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Fabrication and structures of circuit modules with flexible interconnect layers

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/60
출원번호 US-0321346 (1994-10-11)
발명자 / 주소
  • Cole Herbert S. (Burnt Hills NY) Fillion Raymond A. (Niskayuna NY) Gorowitz Bernard (Clifton Park NY) Kolc Ronald F. (Cherry Hill NJ) Wojnarowski Robert J. (Ballston Lake NY)
출원인 / 주소
  • Martin Marietta Corporation (Bethesda MD 02)
인용정보 피인용 횟수 : 216  인용 특허 : 0

초록

A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having c

대표청구항

A method for fabricating a flexible circuit module, comprising the steps of: providing a flexible base insulative layer having a first surface with a first patterned metallization layer and a second surface with a second patterned metallization layer and an outer insulative layer facing the first su

이 특허를 인용한 특허 (216)

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