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Thermal stereolithography 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B29C-035/08
  • B29C-041/02
  • B29C-041/36
출원번호 US-0148544 (1993-11-08)
발명자 / 주소
  • Almquist Thomas A. (San Gabriel CA) Smalley Dennis R. (Baldwin Park CA)
출원인 / 주소
  • 3D Systems, Inc. (Valencia CA 02)
인용정보 피인용 횟수 : 63  인용 특허 : 0

초록

Apparatus for and related methods of forming three-dimensional objects out of a building material, which is normally solid but which is flowable when heated. In one embodiment a support material is used to fill in portions of layers which are not to be solidified as part of the object to provide sup

대표청구항

An apparatus for forming a three-dimensional object, comprising: a building chamber within which the three-dimensional object is formed, for containing one of a building material and a support material which is capable of physical transformation upon exposure to synergistic stimulation, the building

이 특허를 인용한 특허 (63)

  1. Kawaguchi Noboru,JPX, Apparatus and method of laminate molding using releaser.
  2. Russell,David; Hernandez,Andres; Kinsley,Joshua; Berlin,Andrew, Apparatus and methods for 3D printing.
  3. Davidson, Thomas, Apparatus and methods for handling materials in a 3-D printer.
  4. Davidson, Thomas, Apparatus and methods for handling materials in a 3-D printer.
  5. Davidson, Thomas; Hernandez, Andres T.; Kinsley, Joshua; Sanchez, Jennifer, Apparatus and methods for handling materials in a 3-D printer.
  6. Davidson, Thomas; Villegas, Robert, Apparatus and methods for handling materials in a 3-D printer.
  7. Hickerson,Kevin P.; Bedal,Bryan; Diephuis,Richard J., Apparatus for three dimensional printing using image layers.
  8. Batchelder John Sam ; Comb Jim ; Dahlin Thomas J., High performance rapid prototyping system.
  9. Farnworth, Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.
  10. Farnworth, Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.
  11. Farnworth, Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.
  12. Farnworth,Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.
  13. Fritz Boris C., Making hydropress formblocks and dies utilizing stereolithography and liquid molding compounds.
  14. Fritz Boris C., Making hydropress formblocks and dies utilizing stereolithography and liquid molding compounds.
  15. Bredt, James F.; Anderson, Timothy; Russell, David B.; Clark, Sarah L.; DiCologero, Matthew J., Material systems and methods of three-dimensional printing.
  16. Vermeer, Adrianus Johannes Petrus Maria; Maalderink, Herman Hendrikus; Jamar, Jacobus Hubertus Theodoor; Rijfers, Andries; Vaes, Mark Herman Else, Method and apparatus for layerwise production of a 3D object.
  17. Vermeer, Adrianus Johannes Petrus Maria; Maalderink, Herman Hendrikus; Jamar, Jacobus Hubertus Theodoor; Rijfers, Andries; Vaes, Mark Herman Else, Method and apparatus for layerwise production of a 3D object.
  18. Frasier, Donald J.; Kush, Matthew; Schlienger, Max Eric; Baldwin, Michael, Method and apparatus for production of a cast component.
  19. Frasier, Donald J.; Schlienger, M. Eric; Brady, Guy Allen; Kush, Matthew T.; Vessely, Patrick A., Method and apparatus for production of a cast component.
  20. Frasier, Donald J.; Schlienger, M. Eric; Brady, Guy Allen; Kush, Matthew T.; Vessely, Patrick A., Method and apparatus for production of a cast component.
  21. Frasier, Donald J.; Schlienger, M. Eric; Kush, Matthew T., Method and apparatus for production of a cast component.
  22. Frasier, Donald J.; Schlienger, M. Eric; Vessely, Patrick A., Method and apparatus for production of a cast component.
  23. Turner, Greg Allen, Method and system for defining and verifying a part.
  24. Bredt, James F.; Clark, Sarah L.; Uy, Evert F.; DiCologero, Matthew J.; Anderson, Timothy; Tarkanian, Michael; Williams, Derek X., Methods and compositions for three-dimensional printing of solid objects.
  25. Williams,Vernon M., Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads.
  26. Wood,Alan G.; Farnworth,Warren M.; Watkins,Charles M.; Benson,Peter A., Methods for packaging a plurality of semiconductor dice using a flowable dielectric material.
  27. Wood, Alan G.; Farnworth, Warren M.; Watkins, Charles M.; Benson, Peter A., Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material.
  28. Wood,Alan G.; Farnworth,Warren M.; Watkins,Charles M.; Benson,Peter A., Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials.
  29. Wood,Alan G.; Farnworth,Warren M.; Watkins,Charles M.; Benson,Peter A., Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same.
  30. Williams,Vernon M., Programmed material consolidation methods for fabricating printed circuit board.
  31. Comb Jim ; Dockter Steven E. ; Berens Paul A., Rapid prototyping apparatus.
  32. Hopkins, Paul E.; Holzwarth, Donald J., Seam concealment for three-dimensional models.
  33. Hopkins, Paul E.; Holzwarth, Donald J., Seam concealment for three-dimensional models.
  34. Williams, Vernon M., Selective consolidation processes for electrically connecting contacts of semiconductor device components.
  35. Leyden, Richard N.; Thayer, Jeffrey S.; Bedal, Bryan J. L.; Almquist, Thomas A.; Hull, Charles W.; Earl, Jocelyn M.; Kerekes, Thomas A.; Smalley, Dennis R.; Merot, Christian M.; Fedchenko, Richard P., Selective deposition modeling method and apparatus for forming three-dimensional objects and supports.
  36. Leyden, Richard N.; Thayer, Jeffrey S.; Bedal, Bryan J. L.; Almquist, Thomas A.; Hull, Charles W.; Earl, Jocelyn M.; Kerekes, Thomas A.; Smalley, Dennis R.; Merot, Christian M.; Fedchenko, Richard P., Selective deposition modeling method and apparatus for forming three-dimensional objects and supports.
  37. Leyden,Richard N.; Thayer,Jeffrey S.; Bedal,Bryan J. L.; Almquist,Thomas A.; Hull,Charles W.; Earl,Jocelyn M.; Kerekes,Thomas A.; Smalley,Dennis R.; Merot,Christian M.; Fedchenko,Richard P.; Lockard,, Selective deposition modeling method and apparatus for forming three-dimensional objects and supports.
  38. Wang, Hongqing Vincent; Kumar, Pavan; Stockwell, John; Moussa, Khalil; Kulkami, Rajeev, Selective deposition modeling methods for improved support-object interface.
  39. Farnworth, Warren M., Stereolithographic method for applying materials to electronic component substrates and resulting structures.
  40. Williams, Vernon M., Stereolithographic methods for fabricating conductive elements.
  41. Williams, Vernon M., Stereolithographic methods for securing conductive elements to contacts of semiconductor device components.
  42. Kulkarni, Rajeev B.; Manners, Chris R., Stereolithographic process of making a three-dimensional object.
  43. Kulkarni, Rajeev B.; Manners, Chris R., Stereolithographic supports.
  44. Vernon M. Williams, Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.
  45. Vernon M. Williams, Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.
  46. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.
  47. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.
  48. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.
  49. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.
  50. Joseph L. Calderon ; Andrew M. Hahn, Substrate mounting system for a three-dimensional modeling machine.
  51. Vermeer, Adrianus Johannes Petrus Maria; Maalderink, Herman Hendrikus; Jamar, Jacobus Hubertus Theodoor; Rijfers, Andries; Vaes, Mark Herman Else; Bauman, Brian; Thomas, Richard, System and method for layerwise production of a tangible object.
  52. Bredt, James F.; Clark, Sarah L.; Williams, Derek X.; DiCologero, Matthew J., Thermoplastic powder material system for appearance models from 3D printing systems.
  53. Swanson William J. ; Hopkins Paul E., Thin-wall tube liquifier.
  54. Bredt,James F.; Anderson,Timothy C.; Russell,David B., Three dimensional printing material system and method.
  55. Williams, Derek X., Three dimensional printing material system and method using peroxide cure.
  56. Giller, Eugene; Williams, Derek X., Three dimensional printing material system and method using plasticizer-assisted sintering.
  57. Giller, Eugene; Williams, Derek X., Three dimensional printing material system and method using plasticizer-assisted sintering.
  58. Davidson, Thomas; Phillips, Robert A.; Hernandez, Andres T.; Russell, David B.; Roche, Kevin; Zengerle, III, Walter H.; Berlin, Andrew; Kinsley, Joshua P.; Sweet-Block, Benjamin Daniel; Kisai, Darul, Three-dimensional printer.
  59. Davidson, Thomas; Phillips, Robert A.; Russell, David B., Three-dimensional printer.
  60. Davidson,Thomas; Phillips,Robert A.; Hernandes,Andres T.; Russell,David B.; Roche,Kevin; Zengerle, III,Walter H.; Berlin,Andrew; Kinsley,Joshua P.; Sweet Block,Benjamin Daniel; Kisai,Darul, Three-dimensional printer.
  61. Alam, Amir; Bredt, James F.; Clark, Nanette; Flynn, Mary; Sprauer, Jean; Williams, Derek X., Three-dimensional printing material system with improved color, article performance, and ease of use.
  62. Daily Carl S. ; Lees Daniel A. ; McKitterick Dennis Donald, Truss structure design.
  63. Hembree, David R.; Farnworth, Warren M., Underfill and encapsulation of semiconductor assemblies with materials having differing properties.
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