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Integrated circuit package having a multilayered wiring portion formed on an insulating substrate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/48
  • H01L-029/44
출원번호 US-0368384 (1994-12-30)
우선권정보 JP-0137949 (1991-06-10)
발명자 / 주소
  • Imai Ryuji (Aichi JPX) Kanbe Rokuro (Aichi JPX)
출원인 / 주소
  • NGK Spark Plug Co., Ltd. (Aichi JPX 03)
인용정보 피인용 횟수 : 75  인용 특허 : 0

초록 ▼

An integrated circuit package in which three conductor columns for connecting an insulating substrate and an integrated circuit are connected in parallel for use as I/O vias. Thereby, the conductor columns in a multilayer wiring portion between an integrated circuit and an insulating substrate is pr

대표청구항 ▼

An integrated circuit package comprising: a multilayer wiring portion having a first surface on which at least one integrated circuit is mounted and a second surface opposite the first surface, the multilayer wiring portion having a plurality of laminated wiring layers, said plurality of wiring laye

이 특허를 인용한 특허 (75)

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