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Thermoplastic hotmelt adhesive 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08K-005/01
  • C08L-091/08
  • C08L-023/00
출원번호 US-0381846 (1995-02-06)
우선권정보 DE-4226081 (1992-08-06)
국제출원번호 PCT/EP93/02019 (1993-07-29)
§371/§102 date 19950206 (19950206)
국제공개번호 WO-9403548 (1994-02-17)
발명자 / 주소
  • Butterbach Ruediger (Essen DEX) Kopannia Siegfried (Duesseldorf DEX) Andres Johannes (Hilden DEX)
출원인 / 주소
  • Henkel Kommanditgesellschaft auf Aktien (Duesseldorf DEX 03)
인용정보 피인용 횟수 : 62  인용 특허 : 0

초록 ▼

A thermoplastic hot-melt adhesive based on a polymer blend of polyolefins is disclosed. An oligomer of an alpha-olefin with at least eight carbon atoms in the monomer and a molecular weight of the oligomer of up to 5,000, as well as other known additives, are added to the known mixture of a substant

대표청구항

A thermoplastic hotmelt adhesive comprising a blend of polyolefins, which comprises: A) a substantially amorphous poly-aaa8 to 16 carbon atoms in the monomer, the oligomer having a molecular weight of up to 5,000; and D) additives.

이 특허를 인용한 특허 (62)

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  24. Stumphauzer,William C.; Parker,Anthony A., Hybrid plastisol/hot melt compositions.
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