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다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
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Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0055863 (1993-05-04) |
발명자 / 주소 |
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출원인 / 주소 |
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인용정보 | 피인용 횟수 : 383 인용 특허 : 0 |
A wire bondable plastic encapsulated semiconductor device (58) having no die supporting surface can be manufactured. In one embodiment, a semiconductor die (22) and a plurality of conductors (12) extending toward the periphery of the die are provided. The die is rigidly held in place on a workholder
A wire bondable plastic encapsulated semiconductor device (58) having no die supporting surface can be manufactured. In one embodiment, a semiconductor die (22) and a plurality of conductors (12) extending toward the periphery of the die are provided. The die is rigidly held in place on a workholder (60) with a vacuum (62) for the wire bonding process. Wire bonds (26) electrically connect the die to the conductors. The wire bonded die is then placed inside a mold cavity (64), and a resin encapsulated is transferred into the cavity under elevated temperature and pressure to form package body (70) around the die, the wire bonds and a portion of the conductors. Before the package body is formed, the die is supported solely by the the rigidity of the wire bonds since there is no die supporting surface connected to the conductors.
A method for fabricating a semiconductor device comprising the steps of: placing a semiconductor die having an active surface and a periphery on a supporting workholder; attaching an inactive surface of the semiconductor die to a removable tape, the tape being supported by the workholder to rigidly
A method for fabricating a semiconductor device comprising the steps of: placing a semiconductor die having an active surface and a periphery on a supporting workholder; attaching an inactive surface of the semiconductor die to a removable tape, the tape being supported by the workholder to rigidly hold the semiconductor die in a fixed position on the workholder; providing a first plurality of conductors extending toward the periphery of the semiconductor die; wire bonding the active surface of the semiconductor die to the first plurality of conductors; forming a package body, having planar surfaces, to cover the active surface of the semiconductor die and a portion of the plurality of conductors; and providing a second plurality of conductors electrically connected to the semiconductor die to provide external electrical connections.
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