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Removal of field and embedded metal by spin spray etching 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0375054 (1995-01-19)
발명자 / 주소
  • Contolini Robert J. (Pleasanton CA) Mayer Steven T. (San Leandro CA) Tarte Lisa A. (Livermore CA)
출원인 / 주소
  • The United States of America as represented by The United States Department of Energy (Washington DC 06)
인용정보 피인용 횟수 : 61  인용 특허 : 0

초록 ▼

A process of removing both the field metal, such as copper, and a metal, such as copper, embedded into a dielectric or substrate at substantially the same rate by dripping or spraying a suitable metal etchant onto a spinning wafer to etch the metal evenly on the entire surface of the wafer. By this

대표청구항 ▼

A process for uniformly removing metal from a metal surface located on a substrate surface and from a metal surface located above metal containing trenches formed in the substrate for producing an essentially planar surface across the substrate and the metal containing trenches therein, comprising:

이 특허를 인용한 특허 (61)

  1. Ganesan, Kousik; Ghongadi, Shanthinath; Majid, Tariq; Labrie, Aaron; Mayer, Steven T., Apparatus and method for edge bevel removal of copper from silicon wafers.
    상세보기
  2. Ganesan, Kousik; Ghongadi, Shantinath; Majid, Tariq; Labrie, Aaron; Mayer, Steven T., Apparatus and method for edge bevel removal of copper from silicon wafers.
    상세보기
  3. Kwag Gyu-hwan,KRX ; Hwang Kyung-seuk,KRX, Apparatus for wafer treatment for the manufacture of semiconductor devices.
    상세보기
  4. Briggs, Benjamin D.; Huang, Elbert E.; Nogami, Takeshi; Patlolla, Raghuveer R.; Peethala, Cornelius B.; Rath, David L., Barrier planarization for interconnect metallization.
    상세보기
  5. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.
    상세보기
  6. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.
    상세보기
  7. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.
    상세보기
  8. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.
    상세보기
  9. Yu, Cheng-Po; Yu, Cheng-Hung, Circuit board and manufacturing method thereof.
    상세보기
  10. Mayer Steven T. ; Russo Carl ; Patton Evan, Edge bevel removal of copper from silicon wafers.
    상세보기
  11. Mayer, Steven T.; Varadarajan, Seshasayee; McCutcheon, Andrew J., Edge bevel removal of copper from silicon wafers.
    상세보기
  12. Mayer, Steven T.; Varadarajan, Seshasayee; Preston, Douglas A., Edge bevel removal of copper from silicon wafers.
    상세보기
  13. Henri, Jon; Meinhold, Henner; Gage, Christopher; Doble, Dan, Edge removal of films using externally generated plasma species.
    상세보기
  14. Toshiaki Yoshikawa JP; Makoto Kameyama JP; Junri Ishikura JP, Electrode plate, liquid crystal device and production thereof.
    상세보기
  15. Mayer Steven T. ; Contolini Robert J., Electroplanarization of large and small damascene features using diffusion barriers and electropolishing.
    상세보기
  16. Mayer Steven T. ; Alexy John B. ; Feng Jinbin, Etchant mixing system for edge bevel removal of copper from silicon wafers.
    상세보기
  17. Koos, Daniel A.; Mayer, Steven T.; Park, Heung L.; Cleary, Timothy Patrick; Mountsier, Thomas, Fabrication of semiconductor interconnect structure.
    상세보기
  18. Mayer, Steven T.; Koos, Daniel A.; Webb, Eric, Fabrication of semiconductor interconnect structure.
    상세보기
  19. Mayer, Steven T.; Koos, Daniel A.; Webb, Eric, Fabrication of semiconductor interconnect structure.
    상세보기
  20. Ulrich Bruce Dale ; Nguyen Tue ; Kobayashi Masato, Low temperature system and method for CVD copper removal.
    상세보기
  21. Feng, Jingbin; LaBrie, Aaron; Ganesan, Kousik, Magnetically actuated chuck for edge bevel removal.
    상세보기
  22. Mayer, Steven T.; Drewery, John S., Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation.
    상세보기
  23. Mayer, Steven T.; Contolini, Robert J.; Broadbent, Eliot K.; Drewery, John S., Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation.
    상세보기
  24. Reid, Jonathan David, Method for electrochemical planarization of metal surfaces.
    상세보기
  25. Koos,Daniel A.; Mayer,Steven T.; Park,Heung L.; Cleary,Timothy Patrick; Mountsier,Thomas, Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage.
    상세보기
  26. Mayer,Steven T.; Reid,Jonathan D.; Rea,Mark L.; Emesh,Ismail T.; Meinhold,Henner W.; Drewery,John S., Method for planar electroplating.
    상세보기
  27. Lee, Pei-Ing; Wu, Chang Rong; Ho, Tzu En; Chen, Yi-Nan; Su, Hsien Wen, Method for shallow trench isolation fabrication and partial oxide layer removal.
    상세보기
  28. Jaso Mark Anthony, Method of chemically mechanically polishing an electronic component using a non-selective ammonium persulfate slurry.
    상세보기
  29. Yu, Cheng-Po, Method of making a circuit structure of a circuit board.
    상세보기
  30. Kwag Gyu-hwan,KRX ; Ko Se-jong,KRX ; Hwang Kyung-seuk,KRX ; Gil Jun-ing,KRX ; Park Sang-o,KRX ; Kim Dae-hoon,KRX ; Chon Sang-moon,KRX ; Chung Ho-Kyoon,KRX, Method of manufacturing semiconductor devices, etching composition for manufacturing semiconductor devices, and semiconductor devices made using the method.
    상세보기
  31. Gyu-hwan Kwag KR; Se-jong Ko KR; Kyung-seuk Hwang KR; Jun-ing Gil KR; Sang-o Park KR; Dae-hoon Kim KR; Sang-moon Chon KR; Ho-Kyoon Chung KR, Method of manufacturing semiconductor devices, etching compositions for manufacturing semiconductor devices, and semiconductor devices made using this method.
    상세보기
  32. Kwag Gyu-hwan,KRX ; Ko Se-jong,KRX ; Hwang Kyung-seuk,KRX ; Gil Jun-ing,KRX ; Park Sang-o,KRX ; Kim Dae-hoon,KRX ; Chon Sang-moon,KRX ; Chung Ho-Kyoon,KRX, Method of manufacturing semiconductor devices, etching compositions for manufacturing semiconductor devices, and semiconductor devices thereby.
    상세보기
  33. Chou,Shih Wei; Tsai,Minghsing; Shue,Winston, Method to remove copper without pattern density effect.
    상세보기
  34. Reid, Jonathan; Varadarajan, Sesha; Emekli, Ugur, Methods and apparatus for depositing copper on tungsten.
    상세보기
  35. Reid, Jonathan; Varadarajan, Sesha; Emekli, Ugur, Methods and apparatus for depositing copper on tungsten.
    상세보기
  36. Mayer, Steven T.; Porter, David W., Modulated metal removal using localized wet etching.
    상세보기
  37. Mayer, Steven T.; Svirchevski, Julia; Drewery, John Stephen, Pad-assisted electropolishing.
    상세보기
  38. Mayer, Steven T.; Drewery, John Stephen; Webb, Eric G., Photoresist-free metal deposition.
    상세보기
  39. Basol, Bulent M., Plating method and apparatus for controlling deposition on predetermined portions of a workpiece.
    상세보기
  40. Basol, Bulent M., Plating method and apparatus for controlling deposition on predetermined portions of a workpiece.
    상세보기
  41. Basol, Bulent M., Plating methods for low aspect ratio cavities.
    상세보기
  42. Gupta Anand ; Karlsrud Chris ; Gopalan Periya, Post-CMP wet-HF cleaning station.
    상세보기
  43. Gupta Anand ; Karlsrud Chris ; Gopalan Periya ; Trojan Daniel R. ; Cunnane Jeffrey B. ; MacErnie Jon R., Post-CMP wet-HF cleaning station.
    상세보기
  44. Kruwinus,Hans Jurgen; Sellmer,Reinhard, Process for planarizing substrates of semiconductor technology.
    상세보기
  45. Karen R. Caldwell, Process for preparation of thin metallic foils and organic thin-film-metal structures.
    상세보기
  46. Mayer, Steven T.; Porter, David W., Reduced isotropic etchant material consumption and waste generation.
    상세보기
  47. Mayer, Steven T.; Porter, David W., Reduced isotropic etchant material consumption and waste generation.
    상세보기
  48. Mayer, Steven T.; Drewery, John S.; Hill, Richard S.; Archer, Timothy M.; Kepten, Avishai, Selective electrochemical accelerator removal.
    상세보기
  49. Mayer, Steven T.; Drewery, John; Hill, Richard S.; Archer, Timothy; Kepten, Avishai, Selective electrochemical accelerator removal.
    상세보기
  50. Mayer, Steven T.; Stowell, Marshall R.; Drewery, John S.; Hill, Richard S.; Archer, Timothy M.; Kepten, Avishai, Selective electrochemical accelerator removal.
    상세보기
  51. Olgado, Donald J. K.; Tepman, Avi; Lubomirsky, Dmitry; Webb, Timothy R., System for planarizing metal conductive layers.
    상세보기
  52. Amrich, Mark; Rolfe, Jonathan; Buturlia, Joseph; Lynch, Robert, Textured surface having undercut micro recesses in a surface.
    상세보기
  53. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
    상세보기
  54. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
    상세보기
  55. Mayer, Steven T.; Taatjes, Steve; McCutcheon, Andy; Schall, Jim; Feng, Jinbin, Wafer chuck for use in edge bevel removal of copper from silicon wafers.
    상세보기
  56. Mayer, Steven T.; Taatjes, Steve; McCutcheon, Andy; Schall, Jim; Feng, Jingbin, Wafer chuck for use in edge bevel removal of copper from silicon wafers.
    상세보기
  57. Stephens, Craig P.; Kanetomi, Matt; Richardson, Joseph; Veazey, Chris; LaBrie, Aaron, Wafer chuck with aerodynamic design for turbulence reduction.
    상세보기
  58. Uzoh Cyprian Emeka, Wafer edge deplater for chemical mechanical polishing of substrates.
    상세보기
  59. Mayer, Steven T.; Webb, Eric G.; Porter, David W., Wet etching methods for copper removal and planarization in semiconductor processing.
    상세보기
  60. Mayer, Steven T.; Webb, Eric; Porter, David W., Wet etching methods for copper removal and planarization in semiconductor processing.
    상세보기
  61. Mayer, Steven T.; Webb, Eric; Porter, David W., Wet etching methods for copper removal and planarization in semiconductor processing.
    상세보기

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