$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Semiconductor device having a transistor, a ferroelectric capacitor and a hydrogen barrier film 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/68
출원번호 US-0238802 (1994-05-06)
우선권정보 JP-0220905 (1990-08-21)
발명자 / 주소
  • Takenaka Kazuhiro (Suwa JPX) Fujisawa Akira (Suwa JPX)
출원인 / 주소
  • Ramtron International Corporation (Colorado Springs CO 02)
인용정보 피인용 횟수 : 43  인용 특허 : 0

초록

A semiconductor device having a ferroelectric film or a polycrystalline silicon gate, a humidity-resistant hydrogen barrier film, like TiN film, TiON film, etc., formed by hydrogen non-emission film forming method over the ferroelectric film or the polycrystalline silicon gate.

대표청구항

A portion of an integrated circuit including a bonding pad comprising: an insulating layer located over said bonding pad; a humidity-resisting hydrogen barrier layer consisting of TiON located over said insulating layer; a contact hole located through said humidity-resisting hydrogen barrier layer a

이 특허를 인용한 특허 (43)

  1. Hickert George, Barrier layer to protect a ferroelectric capacitor after contact has been made to the capacitor electrode.
  2. Wu, Hui-Min; Wang, Ming-I; Wang, Kuan-Yu; Hsieh, Kun-Che; Huang, Chien-Hsin, Bond pad structure and fabricating method thereof.
  3. Maejima Yukihiko,JPX, Capacitor and method of manufacturing the same.
  4. Asano, Tetsuro; Hirai, Toshikazu; Higashino, Takayoshi; Hirata, Koichi; Sakakibara, Mikito, Compound semiconductor device with depletion layer stop region.
  5. Argos George ; Yamazaki Tatsuya,JPX, Dual-level metalization method for integrated circuit ferroelectric devices.
  6. Joseph D. Cuchiaro ; Carlos A. Paz de Araujo ; Larry D. McMillan, Ferroelectric integrated circuit having hydrogen barrier layer.
  7. Cuchiaro Joseph D. ; Furuya Akira,JPX ; Paz de Araujo Carlos A. ; Miyasaka Yoichi,JPX, Ferroelectric integrated circuit having low sensitivity to hydrogen exposure and method for fabricating same.
  8. Cuchiaro, Joseph D.; Furuya, Akira; Paz de Araujo, Carlos A.; Miyasaka, Yoichi, Ferroelectric integrated circuit having low sensitivity to hydrogen exposure and method for fabricating same.
  9. Cuchiaro Joseph D. ; Furuya Akira,JPX ; Paz de Araujo Carlos A. ; Miyasaka Yoichi,JPX, Ferroelectric integrated circuit with protective layer incorporating oxygen and method for fabricating same.
  10. Czabaj, Brian M.; Hart, III, James V.; Murphy, William J.; Nakos, James S., Hydrogen barrier liner for ferro-electric random access memory (FRAM) chip.
  11. Czabaj, Brian M.; Hart, III, James V.; Murphy, William J.; Nakos, James S., Hydrogen barrier liner for ferro-electric random access memory (FRAM) chip.
  12. Amiotti, Marco; Jung, Jae Hak; Boffito, Claudio, Integrated capacitive device with hydrogen degradable dielectric layer protected by getter layer.
  13. Cuchiaro, Joseph D.; Furuya, Akira; Paz de Araujo, Carlos A.; Miyasaka, Yoichi, Integrated circuit having self-aligned hydrogen barrier layer and method for fabricating same.
  14. Whitaker, Mark R.; Marentette, Leslie Joseph, Interrupt generation and acknowledgment for RFID.
  15. Whitaker, Mark R., Low power, low pin count interface for an RFID transponder.
  16. Yamagata Satoru,JPX ; Onishi Shigeo,JPX ; Kudo Jun,JPX, Manufacturing method of electrode.
  17. Ahn, Byoung Kwon; Park, Sung Hoon; Kim, Joon Ho, Method for fabricating a capacitor.
  18. Hopfner Joachim,DEX, Method for fabricating a semiconductor component.
  19. Cuchiaro Joseph D. ; Furuya Akira,JPX ; Paz de Araujo Carlos A. ; Miyasaka Yoichi,JPX, Method for fabricating ferroelectric integrated circuits.
  20. Lee Kyeong Bock,KRX ; Jin Sung Gon,KRX, Method for forming barrier metal layer of semiconductor device.
  21. Cuchiaro Joseph D. ; Furuya Akira,JPX ; Paz de Araujo Carlos A. ; Miyasaka Yoichi,JPX, Method of fabricating ferroelectric integrated circuit using dry and wet etching.
  22. Cuchiaro Joseph D. ; Furuya Akira,JPX ; Paz de Araujo Carlos A. ; Miyasaka Yoichi,JPX, Method of fabricating ferroelectric integrated circuit using oxygen to inhibit and repair hydrogen degradation.
  23. Rika Shinohara JP; Atsuhiro Tsukune JP; Hiroshi Kudo JP, Method of making ferroelectric film with protective cover film against hydrogen and moisture.
  24. Yukihiko Maejima JP, Method of manufacturing a ferroelectric capacitor.
  25. Inomata, Daisuke, Method of manufacturing ferroelectric capacitor.
  26. Hartner, Walter; Schindler, Gunther; Kastner, Marcus; Dehm, Christine, Method of producing a ferroelectric semiconductor memory.
  27. Hong Kwon,KRX, Methods for fabricating high dielectric capacitors of semiconductor devices.
  28. Gabric,Zvonimir; Hartner,Walter; Kr철nke,Matthias; Schindler,G체nther, Microelectronic structure having a hydrogen barrier layer.
  29. Whitaker, Mark R.; Greefkes, Kirk, RFID interface and interrupt.
  30. Nagano Yoshihisa,JPX ; Kutsunai Toshie,JPX ; Judai Yuji,JPX ; Uemoto Yasuhiro,JPX ; Fujii Eiji,JPX, Semiconductor device and method for fabricating the same.
  31. Nagano, Yoshihisa; Kutsunai, Toshie; Judai, Yuji; Uemoto, Yasuhiro; Fujii, Eiji, Semiconductor device and method for fabricating the same.
  32. Takahashi, Makoto; Nagai, Kouichi, Semiconductor device and method for manufacturing the same.
  33. Takahashi, Makoto; Nagai, Kouichi, Semiconductor device and method for manufacturing the same.
  34. Nagai, Kouichi; Sato, Katsuhiro; Sugawara, Kaoru; Takahashi, Makoto; Kudou, Masahito; Asai, Kazuhiro; Miyazaki, Yukimasa; Saigoh, Kaoru, Semiconductor device and method of fabricating the same.
  35. Amanuma Kazushi,JPX, Semiconductor device and method of manufacturing the same.
  36. Kazushi Amanuma JP, Semiconductor device and method of manufacturing the same.
  37. Takano, Tamae; Ohsawa, Nobuharu; Kato, Kiyoshi, Semiconductor device having an antenna.
  38. Takano, Tamae; Ohsawa, Nobuharu; Kato, Kiyoshi, Semiconductor device having antenna and sensor elements.
  39. Nagano,Yoshihisa; Ito,Toyoji; Imanishi,Sadayuki; Fujii,Eiji, Semiconductor device including a capacitor having a capacitive insulating film of an insulating metal oxide.
  40. Takano, Tamae; Ohsawa, Nobuharu; Kato, Kiyoshi, Semiconductor device with antenna and light-emitting element.
  41. Saigoh, Kaoru; Nagai, Kouichi, Semiconductor device with pads of enhanced moisture blocking ability.
  42. Saigoh, Kaoru; Nagai, Kouichi, Semiconductor device with pads of enhanced moisture blocking ability.
  43. Saigoh, Kaoru; Nagai, Kouichi, Semiconductor device with pads of enhanced moisture blocking ability.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로