[특허]Focused CPU air cooling system including high efficiency heat exchanger

Focused CPU air cooling system including high efficiency heat exchanger 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0251411 (1994-05-31)
발명자 / 주소	Porter Warren W. (Escondido CA) Wall III Charles B. (Irmo SC)
출원인 / 주소	AT&T Global Information Solutions Company (Dayton OH 02)
인용정보	피인용 횟수 : 32 인용 특허 : 0

초록 ▼

A cooling system for a computer system which includes at least one component which generates substantial thermal energy. The cooling system includes a high efficiency heat exchanger formed of a thermally conductive material which is attached to the heat generating component. This heat exchanger comprises a hollow body formed of a thermally conductive material for attachment to the heat generating component, a coolant inlet provided through the wall of the hollow body for providing cooling air from received from an air compressor to the interior of the heat exchanger, and a coolant outlet provided through the wall of the hollow body for providing egress of cooling air from the heat exchanger. Within the hollow body, the exchanger includes a a corrugated metal fin which is periodically lanced to provide for the passage of cooling air through the fin. The metal fin occupies substantially all of the cavity within the heat exchanger\s hollow body and is oriented such that the corrugations in the fin are positioned between the heat exchanger\s inlet and outlet, providing maximum contact between the cooling air and the surface area of the metal fin.

대표청구항 ▼

In a computer system including at least one component which generates substantial thermal energy, a cooling system comprising: a vacuum pump unit for generating a cooling airflow; a heat exchanger comprising a thermally conductive material, said heat exchanger being in thermal contact with said component, said heat exchanger comprising: a hollow body formed of a thermally conductive material for attachment to said component; an internal cooling structure formed of a thermally conductive material for providing an increased surface area which is exposed to said cooling air, said cooling structure being thermally attached within said hollow body, said cooling structure comprising a corrugated metal fin which occupies substantially all of the cavity within said hollow body, said corrugated metal fin being periodically lanced to provide for the passage of cooling air through said corrugated metal fin; a coolant inlet provided through the wall of said hollow body; and a coolant outlet provided through the wall of said hollow body; and a conduit having a first end which is connected with said vacuum pump unit and a second end which is connected to said coolant outlet for providing a cooling air pathway from said heat exchanger to said vacuum pump unit.

이 특허를 인용한 특허 (32)

Jeter, Michael A; Mock, Roger A; Gerbsch, Erich W; Ronning, Jeffrey J.; Taylor, Ralph S.; Hayes, Andrew R., Automotive electronics heat exchanger.
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Giannatto Carl J. ; Cornish Kevin C., Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger.
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Harrington, Steve, Computer cooling system and method of use.
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Goldowsky Michael Philip ; Chiu George Liang-Tai ; Mok Lawrence Shungwei ; Ellis Arthur W., Contactless hermetic pump.
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Cheon Kioan, Cooling apparatus for electronic devices.
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Hamman,Brian A., Cooling system.
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Cheon Kioan, Cooling system for computer.
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Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus.
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Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus.
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Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus including liquid cooling unit.
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Cheon Kioan, Fanless cooling system for computer.
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Alexander Arthur Ray ; Porter ; deceased Warren W., Focused air cooling employing a dedicated chiller.
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Wilson,Michael J.; Wert,Kevin L.; Wattelet,Jonathan; DeKeuster,Richard; Lightner,Donald, Forced fluid heat sink.
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Masseth, Robert E.; Wilson, Daniel E.; Quan, Michael, Heat exchanger having silicon nitride substrate for mounting high power electronic components.
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Bridges, Jeremy S.; La Rocca, Paul J.; Megarity, William M., Heat sink for distributing a thermal load.
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Giannatto Carl J. ; Cornish Kevin C., Housing for diverse cooling configuration printed circuit cards.
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Giannatto Carl J. ; Cornish Kevin C., Housing for diverse cooling configuration printed circuit cards.
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Gang Wang ; P. Keith Muller ; James Leo Knighten ; Joseph Ted DiBene, II, Integrated venting EMI shield and heatsink component for electronic equipment enclosures.
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Hamman,Brian A., Liquid cooling system.
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Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat exchanger therefor.
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Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat receiver therefor.
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Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat receiver therefor.
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Douglas P. Calaman ; Mathew J. Connors, Liquid-cooled heat sink with thermal jacket.
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Wall Charles B. ; Peeples Johnston W. ; Craps Terry ; DiGiacomo Robert, Method and apparatus for cooling an integrated circuit device.
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Harrington, Steve; Deangelis, Peter C.; Campbell, William C, No drip hot swap connector and method of use.
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Morehead, Graham Andrew, Peltier-assisted liquid-cooled computer enclosure.
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Song Kwang-Ho,KRX, Portable computer having a heat-emitting device mountable on a CPU for emitting heat generated from the CPU via air ven.
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Giannatto Carl J. ; Cornish Kevin C. ; Straub Walter H., Printed circuit board-mounted, sealed heat exchanger.
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Hileman Vince P. ; Harpell Gary A., Refrigeration cooled disk storage assembly.
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Chen, Chin-Ping, Semi-closed air cooling type radiator.
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Belady, Christian; Tanksalvala, Darius; Gostin, Gary, System and method for cooling an electronic component.
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Hamman, Brian Alan, System processor heat dissipation.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Focused CPU air cooling system including high efficiency heat exchanger 원문보기

초록 ▼

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이 특허를 인용한 특허 (32)

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Focused CPU air cooling system including high efficiency heat exchanger 원문보기

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연구과제 타임라인

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이 특허를 인용한 특허 (32)

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