이 특허를 인용한 특허 (242)

1. Oohira, Kouya; Nakanishi, Masaki; Taguchi, Yosuke; Nakao, Setsuo, Amorphous carbon film and method for forming same.

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2. Mancini, David P.; Smith, Steven M.; Resnick, Douglas J., Amorphous carbon layer for improved adhesion of photoresist and method of fabrication.

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3. Antonelli, George Andrew; Sriram, Mandyam; Rangarajan, Vishwanathan; Subramonium, Pramod, Apparatus including a plasma chamber and controller including instructions for forming a boron nitride layer.

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4. Petrmichl, Rudolph Hugo; Reis, Fabio, Buffing diamond-like carbon (DLC) to improve scratch resistance.

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5. Teer, Dennis Gerald; Camino, Didier; Jones, Andrew H S, Carbon coatings, method and apparatus for applying them, and articles bearing such coatings.

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6. Ji, Chunhai; Reddy, Sirish; Wang, Tuo; Sriram, Mandyam, Carbon deposition-etch-ash gap fill process.

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7. Murphy, Nestor P.; Frati, Maximo; Petrmichl, Rudolph Hugo; Wang, Jiangping; Muller, Jens-Peter; Lage, Herbert, Coated article having diamond-like carbon (DLC) and protective film thereon.

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8. Veerasamy, Vijayen S., Coated article with DLC inclusive layer(s) having increased hydrogen content at surface area.

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9. Hodes, Daniel, Combinatorial synthesis of diamond.

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10. Hodes, Daniel, Combinatorial synthesis of the diamond unit cell.

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11. Schricker, April D.; Clark, Mark H.; Fu, Andy; Xu, Huiwen, Damascene integration methods for graphitic films in three-dimensional memories and memories formed therefrom.

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12. Antonelli, George Andrew; Sriram, Mandyam; Rangarajan, Vishwanathan; Subramonium, Pramod, Depositing conformal boron nitride film by CVD without plasma.

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13. Chaffin,John Harvie, Diamond films and methods of making diamond films.

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14. Yu, Yongsik; Subramonium, Pramod; Fang, Zhiyuan; Henri, Jon; Apen, Elizabeth; Vitkavage, Dan, Diffusion barrier and etch stop films.

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15. Fischer, Mark; Russell, Stephen; Manning, H. Montgomery, Efficient pitch multiplication process.

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16. Fischer, Mark; Russell, Stephen; Manning, H. Montgomery, Efficient pitch multiplication process.

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17. Fischer, Mark; Russell, Stephen; Manning, H. Montgomery, Efficient pitch multiplication process.

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18. Fischer, Mark; Russell, Stephen; Manning, H.Montgomery, Efficient pitch multiplication process.

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19. Thomsen, Scott V.; Andreasen, Michael, First surface mirror with DLC coating.

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20. Mallick, Abhijit Basu; Ingle, Nitin K., Flowable carbon for semiconductor processing.

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21. Jindai, Kazuhiro; Yokoi, Hideto, Foreign matter or abnormal unsmoothness inspection apparatus and foreign matter or abnormal unsmoothness inspection method.

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22. Jindai, Kazuhiro; Yokoi, Hideto, Foreign matter or abnormal unsmoothness inspection apparatus and foreign matter or abnormal unsmoothness inspection method.

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23. Krisko,Annette J.; Hartig,Klaus, Graded photocatalytic coatings.

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24. Kasra Khazeni ; Eugene Tzou ; Zhengquan Tan, HDP-CVD deposition of low dielectric constant amorphous carbon film.

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25. Wu, Qingguo; Sims, James S.; Sriram, Mandyam; Varadarajan, Seshasayee; Fu, Haiying; Subramonium, Pramod; Henri, Jon; Reddy, Sirish, High compressive stress carbon liners for MOS devices.

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26. Reddy, Sirish K.; Ji, Chunhai; Chen, Xinyi; Subramonium, Pramod, High selectivity and low stress carbon hardmask by pulsed low frequency RF power.

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27. Veerasamy Vijayen S., Highly tetrahedral amorphous carbon coating on glass.

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28. Veerasamy Vijayen S., Highly tetrahedral amorphous carbon coating on glass.

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29. Veerasamy, Vijayen S., Highly tetrahedral amorphous carbon coating on glass.

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30. Veerasamy, Vijayen; Weiler, Manfred; Li, Eric, Highly tetrahedral amorphous carbon coatings and systems and methods for their production.

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31. Veerasamy,Vijayen; Weiler,Manfred; Li,Eric, Highly tetrahedral amorphous carbon coatings and systems and methods for their production.

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32. Veerasamy, Vijayen S., Hydrophilic DLC on substrate with UV exposure.

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33. Veerasamy, Vijayen S., Hydrophilic DLC on substrate with UV exposure.

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34. Veerasamy,Vijayen S., Hydrophilic DLC on substrate with UV exposure.

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35. Veerasamy Vijayen S. ; Petrmichl Rudolph Hugo ; Thomsen Scott V., Hydrophobic coating including DLC and/or FAS on substrate.

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36. Vijayen S. Veerasamy, Hydrophobic coating including DLC on substrate.

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37. Vijayen S. Veerasamy, Hydrophobic coating including DLC on substrate.

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38. Shamma, Nader; van Schravendijk, Bart J.; Reddy, Sirish K.; Ji, Chunhai, Image reversal with AHM gap fill for multiple patterning.

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39. Wise, Richard S.; Deshpande, Sadanand V.; Yan, Wendy; Allen, Soctt D.; Mahorowala, Arpan P., In-situ plasma etch for TERA hard mask materials.

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40. Tran, Luan C.; Lee, John; Liu, Zengtao "Tony"; Freeman, Eric; Nielsen, Russell, Integrated circuit fabrication.

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41. Tran, Luan C.; Lee, John; Liu, Zengtao “Tony” ; Freeman, Eric; Nielsen, Russell, Integrated circuit fabrication.

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42. Tran, Luan C.; Lee, John; Liu, Zengtao “Tony”; Freeman, Eric; Nielsen, Russell, Integrated circuit fabrication.

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43. Tran, Luan C.; Lee, John; Liu, Zengtao “Tony”; Freeman, Eric; Nielsen, Russell, Integrated circuit fabrication.

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44. Tran, Luan C.; Lee, John; Liu, Zengtao “Tony”; Freeman, Eric; Nielsen, Russell, Integrated circuit fabrication.

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45. Tran, Luan C.; Lee, John; Liu, Zengtao; Freeman, Eric; Nielsen, Russell, Integrated circuit fabrication.

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46. Tran, Luan C.; Lee, John; Liu, Zengtao; Freeman, Eric; Nielsen, Russell, Integrated circuit fabrication.

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47. Tran, Luan C.; Lee, John; Liu, Zengtao; Freeman, Eric; Nielsen, Russell, Integrated circuit fabrication.

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48. Tran, Luan; Rericha, William T.; Lee, John; Alapati, Ramakanth; Honarkhah, Sheron; Meng, Shuang; Sharma, Puneet; Bai, Jingyi; Yin, Zhiping; Morgan, Paul; Abatchev, Mirzafer K.; Sandhu, Gurtej S.; Durcan, D. Mark, Integrated circuit having pitch reduced patterns relative to photoithography features.

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49. Abatchev, Mirzafer; Sandhu, Gurtej, Integrated circuit structure having arrays of small, closely spaced features.

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50. Ohmi, Tadahiro, Interlayer insulating film, interconnection structure, and methods of manufacturing the same.

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51. Janai Meir,ILX ; Cassuto Yoram,ILX ; Silverstein Michael Stephen,ILX ; Zehavi Sharon, Laser ablateable material.

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52. Tang, Qiang; Ghodsi, Ramin, Layout for high density conductive interconnects.

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53. Yamazaki,Shunpei; Maruyama,Junya; Ogura,Keiichi; Takayama,Toru, Light emitting device and electronic equipment.

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54. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl ; Scott V. Thomsen, Low-E coating system including protective DLC.

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55. Krisko, Annette J.; Bond, Bob; Stanek, Roger; Pfaff, Gary; Hartig, Klaus, Low-emissivity, soil-resistant coating for glass surfaces.

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56. Myli, Kari B.; Krisko, Annette J.; German, John R.; Hartig, Klaus, Low-maintenance coating technology.

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57. Krisko, Annette J.; Myli, Kari B.; Pfaff, Gary L.; Brownlee, James E., Low-maintenance coatings.

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58. Krisko, Annette J.; Myli, Kari B.; Pfaff, Gary L.; Brownlee, James E., Low-maintenance coatings.

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59. Krisko, Annette J.; Myli, Kari; Pfaff, Gary L.; Brownlee, James, Low-maintenance coatings.

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60. Krisko, Annette J.; Myli, Kari; Pfaff, Gary L.; Brownlee, James, Low-maintenance coatings.

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61. Myli, Kari B.; Krisko, Annette J.; Brownlee, James E.; Pfaff, Gary L., Low-maintenance coatings, and methods for producing low-maintenance coatings.

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62. Abatchev, Mirzafer K.; Sandhu, Gurtej, Mask material conversion.

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63. Abatchev, Mirzafer K.; Sandhu, Gurtej, Mask material conversion.

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64. Juengling, Werner, Masking process for simultaneously patterning separate regions.

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65. Sandhu,Gurtej S.; Yin,Zhiping; Li,Weimin, Masking structure having multiple layers including amorphous carbon layer.

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66. Sandhu,Gurtej S.; Yin,Zhiping; Li,Weimin, Masking structure having multiple layers including an amorphous carbon layer.

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67. Sandhu, Gurtej S., Masking techniques and contact imprint reticles for dense semiconductor fabrication.

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68. Sandhu, Gurtej S., Masking techniques and contact imprint reticles for dense semiconductor fabrication.

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69. Sandhu, Gurtej S., Masking techniques and contact imprint reticles for dense semiconductor fabrication.

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70. Sandhu, Gurtej S.; Niroomand, Ardavan, Masking techniques and templates for dense semiconductor fabrication.

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71. Juengling, Werner, Memory device comprising an array portion and a logic portion.

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72. Juengling, Werner, Memory device comprising an array portion and a logic portion.

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73. Juengling, Werner, Method and algorithm for random half pitched interconnect layout with constant spacing.

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74. Juengling, Werner, Method and algorithm for random half pitched interconnect layout with constant spacing.

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75. Juengling, Werner, Method and algorithm for random half pitched interconnect layout with constant spacing.

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76. Grill Alfred ; Jahnes Christopher Vincent ; Patel Vishnubhai Vitthalbhai ; Saenger Katherine Lynn, Method and material for integration of fuorine-containing low-k dielectrics.

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77. Wells, David H., Method for adjusting feature size and position.

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78. Fairbairn, Kevin; Rice, Michael; Weidman, Timothy; Ngai, Christopher S; Latchford, Ian Scot; Bencher, Christopher Dennis; Wang, Yuxiang May, Method for depositing an amorphous carbon layer.

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79. Graff, Wesley P., Method for etching organic hardmasks.

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80. Shamma, Nader; van Schravendijk, Bart; Reddy, Sirish; Ji, Chunhai, Method for forming a mask by etching conformal film on patterned ashable hardmask.

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81. Zhou, Baosuo; Sandhu, Gurtej S.; Niroomand, Ardavan, Method for forming high density patterns.

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82. Zhou, Baosuo; Sandhu, Gurtej S.; Niroomand, Ardavan, Method for forming high density patterns.

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83. Zhou, Baosuo; Sandhu, Gurtej S.; Niroomand, Ardavan, Method for forming high density patterns.

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84. Shinriki, Hiroshi; Namba, Kunitoshi; Jeong, Daekyun, Method for forming metal film by ALD using beta-diketone metal complex.

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85. Smith, Mike, Method for forming transistor with high breakdown voltage using pitch multiplication technique.

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86. Kharas, Boris, Method for improving refractive index control in PECVD deposited a-SiNfilms.

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87. Abatchev, Mirzafer K.; Sandhu, Gurtej; Tran, Luan; Rericha, William T.; Durcan, D. Mark, Method for integrated circuit fabrication using pitch multiplication.

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88. Abatchev, Mirzafer K.; Sandhu, Gurtej; Tran, Luan; Rericha, William T.; Durcan, D. Mark, Method for integrated circuit fabrication using pitch multiplication.

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89. Abatchev, Mirzafer K.; Sandhu, Gurtej; Tran, Luan; Rericha, William T.; Durcan, D. Mark, Method for integrated circuit fabrication using pitch multiplication.

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90. Abatchev, Mirzafer K; Sandhu, Gurtej; Tran, Luan; Rericha, William T; Durcan, D. Mark, Method for integrated circuit fabrication using pitch multiplication.

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91. Wu, Qingguo; Sims, James S.; Sriram, Mandyam; Varadarajan, Seshasayee; Singhal, Akhil, Method for making high stress boron-doped carbon films.

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92. Sant, Sanket; Sandhu, Gurtej; Rueger, Neal R., Method for positioning spacers for pitch multiplication.

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93. Sant, Sanket; Sandhu, Gurtej; Rueger, Neal R., Method for positioning spacers in pitch multiplication.

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94. Sant, Sanket; Sandhu, Gurtej; Rueger, Neal R., Method for positioning spacers in pitch multiplication.

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95. Sant, Sanket; Sandhu, Gurtej; Rueger, Neal R., Method for positioning spacers in pitch multiplication.

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96. Hsu, Gishun; Merrill, Charles; Stoddard, Scott, Method for purifying acetylene gas for use in semiconductor processes.

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97. Hsu, Gishun; Merrill, Charles; Stoddard, Scott, Method for purifying acetylene gas for use in semiconductor processes.

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98. Zhu, Hongbin, Method for selectively modifying spacing between pitch multiplied structures.

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99. Zhu, Hongbin, Method for selectively modifying spacing between pitch multiplied structures.

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100. Zhu, Hongbin, Method for selectively modifying spacing between pitch multiplied structures.

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101. Fairbairn, Kevin; Rice, Michael; Weidman, Timothy; Ngai, Christopher S; Latchford, Ian Scot; Bencher, Christopher Dennis; Wang, Yuxiang May, Method of depositing an amorphous carbon layer.

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102. Fairbairn,Kevin; Rice,Michael; Weidman,Timothy; Ngai,Christopher S; Latchford,Ian Scot; Bencher,Christopher Dennis; Wang,Yuxiang May, Method of depositing an amorphous carbon layer.

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103. Fairbairn,Kevin; Rice,Michael; Weidman,Timothy; Ngai,Christopher S; Latchford,Ian Scot; Bencher,Christopher Dennis; Wang,Yuxiang May, Method of depositing an amorphous carbon layer.

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104. Matsuki,Nobuo; Morisada,Yoshinori; Umemoto,Seijiro; Lee,Jea Sik, Method of forming a carbon polymer film using plasma CVD.

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105. Matsuki,Nobuo; Morisada,Yoshinori; Umemoto,Seijiro; Lee,Jea Sik, Method of forming a carbon polymer film using plasma CVD.

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106. Morisada, Yoshinori; Matsuki, Nobuo; Goundar, Kamal Kishore, Method of forming a carbon polymer film using plasma CVD.

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107. Goundar, Kamal Kishore, Method of forming a high transparent carbon film.

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108. Morisada,Yoshinori; Goundar,Kamal Kishore; Yamaguchi,Masashi; Matsuki,Nobuo; Na,Kyu Tae; Baek,Eun Kyung, Method of forming carbon polymer film using plasma CVD.

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109. Tran, Luan C., Method of forming isolated features using pitch multiplication.

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110. Tran, Luan C., Method of forming pitch multipled contacts.

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111. Tran, Luan C., Method of forming pitch multiplied contacts.

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112. Tran, Luan C., Method of forming pitch multiplied contacts.

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113. Veerasamy, Vijayen S.; Petrmichl, Rudolph Hugo, Method of making a coated article including DLC and FAS.

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114. Veerasamy, Vijayen S.; Petrmichl, Rudolph Hugo; Thomsen, Scott V., Method of making coated article including DLC inclusive layer over low-E coating.

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115. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl ; Scott V. Thomsen, Method of making coated article including diamond-like carbon (DLC) and FAS.

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116. Veerasamy, Vijayen S., Method of making coated article including layer(s) of diamond-like carbon which may be hydrophobic.

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117. Veerasamy, Vijayen S., Method of making coating article including carbon coating on glass.

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118. Veerasamy,Vijayen S., Method of making heat treatable coated article with diamond-like carbon (DLC) coating.

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119. Veerasamy,Vijayen S., Method of making heat treatable coated article with diamond-like carbon (DLC) inclusive layer.

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120. Veerasamy, Vijayen S., Method of making heat treatable coated article with protective layer.

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121. Murphy, Nestor P.; Frati, Maximo; Petrmichl, Rudolph Hugo; Wang, Jiangping; Muller, Jens-Peter; Lage, Herbert, Method of making heat treated coated article having carbon layer and utilizing removable zinc oxide inclusive protective film.

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122. Veerasamy, Vijayen S., Method of making heat treated coated article using TCO and removable protective film.

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123. Krasnov, Alexey; Petrmichl, Rudolph Hugo; Wang, Jiangping; Murphy, Nestor P.; Frati, Maximo; Nunez-Regueiro, Jose, Method of making heat treated coated article using diamond-like carbon (DLC) coating and protective film.

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124. Murphy, Nestor P.; Frati, Maximo; Petrmichl, Rudolph Hugo; Wang, Jiangping; Muller, Jens-Peter; Lage, Herbert, Method of making heat treated coated article using diamond-like carbon (DLC) coating and protective film.

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125. Murphy, Nestor P.; Frati, Maxio; Petrmichl, Rudolph H.; Wang, Jiangping; Muller, Jens-Peter; Lage, Herbert, Method of making heat treated coated article using diamond-like carbon (DLC) coating and protective film.

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126. Petrmichl, Rudolph Hugo; Wang, Jiangping; Murphy, Nestor P.; Frati, Maximo; Nunez-Regueiro, Jose, Method of making heat treated coated article using diamond-like carbon (DLC) coating and protective film.

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127. Petrmichl, Rudolph Hugo; Wang, Jiangping; Murphy, Nestor P.; Frati, Maximo; Nunez-Regueiro, Jose, Method of making heat treated coated article using diamond-like carbon (DLC) coating and protective film.

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128. Petrmichl, Rudolph Hugo; Wang, Jiangping; Murphy, Nestor P.; Frati, Maximo; Nunez-Regueiro, Jose, Method of making heat treated coated article using diamond-like carbon (DLC) coating and protective film.

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129. Sol, Jean-Marc, Method of making heat treated coated article using diamond-like carbon (DLC) coating and protective film including removal of protective film via blasting.

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130. Vijayen S. Veerasamy, Method of making hydrophobic coated article.

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131. Veerasamy, Vijayen S., Method of making window unit including diamond-like carbon (DLC) coating.

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132. Veerasamy, Vijayen S., Method of making window unit including diamond-like carbon (DLC) coating.

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133. Veerasamy, Vijayen S., Method of making window unit including diamond-like carbon (DLC) coating.

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134. Neuberger Wolfgang,MYX ; Dowling Denis,IEX ; Donnely Kevin,IEX ; O'Brien Terence,IEX ; Kelly Thomas,IEX, Method of producing diamond-like-carbon coatings.

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135. Vijayen, Veerasamy; Weiler, Manfred; Li, Eric, Method of producing recording media having protective overcoats of highly tetrahedral amorphous carbon.

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136. Sandhu, Gurtej S.; Chance, Randal W.; Rericha, William T., Method to align mask patterns.

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137. Sandhu, Gurtej S.; Chance, Randal W.; Rericha, William T., Method to align mask patterns.

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138. Sandhu, Gurtej S; Chance, Randal W; Rericha, William T, Method to align mask patterns.

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139. Subramonium, Pramod; Bingham, Aaron; Thomas, Tim; Henri, Jon; Farhner, Greg, Methods and apparatus for plasma-based deposition.

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140. Krisko,Annette J.; Bond,Bob; Stanek,Roger; Pfaff,Gary; Hartig,Klaus, Methods and apparatuses for depositing film on both sides of a pane.

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141. Myli, Kari; Pfaff, Gary; Brownlee, James; German, John; Krisko, Annette; Hartig, Klaus, Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films.

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142. Abatchev, Mirzafer; Sandhu, Gurtej, Methods for forming arrays of small, closely spaced features.

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143. Wells, David H., Methods for forming arrays of small, closely spaced features.

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144. Wells, David H., Methods for forming arrays of small, closely spaced features.

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145. Wells, David H., Methods for forming arrays of small, closely spaced features.

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146. Wells, David H., Methods for forming arrays of small, closely spaced features.

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147. Fox, Keith; Hausmann, Dennis, Methods for forming conductive carbon films by PECVD.

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148. Abatchev, Mirzafer; Wells, David; Zhou, Baosuo; Subramanian, Krupakar M., Methods for integrated circuit fabrication with protective coating for planarization.

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149. Abatchev, Mirzafer; Wells, David; Zhou, Baosuo; Subramanian, Krupakar Murali, Methods for integrated circuit fabrication with protective coating for planarization.

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150. Abatchev, Mirzafer; Wells, David; Zhou, Baosuo; Subramanian, Krupakar Murali, Methods for integrated circuit fabrication with protective coating for planarization.

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151. Tran, Luan C., Methods for isolating portions of a loop of pitch-multiplied material and related structures.

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152. Tran, Luan C., Methods for isolating portions of a loop of pitch-multiplied material and related structures.

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153. Tran, Luan C., Methods for isolating portions of a loop of pitch-multiplied material and related structures.

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154. Tran, Luan C., Methods for isolating portions of a loop of pitch-multiplied material and related structures.

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155. Tran, Luan C., Methods for isolating portions of a loop of pitch-multiplied material and related structures.

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156. Newman, Arnold L.; Hodes, Daniel, Methods for producing diamond mass and apparatus therefor.

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157. Subramonium, Pramod; Fang, Zhiyuan; Henri, Jon, Methods of depositing highly selective transparent ashable hardmask films.

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158. Subramonium, Pramod; Fang, Zhiyuan; Hancock, Shawn; Pierce, Mike; Henri, Jon, Methods of depositing smooth and conformal ashable hard mask films.

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159. Subramonium, Pramod; Fang, Zhiyuan; Hancock, Shawn; Pierce, Mike; Henri, Jon, Methods of depositing smooth and conformal ashable hard mask films.

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160. Subramonium, Pramod; Yu, Yongsik; Fang, Zhiyuan; Henri, Jon, Methods of depositing stable and hermetic ashable hardmask films.

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161. DeVilliers, Anton, Methods of forming a masking pattern for integrated circuits.

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162. DeVilliers, Anton, Methods of forming a masking pattern for integrated circuits.

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163. Juengling, Werner; Lane, Richard, Methods of forming an integrated circuit with self-aligned trench formation.

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164. Newman, Arnold L.; Hodes, Daniel, Methods of producing heterodiamond and apparatus therefor.

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165. Bai, Jingyi; Sandhu, Gurtej S; Meng, Shuang, Multiple deposition for integration of spacers in pitch multiplication process.

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166. Bai, Jingyi; Sandhu, Gurtej S; Meng, Shuang, Multiple deposition for integration of spacers in pitch multiplication process.

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167. Sant, Sanket; Sandhu, Gurtej S.; Rueger, Neal R., Multiple spacer steps for pitch multiplication.

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168. Sant, Sanket; Sandhu, Gurtej; Rueger, Neal R., Multiple spacer steps for pitch multiplication.

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169. Krisko, Annette J.; Myli, Kari B.; Pfaff, Gary L.; Brownlee, James, Opposed functional coatings having comparable single surface reflectances.

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170. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Optical uses diamondoid-containing materials.

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171. Shamma, Nader; Mountsier, Thomas; Schlosser, Don, PECVD films for EUV lithography.

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