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Selective metallization process 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G03F-007/16
출원번호 US-0520554 (1995-08-29)
발명자 / 주소
  • Calabrese Gary S. (North Andover MA) Calvert Jeffrey M. (Burke VA) Chen Mu-San (Ellicott MD) Dressick Walter J. (Fort Washington MD) Dulcey Charles S. (Washington DC) Georger
  • Jr. Jacque H. (Holden
출원인 / 주소
  • Shipley Company Inc. (Marlborough MA 02)
인용정보 피인용 횟수 : 175  인용 특허 : 0

초록 ▼

The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate re

대표청구항 ▼

An article of manufacture comprising a substrate having a layer of a ligating material over its entire surface, a layer of an organic material having recesses defined therein over said substrate and said ligating material and a metal coating over a portion of said substrate in a selected pattern con

이 특허를 인용한 특허 (175)

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