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Refrigeration system and method for very large scale integrated circuits

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-041/04
출원번호 US-0273378 (1994-07-01)
발명자 / 주소
  • Cowans Kenneth W. (Fullerton CA)
출원인 / 주소
  • Acurex Corporation (Anaheim CA 02)
인용정보 피인용 횟수 : 82  인용 특허 : 0

초록

To dissipate heat generated internally in integrated circuit units, both an active refrigeration system and a passive refrigeration system are coupled to a heat sink that engages the integrated circuit unit. A cold probe insertable into the heat sink has an interior heat exchanger and receives high

대표청구항

A cooling system for subcooling an electronic circuit unit having at least one active component which generates substantial thermal energy during operation, comprising: a cooler system spaced apart from with the component to be cooled, the cooler system including means for generating a high pressure

이 특허를 인용한 특허 (82)

  1. Doll, Wade J.; Kelley, Douglas P., Air conditioning systems for computer systems and associated methods.
  2. Helbig, Joerg Burkhard; Gizzi, Steven Thomas, Apparatus and methods for cooling rejected heat from server racks.
  3. Seidler, Siegfried; Angelis, Walter G.; Laufer, Wolfgang; Lulic, Francisco Rojo, Apparatus including a heat exchanger and equalizing vessel.
  4. Eriksson Mats,SEX, Arrangement and method for the remote cooling of radio transceivers.
  5. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution.
  6. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having very agile wafer temperature control.
  7. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Capacitively coupled plasma reactor having very agile wafer temperature control.
  8. Gwin,Paul J., Capillary tube bubble containment in liquid cooling systems.
  9. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Closed-loop microchannel cooling system.
  10. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration systems.
  11. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Combined air and refrigeration cooling for computer systems.
  12. Manole,Dan M.; Coffey,Donald L.; Moore,Michael J., Compact refrigeration system for providing multiple levels of cooling.
  13. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  14. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  15. Webb Matthew L., Computer having a heat sink structure incorporated therein.
  16. Webb Matthew L., Computer having a heat sink structure incorporated therein.
  17. Santiago,Juan G.; Zeng,Shulin, Control of electrolysis gases in electroosmotic pump systems.
  18. Uomori, Yasuharu; Takahashi, Masanori; Ito, Satoshi, Cooler for electronic device.
  19. Hiroyuki Osakabe JP; Kiyoshi Kawaguchi JP; Masahiko Suzuki JP; Shigeru Kadota JP, Cooling apparatus boiling and condensing refrigerant.
  20. Kadota Shigeru,JPX ; Furukawa Takashi,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Yamada Kenji,JPX, Cooling apparatus using boiling and condensing refrigerant.
  21. Chandrakant D. Patel, Cooling arrangement for high performance electronic components.
  22. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cooling computer systems.
  23. Borror, Steven A.; DiPaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  24. Borror, Steven A.; DiPaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  25. Borror, Steven A.; Dipaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  26. Borror, Steven A; DiPaolo, Franklin E; Harvey, Thomas E; Madara, Steven M; Mam, Reasey J; Sillato, Stephen C, Cooling system for high density heat load.
  27. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  28. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  29. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  30. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  31. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Dehumidified cooling assembly for IC chip modules.
  32. Yamamoto Osamu,JPX, Electric apparatus with integrated semiconductor component.
  33. Walz,Andrew A.; Tegart,Donald A., Electrical module and support therefor with integrated cooling.
  34. Severson Mark H., Electronic assembly with fault tolerant cooling.
  35. Madara, Steven M.; Sillato, Steve; Harvey, Thomas E.; Dukes, David A., Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation.
  36. Goodson, Kenneth E.; Chen, Chuan-Hua; Huber, David E.; Jiang, Linan; Kenny, Thomas W.; Koo, Jae-Mo; Laser, Daniel J.; Mikkelsen, James C.; Santiago, Juan G.; Wang, Evelyn Ning-Yi; Zeng, Shulin; Zhang, Electroosmotic microchannel cooling system.
  37. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  38. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  39. Andrew W. Batchelor AU; Ben Banney AU; David McDonald AU; Tilak T. Chandratilleke AU, Heat exchanger for an electronic heat pump.
  40. Batchelor, Andrew W.; Banney, Ben; McDonald, David; Chandratilleke, Tilak T., Heat exchanger for an electronic heat pump.
  41. Ouyang,Chien, Heat sink having magnet array for magneto-hydrodynamic hot spot cooling.
  42. He,Li, Liquid cooling device.
  43. Minamitani, Rintaro; Kitano, Makoto; Ashiwake, Noriyuki; Ohashi, Shigeo; Kondo, Yoshihiro; Naganawa, Takashi; Yoshitomi, Yuji; Nakagawa, Tsuyoshi, Liquid cooling system and personal computer using the same.
  44. Flotta, Matteo; Martin, Yves C.; Romankiw, Lubomyr T.; Van Kessel, Theodore G., Method and apparatus for chip cooling.
  45. Flotta, Matteo; Martin, Yves C.; Romankiw, Lubomyr T.; van Kessel, Theodore G., Method and apparatus for chip cooling.
  46. Baer, Daniel B, Method and apparatus for cooling electronic enclosures.
  47. Baer,Daniel B., Method and apparatus for cooling electronic enclosures.
  48. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, Williams W.; Zubillaga, Glenn W.; Millian, Isaac, Method for agile workpiece temperature control in a plasma reactor using a thermal model.
  49. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.
  50. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.
  51. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of operating a capacitively coupled plasma reactor with dual temperature control loops.
  52. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using feed forward thermal control.
  53. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal control.
  54. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  55. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  56. Doll, Wade J., Multi-stage air movers for cooling computer systems and for other uses.
  57. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with a multiple zone thermal control feed forward control apparatus.
  58. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with a multiple zone thermal control feed forward control apparatus.
  59. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.
  60. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.
  61. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops.
  62. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Everett, Jr., George Carl, Power conditioning module.
  63. Liu, PeiJun, Receiver with flow metering device.
  64. Scofield, William H.; Baube, Scott H., Refrigerant line electrical ground isolation device for data center cooling applications.
  65. Pham,Hung M.; Warner,Wayne R., Refrigeration system including thermoelectric module.
  66. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  67. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  68. Mohammad A. Tantoush, Scalable and modular heat sink-heat pipe cooling system.
  69. Tantoush, Mohammad A., Scalable and modular heat sink-heat pipe cooling system.
  70. David, Tom, Self-adjusting cooling module.
  71. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Spot cooling evaporator cooling system for integrated circuit chip modules.
  72. Belady Christian L, Sub-cooled processor and companion voltage regulator.
  73. Chu Richard C. ; Chrysler Gregory M. ; Simons Robert E., Sub-dew point cooling of electronic systems.
  74. Shari Lynn Slovikosky, System and method for cooling a central processing unit.
  75. Gregory W. Pautsch ; Kent T. McDaniel ; Eric Dwayne Lakin ; James Joseph Jirak, System and method for cooling electronic components.
  76. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Kim, John J.; Chaplinsky, Robert C.; Everett, Jr., George Carl, System including power conditioning modules.
  77. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  78. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  79. Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
  80. Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
  81. Wang,Jack; Cheng,Cheng Hua; Lin,Michael; Ma,Charles, Water-cooling heat dissipation system.
  82. Neng-Chao Chang TW, Water/air dual cooling arrangement for a CPU.
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