  7. Ganapathiraman,Ramanath; Krishnamoorthy,Ahila; Chanda,Kaushik; Murarka,Shyam P., Diffusion barriers comprising a self-assembled monolayer.
  8. Thorn Charles Edwin ; Polakovic Frank ; Mosolf Charles A., Direct metallization process.
  9. Thorn Charles Edwin ; Polakovic Frank ; Mosolf Charles A., Direct metallization process employing a cationic conditioner and a binder.
  10. Whiting, Gregory L.; Lujan, Rene A.; Chow, Eugene M.; Lu, JengPing, Fabrication method for microelectronic components and microchip inks used in electrostatic assembly.
  11. Marganski, Paul J.; Arno, Jose I.; Sturm, Edward A.; Zaleta, Kristy L., Fluid storage and dispensing vessels having colorimetrically verifiable leak-tightness and method of making same.
  12. Marganski, Paul J.; Arno, Jose I.; Sturm, Edward A.; Zaleta, Kristy L., Fluid storage and dispensing vessels having colorimetrically verifiable leak-tightness, and method of making same.
  13. Marganski,Paul J.; Arno,Jose I.; Sturm,Edward A.; Zaleta,Kristy L., Fluid storage and dispensing vessels having colorimetrically verifiable leak-tightness, and method of making same.
  14. Bandic,Zvonimir Z.; Knigge,Bernhard E.; Mate,Charles Mathew, High resolution patterning of surface energy utilizing high resolution monomolecular resist for fabrication of patterned media masters.
  15. Heiks, Noel; Sherrer, David, Hollow core coaxial cables and methods of making the same.
  16. Sherrer, David W.; Heiks, Noel, Hollow core coaxial cables and methods of making the same.
  17. Endo Masayuki,JPX ; Fukumoto Toru,JPX ; Ohsaki Hiromi,JPX, Manufacturing method and apparatus for semiconductor device.
  18. Cahalen John P. ; Sonnenberg Wade, Metallization process and component.
  19. Wakizaka, Yasuhiro; Ikeda, Koichi; Kanda, Naoki, Method for manufacturing multilayer circuit board and resin base material.
  20. Bamba, Akimitsu; Tsujimoto, Kazuhisa; Yamada, Hideyuki; Kugimiya, Kouichi, Method for producing a resin substrate having a metal film pattern formed thereon.
  21. Lowack,Klaus; Schmid,Günter; Sezi,Recai, Method for the metalization of an insulator and/or a dielectric.
  22. Martiska Thomas J. (Boylston MA) Darling Stephen (Worcester MA), Method of semiconductor fabrication utilizing rinse of polyimide film.
  23. Susan L. Brandow ; Jeffrey M. Calvert ; Walter M. Dressick ; Charles S. Dulcey, Methods and materials for selective modification of photopatterned polymer films.
  24. Liu Yanjing ; Schick Guy A., Patterned molecular self-assembly.
  25. Caspar,Jonathan V.; Andrews,Gerald D.; Meth,Jeffrey S.; Weed,Gregory C., Planarizing element for thermal printing of color filter.
  26. Thorn, Charles Edwin; Polakovic, Frank; Mosolf, Charles A., Printed wiring boards and methods for making them.
  27. Thorn,Charles Edwin; Polakovic,Frank; Mosolf,Charles A., Printed wiring boards and methods for making them.
  28. Stolk Richard D. ; Keyes William J., Resistive sheet patterning process and product thereof.
  29. Ramanath,Ganapathiraman; Ganesan,Pethuraja Gopal; Vijayamohanan,Kunjukrishna Pillai, Self-assembled sub-nanolayers as interfacial adhesion enhancers and diffusion barriers.
  30. Kanbe, Sadao; Seki, Shunichi; Fukushima, Hitoshi; Kiguchi, Hiroshi, Substrate for forming specific pattern, and method for manufacturing same.
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