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Temperature sensor and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01J-005/10
  • G01J-005/58
  • G01J-004/04
  • G02F-001/01
출원번호 US-0309347 (1994-09-20)
발명자 / 주소
  • Duncan Walter M. (Dallas TX) Celii Francis G. (Dallas TX) Henck Steven A. (Plano TX) Paranjpe Ajit P. (Plano TX) Mahlum Douglas L. (Allen TX) Taylor Larry A. (N. Richland Hills TX)
출원인 / 주소
  • Texas Instruments Incorporated (Dallas TX 02)
인용정보 피인용 횟수 : 33  인용 특허 : 0

초록

A direct, noncontact temperature sensor includes an ellipsometer (104-106) to determine absorptance for layered structures and a pyrometer (102) to determine emissive power and combines the two measurements to determine temperature.

대표청구항

A temperature sensor for a layered structure, comprising: a pyrometer; and an absorptance detector coupled to said pyrometer, said detector determining emissivity of a layered structure based on layer thickness measurements; wherein said absorptance detector provides an emissivity correction for sai

이 특허를 인용한 특허 (33)

  1. Warren ; Jr. Waite R. ; Cox John T. ; Nicholls Louis W., Apparatus and method for detecting an error in the placement of a lead frame on a surface of a die mold.
  2. Svensson, Stefan P; Demaree, John D, Apparatus for growth of dilute-nitride materials using an isotope for enhancing the sensitivity of resonant nuclear reaction analysis.
  3. Kelson, Itzhak; Levy, Yuval, Apparatus for in-situ thickness and stoichiometry measurement of thin films.
  4. Camm,David Malcolm; Bumbulovic,Mladen; Cibere,Joseph; Elliott,J. Kiefer; McCoy,Steve; Stuart,Greg, Apparatuses and methods for suppressing thermally-induced motion of a workpiece.
  5. Barlett, Darryl; Wissman, Barry D.; Taylor, II, Charles A., Blackbody fitting for temperature determination.
  6. Kuroiwa, Toru, Heat treatment apparatus and heat treatment method for heating substrate by irradiating substrate with flashes of light.
  7. Hashimoto, Kazuyuki; Kusuda, Tatsufumi, Heat treatment method and heat treatment apparatus for heating substrate by irradiating substrate with light.
  8. Christopher Pickering GB; Roger T Carline GB, In-situ monitoring of electrical properties by ellipsometry.
  9. Whipple ; III Walter ; Alley Robert Philbrick ; Bonissone Piero Patrone ; Dausch Mark Edward ; Badami Vivek Venugopal, Infrared non-contact temperature measurement for household appliances.
  10. Muckenhirm,Sylvain G., Integrated measuring instrument.
  11. Maurer Michael,DEX ; Lerch Wilfried,DEX ; Gschwandtner Alexander,DEX, Method and apparatus for determining emissivity of semiconductor material.
  12. Yamashita,Masatsugu; Kawase,Kodo; Tonouchi,Masayoshi; Kiwa,Toshihiro; Nikawa,Kiyoshi, Method and apparatus for diagnosing fault in semiconductor device.
  13. Zettler,J철rg Thomas, Method and apparatus for the determination of characteristic layer parameters at high temperatures.
  14. Timans, Paul Janis, Method and system for determining optical properties of semiconductor wafers.
  15. Timans, Paul Janis, Method and system for determining optical properties of semiconductor wafers.
  16. Hauenstein, Henning M., Method for determining temperatures on semiconductor components.
  17. Curran William J. ; Moore Gary M., Method for measuring substrate temperature in radiant heated reactors.
  18. Yuko Nambu JP; Satoshi Shibata JP, Method of measuring temperature, method of taking samples for temperature measurement and method for fabricating semiconductor device.
  19. Feichtinger, Heinrich; Rohner, Gottfried; Jussel, Rudolf, Method of optically monitoring the progression of a physical and/or chemical process taking place on a surface of a body.
  20. Beaglehole,David, Method of performing optical measurement on a sample.
  21. Chism, II,William W., Method of photo-reflectance characterization of strain and active dopant in semiconductor structures.
  22. Camm, David Malcolm; Sempere, Guillaume; Kaludjercic, Ljubomir; Stuart, Gregory; Bumbulovic, Mladen; Tran, Tim; Dets, Sergiy; Komasa, Tony; Rudolph, Marc; Cibere, Joseph, Methods and systems for supporting a workpiece and for heat-treating the workpiece.
  23. Camm, David Malcolm; Sempere, Guillaume; Kaludjercic, Ljubomir; Stuart, Gregory; Bumbulovic, Mladen; Tran, Tim; Dets, Sergiy; Komasa, Tony; Rudolph, Marc; Cibere, Joseph, Methods and systems for supporting a workpiece and for heat-treating the workpiece.
  24. Chen Jyh-Chen,TWX ; Hu Chieh,TWX ; Lee Yeou-Chang,TWX, Non-contact method for measuring the surface temperature distribution of a melt during growth of ionic crystals.
  25. Chism, II,William W., Polarization modulation photoreflectance characterization of semiconductor electronic interfaces.
  26. Chism, II, William W., Polarization modulation photoreflectance characterization of semiconductor quantum confined structures.
  27. Celii Francis G., Semiconductor surface measurement system and method.
  28. Camm, David Malcolm; Cibere, Joseph; Bumbulovic, Mladen, Systems and methods for supporting a workpiece during heat-treating.
  29. Camm,David M.; Kervin,Shawna; Lefrancois,Marcel Edmond; Stuart,Greg, Temperature measurement and heat-treating methods and system.
  30. Camm, David M.; Kervin, Shawna; Lefrancois, Marcel Edmond; Stuart, Greg, Temperature measurement and heat-treating methods and systems.
  31. Rosenthal,Peter A.; Xu,Jiazhan; Charpenay,Sylvie; Cosgrove,Joseph E., Thermal imaging for semiconductor process monitoring.
  32. Jellison ; Jr. Gerald E. ; Modine Frank A., Two modulator generalized ellipsometer for complete mueller matrix measurement.
  33. Camm, David Malcolm; Cibere, Joseph; Stuart, Greg; McCoy, Steve, Workpiece breakage prevention method and apparatus.
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