이 특허를 인용한 특허 (66)

1. Farnworth,Warren M.; Grief,Malcolm; Sandhu,Gurtej S., Apparatuses configured to engage a conductive pad.

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2. Breed, David S.; Du Vall, Wilbur E.; Johnson, Wendell C., Automotive electronic safety network.

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3. Breed, David S.; DuVall, Wilbur E.; Johnson, Wendell C.; Sanders, William Thomas, Automotive electronic safety network.

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4. Caggiano Raymond J. ; Colpo Charles ; Hatley Jeffrey A. ; Soroka W. Peter ; Watts Rondell K., Circuit trace probe and method.

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5. Raymond J. Caggiano ; Charles Colpo ; Jeffrey A. Hatley ; W. Peter Soroka ; Rondell K. Watts, Circuit trace probe and method.

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6. Akram Salman, Electrically conductive projections and semiconductor processing method of forming same.

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7. Salman Akram, Electrically conductive projections having conductive coverings.

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8. Akram Salman, Electrically conductive projections of the same material as their substrate.

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9. Bahn, Robert J.; Blum, Fred A.; Neuhaus, Herbert J.; Zou, Bin, Electroless process for the preparation of particle enhanced electric contact surfaces.

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10. Farnworth,Warren M.; Grief,Malcolm, Engagement Probes.

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11. Farnworth, Warren M.; Grief, Malcolm; Sandhu, Gurtej S., Engagement probe and apparatuses configured to engage a conductive pad.

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12. Farnworth,Warren M.; Grief,Malcolm; Sandhu,Gurtej S., Engagement probe having a grouping of projecting apexes for engaging a conductive pad.

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13. Warren M. Farnworth ; Malcolm Grief ; Gurtej S. Sandhu, Engagement probes.

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14. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.

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15. Behfar Alex A. ; McHerron Dale Curtis ; Perry Charles Hampton, High density Z-axis connector.

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16. Akram, Salman, High density stackable and flexible substrate-based devices and systems and methods of fabricating.

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17. Salman Akram, High density stackable and flexible substrate-based devices and systems and methods of fabricating.

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18. Akram, Salman, High density stackable and flexible substrate-based semiconductor device modules.

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19. Haba, Belgacem; Chau, Ellis; Zohni, Wael; Damberg, Philip; Crisp, Richard Dewitt, Impedance controlled packages with metal sheet or 2-layer RDL.

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20. Haba, Belgacem; Chau, Ellis; Zohni, Wael; Damberg, Philip; Crisp, Richard Dewitt, Impedance controlled packages with metal sheet or 2-layer rdl.

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21. Haba, Belgacem; Chau, Ellis; Zohni, Wael; Damberg, Philip; Crisp, Richard Dewitt, Impedence controlled packages with metal sheet or 2-layer RDL.

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22. Breed, David S.; DuVall, Wilbur E.; Johnson, Wendell C.; Sanders, William Thomas, Integrated occupant protection system.

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23. Khandros Igor Y. ; Mathieu Gaetan L., Interconnection substrates with resilient contact structures on both sides.

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24. Fisher,Rayette Ann; Burdick, Jr.,William Edward; Rose,James Wilson, Large area transducer array.

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25. Fasano, Benjamin V.; Courtney, Mark G., Method and apparatus for interim assembly electrical testing of circuit boards.

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26. Farnworth, Warren M.; Grief, Malcolm; Sandhu, Gurtej S., Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability.

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27. Farnworth,Warren M.; Grief,Malcolm; Sandhu,Gurtej S., Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability.

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28. Farnworth Warren M., Method for testing semiconductor packages using oxide penetrating test contacts.

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29. Farnworth Warren M., Method for testing semiconductor packages using oxide penetrating test contacts.

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30. Farnworth Warren M. ; Grief Malcolm ; Sandhu Gurtej S., Method of engaging electrically conductive test pads on a semiconductor substrate.

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31. Akram Salman, Method of forming a structure upon a semiconductive substrate.

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32. Farnworth, Warren M.; Grief, Malcolm; Sandhu, Gurtej S., Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate.

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33. Eldridge,Benjamin Niles; Grube,Gary William; Khandros,Igor Yan; Mathieu,Gaetan L., Method of making a contact structure with a distinctly formed tip structure.

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34. Farnworth, Warren M.; Grief, Malcolm; Sandhu, Gurtej S., Methods of engaging electrically conductive pads on a semiconductor substrate.

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35. Farnworth, Warren M.; Grief, Malcolm; Sandhu, Gurtej S., Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes.

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36. Fisher, Rayette Ann; Burdick, Jr., William Edward; Rose, James Wilson, Methods of fabricating a large area transducer array.

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37. Farnworth Warren M. ; Grief Malcolm ; Sandhu Gurtej S., Methods of forming an apparatus for engaging electrically conductive pads and method of forming a removable electrical interconnect apparatus.

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38. Farnworth, Warren M.; Grief, Malcolm; Sandhu, Gurtej S., Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate.

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39. Warren M. Farnworth ; Malcolm Grief ; Gurtej S. Sandhu, Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate.

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40. Haba, Belgacem; Marcucci, Brian, Microelectronic assembly with impedance controlled wirebond and conductive reference element.

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41. Haba, Belgacem; Marcucci, Brian, Microelectronic assembly with impedance controlled wirebond and reference wirebond.

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42. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure.

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43. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure and method of making same.

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44. Watanabe, Shinji; Mikami, Nobuhiro; Sato, Junya; Fujii, Kenichiro; Abe, Katsumi; Sawada, Atsumasa, Mount board and electronic device.

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45. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly.

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46. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.

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47. Eldridge, Benjamin Niles; Grube, Gary William; Khandros, Igor Yan; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.

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48. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Probe card assembly and kit, and methods of using same.

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49. Eldridge, Benjamin N.; Grube, Gary W.; Mathieu, Gaetan L., Probe card assembly for contacting a device with raised contact elements.

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50. Warren M. Farnworth ; Malcolm Grief ; Gurtej S. Sandhu, Removable electrical interconnect apparatuses including an engagement proble.

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51. Lykins ; II James L., Rough electrical contact surface.

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52. Fukatsu, Kenta; Saito, Yasuhito; Arakawa, Masayuki; Iguchi, Tomohiro; Watanabe, Naotake; Fukuchi, Yoshitoshi; Komatsu, Tetsuro, Semiconductor device having a plurality of stacked wiring boards.

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53. Hong,Jae young, Semiconductor package using flexible film and method of manufacturing the same.

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54. Hong,Jae young, Semiconductor package using flexible film and method of manufacturing the same.

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55. Breed, David S., Single side curtain airbag for vehicles.

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56. Haba, Belgacem, Stacked multi-die packages with impedance control.

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57. Knapp, James H.; St. Germain, Stephen C., Structure and method of forming a multiple leadframe semiconductor device.

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58. Haba, Belgacem; Marcucci, Brian, TSOP with impedance control.

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59. David R. Hembree ; Warren M. Farnworth ; Alan G. Wood ; Salman Akram, Temporary semiconductor package having dense array external contacts.

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60. Hembree David R. ; Farnworth Warren M ; Wood Alan G. ; Akram Salman, Temporary semiconductor package having dense array external contacts.

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61. Ortiz,Alfred E.; Collins,Joseph, Test system for device and method thereof.

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62. Schmokel, Hartmut, Tester apparatus for electronic components.

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63. Breed David S. ; Duvall Wilbur E. ; Johnson Wendell C., Vehicle electrical system.

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64. Breed, David S., Vehicle software upgrade techniques.

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65. Breed, David S., Vehicle software upgrade techniques.

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66. Breed, David S., Vehicle software upgrade techniques.

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