이 특허를 인용한 특허 (44)

1. Wisniewski, Andrew J., Alternate vent hole sealing method.

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2. Nelle, Peter; Stecher, Matthias, Apparatus and method configured to lower thermal stresses.

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3. Nelle, Peter; Stecher, Matthias, Apparatus and method configured to lower thermal stresses.

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4. Nelle, Peter; Stecher, Matthias, Apparatus and method configured to lower thermal stresses.

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5. Bauer, Michael; Woerner, Holger; Jerebic, Simon, Device including a housing for a semiconductor chip including leads extending into the housing.

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6. Joo, Sung Chul; Hussell, Christopher P., High brightness LED package.

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7. Joo, Sung Chul; Hussell, Christopher P., High brightness LED package.

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8. Hussell, Christopher P.; Joo, Sung Chul, High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion.

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9. Hussell, Christopher P., LED package with efficient, isolated thermal path.

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10. Ford B. Grigg ; Warren M. Farnworth, LOC semiconductor assembled with room temperature adhesive.

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11. Ford B. Grigg ; Warren M. Farnworth, LOC semiconductor assembled with room temperature adhesive.

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12. Grigg Ford B. ; Farnworth Warren M., LOC semiconductor assembled with room temperature adhesive.

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13. Grigg Ford B. ; Farnworth Warren M., LOC semiconductor assembled with room temperature adhesive.

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14. Grigg, Ford B.; Farnworth, Warren M., LOC semiconductor assembled with room temperature adhesive.

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15. Grigg, Ford B.; Farnworth, Warren M., LOC semiconductor assembled with room temperature adhesive.

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16. Wang, Chin-Fa; Hsieh, Wan-Jung; Hsu, Yu-Mei, Leadframe and semiconductor package having downset baffle paddles.

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17. Hussell, Christopher P.; Joo, Sung Chul, Light emitting device packages with improved heat transfer.

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18. Hussell, Christopher P.; Joo, Sung Chul; Pyles, Robert S., Light emitting device packages with improved heat transfer.

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19. Emerson, David T.; Hussell, Christopher P.; Joo, Sung Chul, Light emitting device packages, systems and methods.

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20. Hussell, Christopher P.; Emerson, David T.; Britt, Jeffrey C., Light emitting devices and methods.

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21. Emerson, David T.; Bergmann, Michael J.; Hussell, Christopher P., Light emitting diode (LED) devices, systems, and methods.

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22. Joo, Sung Chul; Hussell, Christopher P., Light emitting diode (LED) packages, systems, devices and related methods.

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23. Yeh, Wei-Yu; Ko, Pei-Wen; Sun, Chih-Hsuan; Fu, Hsueh-Hung, Light emitting diode carrier.

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24. Geoffrey Dearnaley ; Mark Van Dyke, Lubricious diamond-like carbon coatings.

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25. Robinson Peter W. ; Mahulikar Deepak ; Hoffman Paul R., Metal ball grid electronic package having improved solder joint.

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26. Dearnaley, Geoffrey; Van Dyke, Mark, Method for producing a lubricious amorphous carbon film.

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27. Peterson, Kenneth A.; Watson, Robert D., Method of fabricating a microelectronic device package with an integral window.

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28. Grigg, Ford B.; Farnworth, Warren M., Method of manufacturing LOC semiconductor assembled with room temperature adhesive.

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29. Grigg, Ford B.; Farnworth, Warren M., Method of manufacturing LOC semiconductor assembled with room temperature adhesive.

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30. Joo, Sung Chul; Hussell, Christopher P., Package for light emitting diode (LED) lighting.

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31. Dearnaley Geoffrey ; Lukezich Stephen J., Porous anodized aluminum surfaces sealed with diamond-like carbon coatings.

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32. Kim, Kwang Soo; Park, Ji Hyun; Lee, Young Ki; Choi, Seog Moon, Power module package and method for fabricating the same.

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33. Chou, Shih; Felstein, Steven R.; Lo, Ching P.; Huang, Daniel A.; Fanucchi, Richard; Mayhew, Gregory L.; Simanyi, Lydia H., Preparation of passivated chip-on-board electronic devices.

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34. Rodriguez Louis ; Dearnaley Geoffrey, Preventing radioactive contamination of porous surfaces.

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35. Yoshida, Hiroshi; Tojo, Tsuyoshi; Ozawa, Masafumi, Semiconductor device and package with high heat radiation effect.

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36. Hiroshi Yoshida JP; Tsuyoshi Tojo JP; Masafumi Ozawa JP, Semiconductor device package, and fabrication method thereof.

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37. Sean T. Crowley ; Bradley D. Boland, Semiconductor package having multiple dies with independently biased back surfaces.

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38. Kim Jin Sung,KRX, Semiconductor package substrate and ball grid array (BGA) semiconductor package using same.

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39. Hussell, Christopher P., Solid state lighting device.

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40. Hussell, Christopher P., Solid state lighting device.

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41. Hussell, Christopher P.; Abare, Amber C.; Reiherzer, Jesse Colin, Solid state lighting devices and methods.

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42. Fukushima, Daisuke, Surface mounting package.

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43. Crowley Sean Timothy ; Boland Bradley David, Thin leadframe-type semiconductor package having heat sink with recess and exposed surface.

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44. Suzuki, Shinsuke, Wire bonding method.

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