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Method of mounting an electronic part with bumps on a circuit board

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/14
출원번호 US-0457805 (1995-06-01)
우선권정보 JP-0050464 (1993-03-11); JP-0003469 (1994-01-18)
발명자 / 주소
  • Sakemi Shoji (Fukuoka JPX) Wada Yoshiyuki (Onojo JPX)
출원인 / 주소
  • Matsushita Electric Industrial Co., Ltd. (Osaka JPX 03)
인용정보 피인용 횟수 : 80  인용 특허 : 0

초록

A method of mounting an electronic part with bumps on a circuit board is disclosed which enables bumps to be bonded to electrodes of the circuit board with certainty and which enables the judgement of the quality of bonding with precision. By making an area of the electrodes of the circuit board lar

대표청구항

A printed circuit board for an electronic part with solder bumps provided on electrodes thereof, said board comprising a plurality of electrodes formed on a surface thereof, said electrodes having larger planar areas than those of said electrodes of the electronic part, each of said plurality of ele

이 특허를 인용한 특허 (80)

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  77. Buck, Jonathan E.; Stoner, Stuart C.; Minich, Steven E.; Johnescu, Douglas M.; Smith, Stephen B., Vertical electrical connector.
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