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Method for encapsulating light emitting diodes 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/60
출원번호 US-0376174 (1995-01-20)
발명자 / 주소
  • Broom Ronald F. (Zurich CHX)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 105  인용 특허 : 0

초록

A method of encapsulating semiconductor light emitting diodes, in particular laser diodes, characterized in that a gap is formed in an encapsulant, which is positioned in front of the light emitting facet of the diode, the gap preventing the encapsulant from adhering to the light emitting facet.

대표청구항 ▼

A method for encapsulating a laser diode provided with a mirror facet, comprising the steps of: a) bonding the laser diode to a mounting base and placing a foil in front of the mirror facet; b) sealing the laser diode with a first encapsulant so that the foil acts as a dam; c) removing the foil afte

이 특허를 인용한 특허 (105)

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  3. Acklin, Bruno; Sp?th, Werner; Gr?tsch, Stefan, Array with light-emitting power semiconductor component and corresponding production method.
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  4. Pederson, John C., Building illumination apparatus with integrated communications, security and energy management.
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  5. Pederson, John C., Building illumination apparatus with integrated communications, security and energy management.
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  6. Pederson, John C., Building illumination apparatus with integrated communications, security and energy management.
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  7. Enquist, Paul M., Conductive barrier direct hybrid bonding.
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  8. Enquist, Paul M., Conductive barrier direct hybrid bonding.
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  9. Zyung Tae Hyoung,KRX ; Hwang Do Hoon,KRX ; Jung Sang Don,KRX, Encapsulation method of a polymer or organic light emitting device.
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  10. Biebuyck Hans,CHX ; Haskal Eliav,CHX, Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives.
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  19. Pederson, John C.; Brown, Paul R.; Vogt, Timothy J.; LeClaire, James; Zimmerman, James; Mikkelsen, Brent, LED light broad band over power line communication system.
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  20. Pederson, John C.; Brown, Paul R.; Vogt, Timothy J.; LeClaire, James; Zimmerman, James; Mikkelsen, Brent, LED light broad band over power line communication system.
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  22. Pederson, John C.; Brown, Paul R.; Vogt, Timothy J.; LeClaire, James; Zimmerman, James; Mikkelsen, Brent, LED light communication system.
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  23. Pederson, John C.; Brown, Paul R.; Vogt, Timothy J.; LeClaire, James; Zimmerman, James; Mikkelsen, Brent, LED light communication system.
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  24. Pederson, John C., LED light control and management system.
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  25. Pederson, John C., LED light control and management system.
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  26. Pederson, John C., LED light control and management system.
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  27. Pederson, John C., LED light control assembly and system.
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  28. Pederson, John C., LED light control assembly and system.
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  29. Pederson, John C.; Brown, Paul R.; Vogt, Timothy J., LED light dongle communication system.
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  30. Pederson, John C.; Brown, Paul R.; Vogt, Timothy J., LED light dongle communication system.
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  31. Pederson, John C.; Brown, Paul R.; Vogt, Timothy J., LED light dongle communication system.
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  32. Pederson, John; Brown, Paul R.; Vogt, Timothy J., LED light dongle communication system.
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  34. Pederson, John C., LED light fixture.
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  37. Pederson, John C., LED light global positioning and routing communication system.
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  38. Pederson, John C., LED light global positioning and routing communication system.
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  39. Pederson, John C.; Brown, Paul R.; Vogt, Timothy J.; LeClaire, James; Zimmerman, James; Mikkelsen, Brent, LED light interior room and building communication system.
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  40. Pederson, John C.; Brown, Paul R.; Vogt, Timothy J.; LeClaire, James; Zimmerman, James; Mikkelsen, Brent, LED light interior room and building communication system.
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  41. Pederson, John C.; Brown, Paul R.; Vogt, Timothy J.; LeClaire, James; Zimmerman, James; Mikkelsen, Brent, LED light interior room and building communication system.
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  84. Pederson,John C., Replaceable LED modules.
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  85. Pederson, John C., Replaceable led modules.
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  88. Pederson, John C., Replacement led lamp assembly and modulated power intensity for light source.
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  89. Tong, Qin Yi; Enquist, Paul M.; Rose, Anthony Scot, Room temperature metal direct bonding.
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  90. Tong, Qin-Yi; Enquist, Paul M.; Rose, Anthony Scot, Room temperature metal direct bonding.
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  91. Tong, Qin-Yi; Enquist, Paul M.; Rose, Anthony Scot, Room temperature metal direct bonding.
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  92. Pederson, John C., Rotational led reflector.
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  94. Jiang Wenbin ; Lebby Michael S. ; Gaw Craig A., Semiconductor laser package including a lead frame and plastic resin housing.
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  95. Pederson, John C., Strip LED light assembly for motor vehicle.
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  96. Pederson,John C., Strip LED light assembly for motor vehicle.
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  97. Pederson,John C., Strip LED light assembly for motor vehicle.
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  98. Enquist, Paul M., Three dimensional device integration method and integrated device.
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  99. Enquist, Paul M.; Fountain, Jr., Gaius Gillman, Three dimensional device integration method and integrated device.
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  100. Enquist, Paul M.; Fountain, Jr., Gaius Gillman, Three dimensional device integration method and integrated device.
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  101. Enquist,Paul M., Three dimensional device integration method and integrated device.
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  102. Pederson, John C., Visible light transceiver glasses.
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  103. Pederson, John C., Visible light transceiver glasses.
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  104. Enquist, Paul M.; Tong, Qin Yi; Fountain, Jr., Gaius Gillman; Markunas, Robert, Wafer bonding hermetic encapsulation.
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  105. Enquist, Paul M.; Tong, Qin-Yi; Fountain, Jr., Gaius Gillman; Markunas, Robert, Wafer bonding hermetic encapsulation.
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