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Method for interconnection of integrated circuit chip and substrate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/607
  • H01L-021/98
출원번호 US-0241427 (1994-05-11)
발명자 / 주소
  • Marrs Robert C. (Scottsdale AZ)
출원인 / 주소
  • Amkor Electronics, Inc. (Chandler AZ 02)
인용정보 피인용 횟수 : 129  인용 특허 : 0

초록 ▼

According to the invention, a method and structure for flip chip interconnection of an integrated circuit chip to a substrate is provided. The method and structure of the invention overcome the problems associated with interconnecting the chip to the substrate by wirebonding and are less expensive t

대표청구항 ▼

A method for forming an interconnection between an integrated circuit chip and a substrate, electrically conductive circuitry and a plurality of electrically conductive bond pads being formed on a surface of the integrated circuit chip, electrically conductive material being formed on a first surfac

이 특허를 인용한 특허 (129)

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