이 특허를 인용한 특허 (50)

1. Lin, Mou-Shiung, Chip structure with a passive device and method for forming the same.

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2. Sapone, Giuseppina, Chip to package interface.

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3. Sapone, Giuseppina, Chip to package interface.

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4. Kie Y. Ahn ; Leonard Forbes, Coupled multilayer soft magnetic films for high frequency microtransformer for system-on-chip power supply.

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5. Tang, Yiwu; Jin, Zhang, High Q transformer disposed at least partly in a non-semiconductor substrate.

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6. Lin, Mou-Shiung, High performance IC chip having discrete decoupling capacitors attached to its IC surface.

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7. Lin, Mou-Shiung, High performance system-on-chip discrete components using post passivation process.

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8. Lin, Mou-Shiung, High performance system-on-chip discrete components using post passivation process.

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9. Lin, Mou-Shiung, High performance system-on-chip inductor using post passivation process.

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10. Lin, Mou-Shing, High performance system-on-chip using post passivation process.

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11. Lin, Mou-Shiung, High performance system-on-chip using post passivation process.

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12. Lee, Jong-Hoon; Song, Young Kyu; Yoon, Jung Ho; Jow, Uei Ming; Zhang, Xiaonan; Lane, Ryan David, High quality factor filter implemented in wafer level packaging (WLP) integrated device.

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13. Song, Young K.; Park, Yunseo; Zhang, Xiaonan; Lane, Ryan D.; Nejati, Babak; Hadjichristos, Aristotele; Chen, Xiaoming, High quality factor inductor implemented in wafer level packaging (WLP).

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14. Rofougaran, Ahmadreza (Reza), Inductively coupled integrated circuit with magnetic communication path and methods for use therewith.

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15. Dang, Bing; Knickerbocker, John U.; Liu, Yang, Integrated circuit (IC) test probe.

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16. Pagani, Alberto; Girlando, Giovanni, Integrated electronic device with transceiving antenna and magnetic interconnection.

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17. Pagani, Alberto; Girlando, Giovanni, Integrated electronic device with transceiving antenna and magnetic interconnection.

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18. Pagani, Alberto; Girlando, Giovanni, Integrated electronic device with transceiving antenna and magnetic interconnection.

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19. Kahlmann, Frank; Strzalkowski, Bernhard; Werner, Wolfgang, Integrated transformer configuration.

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20. Sin, Johnny Kin-On; Peng, Lulu; Wu, Rongxiang; Sumida, Hitoshi; Toyoda, Yoshiaki; Akahane, Masashi, Isolator and isolator manufacturing method.

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21. Sin, Johnny Kin On; Peng, Lulu; Wu, Rongxiang; Sumida, Hitoshi; Toyoda, Yoshiaki; Akahane, Masashi, Isolator and method of manufacturing isolator.

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22. Joshi, Rajeev, Leadframe based magnetics package.

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23. Ravid, Shmuel; Sover, Ra′anan, Method for integrated high Q inductors in FCGBA packages.

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24. Lin, Mou-Shiung; Lee, Jin-Yuan, Method for making high-performance RF integrated circuits.

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25. Lin, Mou-Shiung; Lee, Jin-Yuan, Method for making high-performance RF integrated circuits.

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26. Ahn, Kie Y.; Forbes, Leonard, Microtransformer for system-on-chip power supply.

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27. Ahn, Kie Y.; Forbes, Leonard, Microtransformer for system-on-chip power supply.

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28. Ahn,Kie Y.; Forbes,Leonard, Microtransformer for system-on-chip power supply.

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29. Sin, Johnny Kin On; Wu, Rongxiang; Hui, Ron Shu Yuen, Monolithic magnetic induction device.

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30. Lowther Rex E. ; Young William R., Parasitic current barriers.

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31. Lin, Mou-Shiung; Chou, Chiu-Ming; Chou, Chien-Kang, Post passivation interconnection process and structures.

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32. Lin, Mou-Shiung; Chou, Chiu-Ming; Chou, Chien-Kang, Post passivation interconnection structures.

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33. Nakagawa, Tomokatsu; Chikawa, Yasunori; Rai, Akiteru; Katoh, Tatsuya; Sugiyama, Takuya, Semiconductor device and display apparatus.

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34. Anzai,Noritaka; Terui,Makoto, Semiconductor device and method for fabricating the same.

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35. Anzai,Noritaka; Terui,Makoto, Semiconductor device and method for fabricating the same.

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36. Watanabe,Hiroto; Nakayama,Osamu; Shiratsuchi,Osamu; Daido,Kazuhiko, Semiconductor device having antenna connection electrodes.

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37. Jaouen Herve,FRX ; Marty Michel,FRX, Semiconductor device having separated exchange means.

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38. Freerk Van Rijs NL; Ronald Dekker NL, Semiconductor elements for semiconductor device.

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39. Hoyt, Reed W.; Lanza, John F., System and method for short range wireless communication.

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40. Babcock,Douglas W.; Duris,Robert A.; Hecht,Bruce, T-coil apparatus and method for compensating capacitance.

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41. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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42. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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43. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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44. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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45. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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46. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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47. Lin, Mou-Shiung, Top layers of metal for high performance IC's.

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48. Kim, Jonghae; Wang, Feng; Nowak, Matthew, Transformer signal coupling for flip-chip integration.

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49. Kim, Jonghae; Wang, Feng; Nowak, Matthew M., Transformer signal coupling for flip-chip integration.

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50. Josefosky, John T; Tang, Yiwu; Hayward, Roger, Transformer within wafer test probe.

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