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Method for fabricating thin, strong, and flexible die for smart cards 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/304
출원번호 US-0225687 (1994-04-11)
발명자 / 주소
  • Clifton Mark B. (Robbinsville NJ) Flynn Richard M. (Noblesville IN) Verdi Fred W. (Lawrenceville NJ)
출원인 / 주소
  • AT&T Corp. (Murray Hill NJ 02)
인용정보 피인용 횟수 : 115  인용 특허 : 0

초록 ▼

Improved methods for fabricating smart cards are disclosed. Semiconductor die approximately 0.004 to 0.007 inches thick are fabricated using chemical stress relief processes and UV dicing tape. The die are positioned substantially on the neutral axis of a smart card, thereby providing smart cards ha

대표청구항 ▼

A method for fabricating a plurality of smart card semiconductor die from a full thickness semiconductor wafer including the following steps: (a) mapping the semiconductor wafer to identify, specific semiconductor die, thus permitting the locations of bad or defective die to be specified for future

이 특허를 인용한 특허 (115)

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