[특허]Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor

Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	F28F-009/26
출원번호	US-0173495 (1993-12-23)
발명자 / 주소	Lopez Roger (Louisville CO)
출원인 / 주소	Storage Technology Corporation (Louisville CO 02)
인용정보	피인용 횟수 : 58 인용 특허 : 0

초록 ▼

An assembly, and associated method, for dissipating thermal energy contained in a circuit element of an electrical circuit which is releasably connectable with a substrate to form an electrical connection with the substrate when connected therewith. A fluid conduit extends through a plate member which is positionable proximate to the circuit element to be moveable therewith. The fluid conduit is coupled to a fluid manifold when the electrical circuit forms the electrical connection with the substrate. Coolant fluid is supplied to the manifold and, when the fluid conduit is coupled to the fluid manifold, also the fluid conduit. Thermal energy generated during operation of the electrical circuit is transferred to the coolant fluid flowing through the fluid conduit. The location of the fluid conduit is repositionable responsive to reconfiguration of the electrical circuit.

대표청구항 ▼

An assembly for dissipating thermal energy within an electrical circuit element that includes a first electrical connector, said circuit element being physically mounted on a substrate to electrically cooperate therewith by operation of a second electrical connector that is carried by said substrate and is mateable with said first electrical connector, said assembly comprising: a cooling plate member positioned proximate to said circuit element and physically moveable as a unit with said circuit element; a fluid conduit formed to extend through said plate member, said fluid conduit having a fluid inflow end and a fluid outflow end; a fluid manifold positioned on said substrate, said fluid manifold having a fluid inflow portion and a fluid outflow portion; first normally closed and manually openable fluid flow coupler means for coupling said inflow end of said fluid conduit to said inflow portion of said manifold, said first coupler means having a first member physically associated with said first electrical connector element and having a second member physically associated with said second electrical connector; second normally closed and manually openable fluid flow coupler means for coupling said outflow end of said fluid conduit to said outflow portion of said manifold, said second first coupler means having a first member physically associated with said first electrical connector and having a second member physically associated with said second electrical connector; said first and second coupler means operating such that when said circuit element is mounted on said substrate said first and second members of said first and second coupler means are concomitantly coupled and said first and second coupler means are concomitantly opened to facilitate fluid flow therethrough; and a supply of cooling fluid connected to said manifold, said supply of cooling fluid operating to supply cooling fluid to said inflow portion of said manifold when said circuit element is mounted on said substrate.

이 특허를 인용한 특허 (58)

Tanaka Tetsuya,JPX ; Hatada Toshio,JPX ; Atarashi Takayuki,JPX ; Kobayashi Junichi,JPX ; Takanashi Akihiro,JPX ; Daikoku Takahiro,JPX ; Watanabe Yutaka,JPX ; Zushi Shizuo,JPX, Air-cooled electronic apparatus with condensation prevention.
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Pikovsky, Anatoly; Roemer, Andrew, Apparatus and method for circuit board liquid cooling.
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Arimilli, Ravi K.; Ellsworth, Jr., Michael J.; Seminaro, Edward J., Convergence of air water cooling of an electronics rack and a computer room in a single unit.
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Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
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Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
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Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
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Sharp,Anthony C.; Hudz,Andrew; Jeffery,Peter, Cooling airflow distribution device.
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Sharp,Anthony C.; Hudz,Andrew; Jeffery,Peter, Cooling airflow distribution device.
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Espersen,Morten; Kristensen,Thorben, Cooling arrangement for an integrated circuit.
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Chandrakant D. Patel, Cooling arrangement for high performance electronic components.
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Nicolai,Michael; D철rrich,Martin, Cooling array.
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Beck, Paul J.; Beck, Maxwell J., Cooling device for computer hard drive.
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Spearing, Ian, Cooling fluid flow regulation distribution system and method.
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Spearing, Ian, Cooling fluid flow regulation distribution system and method.
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Cosley,Michael R.; Fischer,Richard L., Cooling system for densely packed electronic components.
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Day, Tony, Data center cooling.
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Day, Tony, Data center cooling.
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Day, Tony, Data center cooling.
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Day, Tony, Data center cooling.
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Day, Tony, Data center cooling.
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Grundbacher, Johann, Device for cooling electric or electronic devices.
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Pfister, Dennis M.; Byrd, Charles M.; Davidson, Howard L., Distributed graphitic foam heat exchanger system.
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Harvey,Rex J.; Hodges,Richard B.; Marban,Joseph, Dual purpose alignment and fluid coupling.
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Kondo, Yoshihiro; Ohashi, Shigeo; Minamitani, Rintaro; Naganawa, Takashi; Yoshitomi, Yuji; Nakanishi, Masato; Sasaki, Yasuhiko; Nakagawa, Tsuyoshi; Suzuki, Osamu; Matsushita, Shinji; Yamada, Yasunori, Electronic equipment.
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Kondo,Yoshihiro; Ohashi,Shigeo; Minamitani,Rintaro; Naganawa,Takashi; Yoshitomi,Yuji; Nakanishi,Masato; Sasaki,Yasuhiko; Nakagawa,Tsuyoshi; Suzuki,Osamu; Matsushita,Shinji; Yamada,Yasunori, Electronic equipment.
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Arimilli, Ravi K.; Ellsworth, Jr., Michael J.; Seminaro, Edward J., Environmental control of liquid cooled electronics.
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Eriksen, Andre Sloth; Krog, Mikael; Hunskjaer, Jan, Fluid connector for a cooling system.
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Alexander Arthur Ray ; Porter ; deceased Warren W., Focused air cooling employing a dedicated chiller.
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Lee, Mario John Dominic, Heat dissipating system.
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Teneketges,Nicholas J.; Kwok,Tarzen, Heat exchange apparatus with parallel flow.
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Brand, Joseph Horace; Dooley, Kevin Allan; Walters, Cameron Todd; Dowhan, Michael, Heat exchange device and method.
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Muller, Christian; Dupin, Jean-Louis; Heitzler, Jean-Claude, Heat exchanger with interface plate forming a fluid circuit.
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Takemura, Keizou; Wei, Jie; Yamada, Mitsutaka; Aoki, Michimasa; Suzuki, Masumi, Information processing device and cooling unit.
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L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.
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Wong, Suzanne Marye; Cornes, Martin Peter John; Tufford, Robert Charles, Integrated thermal inserts and cold plate.
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Wong, Suzanne Marye; Cornes, Martin Peter John; Tufford, Robert Charles, Integrated thermal inserts and cold plate.
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Hamman,Brian A., Liquid cooling system.
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Nicolai, Michael; Dörrich, Martin; Strackbein, Heinrich; Hain, Markus; Kreiling, Jörg, Liquid cooling system.
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Toftloekke, Mikkel Block; Lykke, Peter; Kristensen, Poul Hove, Liquid cooling system for an electronic system.
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Corrado,Joseph P.; Eberth,John F.; Mazzuca,Steven J.; Schmidt,Roger R.; Tsukamoto,Takeshi, Method and apparatus for cooling electronic components.
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Weber, Richard M.; Wyatt, William G.; Rummel, Kerrin A., Method and apparatus for cooling electronics with a coolant at a subambient pressure.
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Patel,Chandrakant D.; Bash,Cullen E., Method and apparatus for cooling heat generating components.
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Krasnov, Yuriy K., Method and system for cooling of integrated circuits.
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Walters,Joseph Douglass; Stefanoski,Zoran; Lee,Tommy C., Modular, scalable thermal solution.
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Farrar, Paul A.; Eldridge, Jerome M., Multi-chip electronic package and cooling system.
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Farrar, Paul A.; Eldridge, Jerome M., Multi-chip electronic package and cooling system.
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Farrar, Paul A.; Eldridge, Jerome M., Multi-chip electronic package and cooling system.
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Farrar, Paul A.; Eldridge, Jerome M., Multiple chip stack structure and cooling system.
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Chou,Der Jeou; Nelson,Daniel Todd, Phase-change heat reservoir device for transient thermal management.
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Breinlinger, Keith; Ostertag, Edward; Sartschev, Ronald A.; Teneketges, Nicholas J., Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment.
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Rodriguez, Jean-Michel, Scalable panel cooling system.
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Rodriguez, Jean-Michel, Scalable panel cooling system.
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Bash,Cullen E.; Simon,Glenn C.; Malone,Christopher G.; Sharma,Ratnesh K., Small form factor liquid loop cooling system.
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Cosley, Michael R.; Fischer, Richard L.; Thiesen, Jack H.; Willen, Gary S., Small scale chip cooler assembly.
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Wyatt, William G.; Weber, Richard M., System and method for separating components of a fluid coolant for cooling a structure.
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Stefanoski, Zoran; Kim, Jeong H., System for efficiently cooling a processor.
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Farrar,Paul A., Three-dimensional multichip module.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor 원문보기

초록 ▼

대표청구항 ▼

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연합인증

Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor 원문보기

초록 ▼

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연구과제 타임라인

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이 특허를 인용한 특허 (58)

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