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Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-009/00
출원번호 US-0317621 (1994-09-26)
우선권정보 JP-0322823 (1990-11-28)
발명자 / 주소
  • Ohashi Shingeo (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Hatada Toshio (Tsuchiura JPX) Matsushima Hitoshi (Ryugasaki JPX) Sato Motohiro (Ibaraki JPX) Inouye Hir
출원인 / 주소
  • Hitachi, Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 70  인용 특허 : 0

초록

An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members for thermally connecting semiconductor devices whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards onto which the semicond

대표청구항

An electronic computer with a cooling system, comprising: means for attaching circuit devices including a plurality of semiconductor devices disposed on boards for constructing the electronic computer; a housing for enclosing said attaching means; cooling means including a volatile cooling fluid whi

이 특허를 인용한 특허 (70)

  1. Ishimine Junichi,JPX ; Suzuki Masahiro,JPX, Air-cooled electronic apparatus.
  2. Myers, Alan M.; List, R. Scott; Vandentop, Gilroy J., Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package.
  3. Myers,Alan M.; List,R. Scott; Vandentop,Gilroy J., Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package.
  4. Dibene, II, Joseph T.; Hartke, David H.; Derian, Edward J.; Hoge, Carl E.; Broder, James M.; San Andres, Jose B.; Riel, Joseph S., Apparatus for delivering power to high performance electronic assemblies.
  5. Joseph Ted Dibene, II ; David H. Hartke ; James Hjerpe Kaskade ; Carl E. Hoge, Apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  6. Tsuji Hiroyuki,JPX ; Kato Keiichi,JPX, Apparatus for radiating heat for use in computer system.
  7. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Closed-loop microchannel cooling system.
  8. Manole,Dan M.; Coffey,Donald L.; Moore,Michael J., Compact refrigeration system for providing multiple levels of cooling.
  9. Tian, Fang; Liang, Zhi-Chun; He, Xiang-Wei, Computer case with dehumidification.
  10. Montgomery, Stephen W.; Faneuf, Barrett M., Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component.
  11. Faneuf, Barrett M.; Holalkere, Ven R.; Montgomery, Stephen W., Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure.
  12. Santiago,Juan G.; Zeng,Shulin, Control of electrolysis gases in electroosmotic pump systems.
  13. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Cooled IC chip modules with an insulated circuit board.
  14. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cooling computer systems.
  15. Hisano,Katsumi; Takamatsu,Tomonao; Iwasaki,Hideo, Cooling device for electronic element producing concentrated heat and electronic device.
  16. Littrup, Peter J.; Babkin, Alexei V.; Duncan, Robert V.; Kerkar, Pramod; Boldarev, Sergey T., Cryotherapy probe.
  17. Littrup, Peter J.; Babkin, Alexei V.; Duncan, Robert V.; Kerkar, Pramod; Boldarev, Sergey T., Cryotherapy probe.
  18. Littrup,Peter J.; Babkin,Alexei V.; Duncan,Robert V.; Kerkar,Pramod; Boldarev,Sergey T., Cryotherapy probe.
  19. Littrup,Peter J.; Babkin,Alexei V.; Duncan,Robert; Boldarev,Sergey, Cryotherapy system.
  20. Littrup,Peter J.; Babkin,Alexei V.; Duncan,Robert; Boldarov,Sergei, Cryotherapy system.
  21. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Dehumidified cooling assembly for IC chip modules.
  22. Goodson, Kenneth E.; Chen, Chuan-Hua; Huber, David E.; Jiang, Linan; Kenny, Thomas W.; Koo, Jae-Mo; Laser, Daniel J.; Mikkelsen, James C.; Santiago, Juan G.; Wang, Evelyn Ning-Yi; Zeng, Shulin; Zhang, Electroosmotic microchannel cooling system.
  23. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  24. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  25. Stauder, Frank A.; Naish, David J., Embedded electronics for high convection cooling in an engine cooling motor application.
  26. Faneuf,Barrett M.; De Lorenzo,David S., Frame-level thermal interface component for transfer of heat from an electronic component of a computer system.
  27. Faneuf,Barrett M.; De Lorenzo,David S., Frame-level thermal interface component for transfer of heat from an electronic component of a computer system.
  28. Ekstedt, Ulf; Johansson, Mikael, Heat conducting mounting structure, method and radio base station housing arrangement for mounting electronic modules.
  29. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Heated PCB interconnect for cooled IC chip modules.
  30. Bhate, Suresh K.; Cestra, John; Harrington, Christopher B.; Hoogenboom, Leo, High power density inverter and components thereof.
  31. Al-Garni, Ahmed Z.; Hawwa, Muhammad A., Hybrid cooling system and method for cooling electronic devices.
  32. Hoss, Shawn Paul; Artman, Paul Theodore, Information handling system cooling system.
  33. Hartke, David H.; DiBene, II, Joseph Ted, Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems.
  34. Dibene ; II Joseph Ted ; Hartke David, Inter-circuit encapsulated packaging.
  35. Joseph Ted DiBene, II ; David Hartke, Inter-circuit encapsulated packaging for power delivery.
  36. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Low thermal conductance insulated cooling assembly for IC chip modules.
  37. Evans Richard J. ; Gardell David L. ; Palagonia Anthony M., Method and apparatus for cooling an electronic device.
  38. Spearing, Ian, Method and apparatus for equalizing a pumped refrigerant system.
  39. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  40. DiBene, II,Joseph T.; Hartke,David H.; Kaskade,James J. Hjerpe; Hoge,Carl E., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  41. Ike, Hidetoshi; Okuhata, Nao, Method for extracting water from air, and device therefor.
  42. Littrup, Peter J.; Babkin, Alexei V.; Duncan, Robert; Boldarev, Sergey, Methods and systems for cryogenic cooling.
  43. Littrup,Peter J.; Babkin,Alexei V.; Duncan,Robert; Boldarev,Sergey, Methods and systems for cryogenic cooling.
  44. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
  45. Chesser, Jason B.; Faneuf, Barrett M.; Montgomery, Stephen W., Modular capillary pumped loop cooling system.
  46. Chesser,Jason B.; Faneuf,Barrett M.; Montgomery,Stephen W., Modular capillary pumped loop cooling system.
  47. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Moisture barrier seals for cooled IC chip module assemblies.
  48. Patrick K. Sullivan, Moisture control system for electrical devices.
  49. Liu, Wanhui, Multi-functional semiconductor refrigerating and warming dual-purpose box and manufacturing method.
  50. Van Brocklin Andrew L. ; Bausch James F. ; Sterner John R., Multi-mode heat transfer using a thermal heat pipe valve.
  51. Van Brocklin Andrew L. ; Bausch James F. ; Sterner John R., Multi-mode heat transfer using a thermal heat pipe valve.
  52. Kim,Sarah E.; List,R. Scott; Maveety,James G.; Myers,Alan M.; Vu,Quat T., Packaged electroosmotic pumps using porous frits for cooling integrated circuits.
  53. Cathey David A., Portable computer with selectively operable cooling unit.
  54. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Everett, Jr., George Carl, Power conditioning module.
  55. Iwanczyk,Jan S.; Saveliev,Valeri D.; Barkan,Shaul, Radiation detector system having heat pipe based cooling.
  56. Maul,Joachim, Refrigerating appliance comprising a refrigerant circulation device.
  57. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
  58. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.
  59. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Spot cooling evaporator cooling system for integrated circuit chip modules.
  60. Belady Christian L, Sub-cooled processor and companion voltage regulator.
  61. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  62. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Kim, John J.; Chaplinsky, Robert C.; Everett, Jr., George Carl, System including power conditioning modules.
  63. Faneuf,Barrett; Aldridge,Tomm, Systems to cool multiple electrical components.
  64. Thomas C. Douglass ; Thomas Alan E., Thermal and power management for computer systems.
  65. Thomas,C. Douglas; Thomas,Alan E., Thermal and power management for computer systems.
  66. Thomas,C. Douglass; Thomas,Alan E., Thermal and power management for computer systems.
  67. Thomas,C. Douglass; Thomas,Alan E., Thermal and power management for computer systems.
  68. Thomas,C. Douglass; Thomas,Alan E., Thermal and power management for computer systems.
  69. C. Douglass Thomas ; Alan E. Thomas, Thermal and power management to computer systems.
  70. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
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