$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Non-contact optical techniques for measuring surface conditions 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01B-011/06
  • G01J-005/06
  • H01L-021/66
출원번호 US-0180641 (1994-01-12)
발명자 / 주소
  • Schietinger Charles W. (Portland OR) Adams Bruce E. (Portland OR)
출원인 / 주소
  • Luxtron Corporation (Santa Clara CA 02)
인용정보 피인용 횟수 : 59  인용 특허 : 0

초록

Thermal, optical, physical and chemical characteristics of a substrate (11) surface are determined with non-contact optical techniques that include illuminating (23) the surface with radiation having a ripple intensity characteristic (51), and then measuring the combined intensities (53) of that rad

대표청구항

A method of determining a characteristic of a layer of one material on a surface of another material, comprising the steps of: directing continuous electromagnetic radiation toward the layer and surface in a manner to be modified thereby, said radiation including a given wavelength range and having

이 특허를 인용한 특허 (59)

  1. Lohokare,Shrikant, Accurate temperature measurement for semiconductor applications.
  2. Ish-Shalom Yaron,ILX ; Baharav Yael, Active pyrometry with emissivity extrapolation and compensation.
  3. Harris David E., Apparatus and method for binocular measurement system.
  4. Harris David E., Apparatus and method for binocular measurement system.
  5. Harnik Arie,ILX ; Schwarzfuchs Elie,ILX ; Iskevitch Eliezer,ILX, Apparatus for processing material at controlled temperatures.
  6. Alers Glenn B. ; Fleming Robert M. ; Levine Barry Franklin ; Thomas Gordon Albert, Apparatus for processing silicon devices with improved temperature control.
  7. Camm,David Malcolm; Bumbulovic,Mladen; Cibere,Joseph; Elliott,J. Kiefer; McCoy,Steve; Stuart,Greg, Apparatuses and methods for suppressing thermally-induced motion of a workpiece.
  8. Volf,Boris; Belousov,Mikhail; Gurary,Alexander, Calibration wafer and method of calibrating in situ temperatures.
  9. Volf,Boris; Belousov,Mikhail; Gurary,Alexander I., Calibration wafer and method of calibrating in situ temperatures.
  10. Bevan,Edward James; Briggs,Max Michael; DiDomenico,John; Gedridge, Jr.,Robert W., Compact emissivity and temperature measuring infrared detector.
  11. Thakur Randhir P. S. ; Martin Annette L., Controlling semiconductor structural warpage in rapid thermal processing by selective and dynamic control of a heating s.
  12. Thakur Randhir P. S. ; Martin Annette L., Controlling semiconductor structural warpage in rapid thermal processing by selective and dynamic control of a heating s.
  13. Woodruff,Daniel J.; Bernt,Marvin Louis, End point detection in workpiece processing.
  14. Gotthold,John P.; Stapleton,Terry M.; Champetier,Robert; Dang,Hung, In situ optical surface temperature measuring techniques and devices.
  15. Simpson, Jeffrey A.; Imbrock, Mark A., Method and apparatus for detecting properties of reflective transparent surface coatings on a sheet of transparent material.
  16. Hoffman, Wayne; Knoble, Wayne, Method and apparatus for identifying photocatalytic coatings.
  17. Gregory F. Redinbo ; Jallepally Ravi ; Michael Rivkin, Method and apparatus for monitoring and/or end point detecting a process.
  18. Holcomb Matthew J., Method and apparatus for parameter difference imaging of a sample surface.
  19. Simpson,Jeffrey A.; Imbrock,Mark A., Method and apparatus for protecting an optical transmission measurement when sensing transparent materials.
  20. Lerch, Wilfried; Hauf, Markus, Method and device for calibrating measurements of temperatures independent of emissivity.
  21. Stamper Anthony K. ; Hartswick Thomas J., Method and device to monitor integrated temperature in a heat cycle process.
  22. Maznev, Alex, Method for measuring thin metal films.
  23. Simpson, Jeffrey A.; Imbrock, Mark A.; Strimpel, Nathan, Method of enhancing measurement of stress in glass.
  24. Hauf Markus,DEX ; Knarr Thomas,DEX ; Walk Heinrich,DEX ; Balthasar Horst,DEX ; Muller Uwe,DEX, Method of measuring electromagnetic radiation.
  25. Palfenier, Ronald A.; Nystrom, Patrick J., Method of optical pyrometry that is independent of emissivity and radiation transmission losses.
  26. Steger, Robert J., Methods and apparatus for in situ substrate temperature monitoring.
  27. Camm, David Malcolm; Sempere, Guillaume; Kaludjercic, Ljubomir; Stuart, Gregory; Bumbulovic, Mladen; Tran, Tim; Dets, Sergiy; Komasa, Tony; Rudolph, Marc; Cibere, Joseph, Methods and systems for supporting a workpiece and for heat-treating the workpiece.
  28. Camm, David Malcolm; Sempere, Guillaume; Kaludjercic, Ljubomir; Stuart, Gregory; Bumbulovic, Mladen; Tran, Tim; Dets, Sergiy; Komasa, Tony; Rudolph, Marc; Cibere, Joseph, Methods and systems for supporting a workpiece and for heat-treating the workpiece.
  29. Schietinger Charles W. ; Adams Bruce E., Non-contact optical techniques for measuring surface conditions.
  30. Spitzberg Richard M., Non-contact surface temperature, emissivity, and area estimation.
  31. Yassour, Yuval; Harnik, Arie; Richman, Hilel, Non-contact thermal platforms.
  32. Sopori, Bhushan; Rupnowski, Przemyslaw; Ulsh, Michael, On-line, continuous monitoring in solar cell and fuel cell manufacturing using spectral reflectance imaging.
  33. Mahawili Imad, Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing.
  34. Mahawili, Imad, Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing.
  35. Palfenier, Ronald A.; Nystrom, Patrick J., Radiometric temperature measurement system.
  36. Palfenier, Ronald A.; Nystrom, Patrick J., Radiometric temperature measurement system.
  37. Kubo, Tomohiro, Rapid thermal processing apparatus and method of manufacture of semiconductor device.
  38. Imad Mahawili, Reactor and method of processing a semiconductor substrate.
  39. Mahawili, Imad, Reactor with remote plasma system and method of processing a semiconductor substrate.
  40. Mahawili, Imad, Rectilinear wedge geometry for optimal process control in chemical vapor deposition and rapid thermal processing.
  41. Burke Robert James ; Zahorik Russell C. ; Paduano Paul A. ; Thakur Randhir P. S., Reflectance method for accurate process calibration in semiconductor substrate heat treatment.
  42. Burke Robert J. (Boise ID) Zahorik Russell C. (Boise ID) Paduano Paul A. (Boise ID) Thakur Randhir P. S. (Boise ID), Reflectance method for accurate process calibration in semiconductor wafer heat treatment.
  43. Camm David Malcolm,CAX ; Lefrancois Marcel Edmond,CAX ; Hickson Brendon James,CAX, Spatially resolved temperature measurement and irradiance control.
  44. Camm, David Malcolm; Lefrancois, Marcel Edmond; Hickson, Brendon James, Spatially resolved temperature measurement and irradiance control.
  45. Mahawili Imad, Substrate platform for a semiconductor substrate during rapid high temperature processing and method of supporting a substrate.
  46. Thakur Randhir P. S., Surface properties detection by reflectance metrology.
  47. Shajii, Ali; Matthews, Brian; Hebb, Jeffrey P.; Danis, John, System and method for controlling movement of a workpiece in a thermal processing system.
  48. Ali Shajii ; Jeffrey P. Hebb, System and method for determining stray light in a thermal processing system.
  49. Jeffrey P. Hebb ; Ali Shajii, System and method for the real time determination of the in situ emissivity and temperature of a workpiece during processing.
  50. Hebb Jeffrey P. ; Shajii Ali, System and method for the real time determination of the in situ emissivity of a workpiece during processing.
  51. Tien-Yu Tom Lee ; James Vernon Hause ; Li Li, System and method to control solder reflow furnace with wafer surface characterization.
  52. Simpson, Jeffrey A.; Imbrock, Mark A.; Strimpel, Nathan, System for detecting coatings on transparent or semi-transparent materials.
  53. Camm, David Malcolm; Cibere, Joseph; Bumbulovic, Mladen, Systems and methods for supporting a workpiece during heat-treating.
  54. Camm,David M.; Kervin,Shawna; Lefrancois,Marcel Edmond; Stuart,Greg, Temperature measurement and heat-treating methods and system.
  55. Camm, David M.; Kervin, Shawna; Lefrancois, Marcel Edmond; Stuart, Greg, Temperature measurement and heat-treating methods and systems.
  56. Mustapha Arroubi FR, Temperature sensor and electrical household appliance comprising same.
  57. Aderhold, Wolfgang; Hegedus, Andreas G.; Merry, Nir, Temperature uniformity measurements during rapid thermal processing.
  58. Mahawili Imad ; Arend John M., Water cooled support for lamps and rapid thermal processing chamber.
  59. Camm, David Malcolm; Cibere, Joseph; Stuart, Greg; McCoy, Steve, Workpiece breakage prevention method and apparatus.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로