이 특허를 인용한 특허 (76)

1. Lutz, Markus; Partridge, Aaron; Kronmueller, Silvia, Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same.

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2. Lutz,Markus; Partridge,Aaron; Kronmueller,Silvia, Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same.

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3. Fleming James G., Bistable microelectromechanical actuator.

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4. Eaton William P. ; Staple Bevan D. ; Smith James H., Capacitance pressure sensor.

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5. Uhland, Scott A.; Polito, Benjamin F.; Maloney, John M.; Sheppard, Jr., Norman F.; Herman, Stephen J.; Yomtov, Barry M., Containment device with multi-layer reservoir cap structure.

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6. Uhland,Scott A.; Polito,Benjamin F.; Maloney,John M.; Sheppard, Jr.,Norman F.; Herman,Stephen J.; Yomtov,Barry Y., Controlled release device and method using electrothermal ablation.

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7. Uhland,Scott A.; Polito,Benjamin F.; Maloney,John M.; Sheppard, Jr.,Norman F.; Herman,Stephen J.; Yomtov,Barry Y., Controlled release device and method using electrothermal ablation.

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8. Gillot, Charlotte; Sillon, Nicolas; Lagoutte, Emmanuelle, Device comprising an encapsulated microsystem and production method thereof.

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9. Santini, Jr.,John T.; Sheppard, Jr.,Norman F.; Young,Chung Chang; Langer,Robert S., Device for the controlled exposure of reservoir-based sensors.

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10. Sheppard, Jr., Norman F.; Santini, Jr., John T., Electrochemical biosensors and arrays.

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11. Koch, Daniel J.; Gogoi, Bishnu Prasanna; Roop, Raymond M., Electronic component.

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12. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.

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13. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.

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14. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.

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15. Santini, Jr., John T.; Sheppard, Jr., Norman F., Implantable medical device for diagnostic sensing.

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16. Santini, Jr., John T.; Cima, Michael J.; Sheppard, Jr., Norman F.; Herman, Stephen J., Implantable, tissue conforming drug delivery device.

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17. Martin, John R.; Morrison, Jr., Richard H., In-situ cap and method of fabricating same for an integrated circuit device.

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18. Lemkin, Mark A.; Clark, William A.; Juneau, Thor; Roessig, Allen W., Low-resistivity microelectromechanical structures with co-fabricated integrated circuit.

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19. Ma,Qing; Cheng,Peng; Rao,Valluri, MEMS device integrated chip package, and method of making same.

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20. Santini, Jr.,John T.; Sheppard, Jr.,Norman F., Medical device and method for diagnostic sensing.

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21. Yomtov, Barry M.; Herman, Stephen J.; Santini, Jr., John T., Medical device for neural stimulation and controlled drug delivery.

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22. Santini, Jr., John T.; Herman, Stephen J., Medical device for sensing glucose.

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23. Santini, Jr., John T.; Sheppard, Jr., Norman F.; Young, Chung Chang; Langer, Robert S., Medical device with reservoir-based sensors.

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24. Lutz,Markus; Partridge,Aaron, Method for adjusting the frequency of a MEMS resonator.

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25. Lutz,Markus; Partridge,Aaron, Method for adjusting the frequency of a MEMS resonator.

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26. Heuvelman, Willem Matthijs, Method for containing a device and a corresponding device.

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27. Heuvelman, Willem Matthijs, Method for containing a device and a corresponding device.

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28. Barron Carole C. ; Fleming James G. ; Montague Stephen, Method for integrating microelectromechanical devices with electronic circuitry.

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29. Santini, Jr., John T.; Sheppard, Jr., Norman F.; Langer, Robert S.; Young, Chung Chang, Method for making reservoir-based sensor device.

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30. Santini, Jr., John T.; Sheppard, Jr., Norman F.; Langer, Robert S.; Young, Chung Chang, Method for operating a reservoir-based sensor device.

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31. Bryce, George; Severi, Simone; Verheyen, Peter, Method for selective deposition of a semiconductor material.

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32. Sheppard, Jr., Norman F.; Santini, Jr., John T.; Cima, Michael J.; Langer, Robert S.; Ausiello, Dennis, Method for wirelessly monitoring implanted medical device.

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33. Santini, Jr., John T.; Cima, Michael J.; Langer, Robert S.; Ausiello, Dennis; Sheppard, Jr., Norman F., Method of actuating implanted medical device.

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34. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Method of fabricating electromechanical device having a controlled atmosphere.

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35. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Method of fabricating microelectromechanical systems and devices having trench isolated contacts.

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36. David J. Collins ; Craig E. Core ; Lawrence E. Felton ; Jing Luo, Method of forming a cover cap for semiconductor wafer devices.

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37. Kim,Hong Ki; Oh,Jae Hee; Youn,Kwan Young, Method of forming semiconductor device with capacitor.

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38. Santini, Jr., John T.; Cima, Michael J.; Langer, Robert S.; Ausiello, Dennis; Sheppard, Jr., Norman F., Method of opening reservoir of containment device.

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39. Renault, Mickael, Method of sealing a cavity.

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40. Sheppard, Jr.,Norman F.; Santini, Jr.,John T.; Herman,Stephen J.; Cima,Michael J.; Langer,Robert S.; Ausiello,Dennis, Microchip reservoir devices using wireless transmission of power and data.

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41. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed and methods for fabricating same.

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42. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same.

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43. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same.

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44. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems and devices having thin film encapsulated mechanical structures.

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45. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems having trench isolated contacts, and methods for fabricating same.

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46. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems, and devices having thin film encapsulated mechanical structures.

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47. Brosnihan Timothy J. ; Bustillo James ; Clark William A., Microfabricated high aspect ratio device with an electrical isolation trench.

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48. Clark William A. ; Juneau Thor N. ; Roessig Allen W. ; Lemkin Mark A., Microfabricated structures with electrical isolation and interconnections.

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49. William A. Clark ; Mark A. Lemkin ; Thor N. Juneau ; Allen W. Roessig, Microfabricated structures with trench-isolation using bonded-substrates and cavities.

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50. William A. Clark, Microfabrication using germanium-based release masks.

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51. Fazzio,R. Shane; Dungan,Thomas E., Monolithic vertical integration of an acoustic resonator and electronic circuitry.

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52. Santini, Jr., John T.; Sbiaa, Zouhair; Coppeta, Jonathan R.; Uhland, Scott A.; Sheppard, Jr., Norman F., Multi-cap reservoir devices for controlled release or exposure of reservoir contents.

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53. Barnes, Stephen Matthew; Miller, Samuel Lee; Rodgers, Murray Steven, Multi-level shielded multi-conductor interconnect bus for MEMS.

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54. Barnes, Stephen Matthew; Miller, Samuel Lee; Rodgers, Murray Steven, Multi-level shielded multi-conductor interconnect bus for MEMS.

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55. Santini, Jr., John T.; Sbiaa, Zouhair; Coppeta, Jonathan R.; Uhland, Scott A.; Sheppard, Jr., Norman F., Multi-opening reservoir devices for controlled release or exposure of reservoir contents.

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56. Damian Hajduk ; Eric Carlson ; Ravi Srinivasan, Rheometer for rapidly measuring small quantity samples.

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57. Hajduk, Damian; Carlson, Eric; Srinivasan, Ravi, Rheometer for rapidly measuring small quantity samples.

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58. Hajduk, Damian; Carlson, Eric; Srinivasan, Ravi, Rheometer for rapidly measuring small quantity samples.

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59. Hajduk, Damian; Carlson, Eric; Srinivasan, Ravi, Rheometer for rapidly measuring small quantity samples.

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60. Hajduk, Damian; Carlson, Eric; Srinivasan, Ravi, Rheometer for rapidly measuring small quantity samples.

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61. Renault, Mickael, Sealed cavity.

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62. Iwakiri Takashi,JPX, Self-planarizing DRAM chip avoids edge flaking.

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63. Rodgers, Murray Steven; Miller, Samuel Lee, Self-shadowing MEM structures.

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64. Rodgers, Murray Steven; Miller, Samuel Lee, Self-shadowing MEM structures.

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65. Bergstrom Paul L. ; Ger Muh-Ling, Semiconductor device having a cavity and method of making.

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66. Kneezel,Gary A.; Lebens,John A.; Delametter,Christopher N.; Trauernicht,David P.; Chwalek,James M., Substrate etching method for forming connected features.

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67. Lacey, Joseph Damian Gordon; Renault, Mickael; Joshi, Vikram; Bobey, James F.; Van Kampen, Robertus P., System and method of encapsulation.

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68. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.

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69. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.

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70. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.

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71. Hajduk,Damian; Carlson,Eric; Srinivasan,Ravi, Tether plate sensor for measuring physical properties of fluid samples.

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72. Santini, Jr.,John T.; Cima,Michael J.; Uhland,Scott Albert, Thermally-activated reservoir devices.

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73. Freidhoff, Carl B., Thin film encapsulation of MEMS devices.

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74. Freidhoff,Carl B., Thin film encapsulation of MEMS devices.

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75. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Wafer encapsulated microelectromechanical structure.

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76. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Wafer encapsulated microelectromechanical structure and method of manufacturing same.

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