[특허]Land grid array package/circuit board assemblies and methods for constructing the same

Land grid array package/circuit board assemblies and methods for constructing the same 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0218076 (1994-03-25)
발명자 / 주소	Dozier II Thomas H. (Carrollton TX)
출원인 / 주소	Convex Computer Corporation (Richardson TX 02)
인용정보	피인용 횟수 : 115 인용 특허 : 0

초록 ▼

An electrical assembly 100 is provided which includes a land grid array integrated circuit package 103, a socket 104, a printed circuit board 106 and a clamping lid 101. Socket 104 and clamping lid 101 have major surface dimensions no greater than the major surface dimensions of the LGA integrated circuit package 103 in order to limit board space requirements to the minimum required by the circuit package 103. Alignment means associated with integrated circuit package 103, socket 104 and printed circuit board 106 are provided to maintain alignment between contact pads 120 on circuit package 103 and first ends of compressible conductors 111 on socket 104 and between contact pads 122 on circuit board 106 and second ends of compressible conductors 111. In the completed assembly, clamping lid 101 applies pressure to an adjacent surface of integrated circuit package 103 thereby compressing compressible conductors 111 against contact pads 120 and contact pads 122.

대표청구항 ▼

An assembly comprising: an integrated circuit package including a first surface having a plurality of contact pads thereon, a plurality of screw holes passing through said first surface and an opposing second surface of said package, and at least one alignment means separate from said screw holes associated with said first surface of said package; a printed circuit board including a first surface having a plurality of contact pads thereon, a plurality of threaded press nuts disposed within said circuit board, and at least one alignment means associated with said first surface of said circuit board; a socket, disposed between said package and said circuit board, having a first surface and an opposing second surface, wherein said first surface of said socket is disposed adjacent to said first surface of said package and wherein a perimeter of said first surface of said socket is positionable entirely within a perimeter of said first surface of said package, said socket further comprising: a plurality of screw holes passing through said first and second surfaces of said socket; a plurality of compressible electrical conductors each having a first end extending from said first surface of said socket and a second end extending from said second surface of said socket; and at least one alignment means interfacing with said alignment means of said package and said circuit board for maintaining alignment between said contact pads of said package and said first ends of said compressible conductors and between said contact pads of said circuit board and said second ends of said compressible conductors; and a clamping lid having a surface disposed adjacent to said second surface of said package and a plurality of screw holes passing through said clamping lid, wherein a perimeter of said clamping lid is positionable entirely within a perimeter of said second surface of said package and wherein said clamping lid compresses said compressible conductors in response to tightening screws which pass through corresponding said screw holes of said clamping lid, said package, said socket, and into said threaded press nuts.

이 특허를 인용한 특허 (115)

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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연합인증

Land grid array package/circuit board assemblies and methods for constructing the same 원문보기

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Land grid array package/circuit board assemblies and methods for constructing the same 원문보기

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연구과제 타임라인

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이 특허를 인용한 특허 (115)

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