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Integrated circuit cooling device having internal cooling conduit 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0274947 (1994-07-14)
발명자 / 주소
  • Paterson Robert W. (Seneca SC)
출원인 / 주소
  • AT&T Global Information Solutions Company (Dayton OH 02)
인용정보 피인용 횟수 : 43  인용 특허 : 0

초록

An apparatus for cooling an integrated circuit device includes a container defining a chamber that is partially filled with a coolant which forms a coolant pool in the chamber, wherein heat generated by the integrated circuit device causes boiling of the coolant in the coolant pool so that vaporized

대표청구항

An apparatus for cooling an electronic device, comprising: a container having a base positionable vertically above and in contact with said electronic device, and defining a chamber that is partially filled with a coolant which forms a coolant pool in the chamber above said container base, wherein h

이 특허를 인용한 특허 (43)

  1. Martin, Yves C.; Van Kessel, Theodore G., Air/fluid cooling system.
  2. Searls, Damion T.; Dishongh, Terrance J.; Pullen, David, Apparatus and method for passive phase change thermal management.
  3. Lee, Sang Cheol; Yoon, Sun Gyu; Jung, Sang Jun, Apparatus for cooling computer parts and method of manufacturing the same.
  4. Aoki, Russell S.; Crocker, Michael T.; Carter, Daniel P., Chamber sealing valve.
  5. Aoki,Russell S.; Crocker,Michael T.; Carter,Daniel P., Chamber sealing valve.
  6. Wagner,Guy R.; Patel,Chandrakant D., Cooling apparatus for dissipating heat from a heat source.
  7. Sugito, Hajime; Tanaka, Hiroshi; Ohara, Takahide, Cooling device boiling and condensing refrigerant.
  8. Jia Hao Li TW, Cylindrical heat radiator.
  9. Wang, Hao, Dissipation utilizing flow of refrigerant.
  10. Wang, Hao, Dissipation utilizing flow of refrigerant.
  11. Ghosh, Debashis; Bhatti, Mohinder Singh, Domed heat exchanger (porcupine).
  12. Cheung, Wai Kwan, Efficient cooler.
  13. Tajima Makoto (Tokyo JPX), Electronic component cooling unit.
  14. Tajima Makoto,JPX, Electronic component cooling unit.
  15. Wang, Hao, Evaporation-condensation systems and methods for their manufacture and use.
  16. Hao, Mingliang; Zhao, Jun, Heat dissipation device.
  17. Mochizuki Masataka (Tokyo JPX) Ono Motoyuki (Tokyo JPX) Mashiko Koichi (Tokyo JPX) Saito Yuji (Tokyo JPX) Hasegawa Masashi (Tokyo JPX) Nagata Masakatsu (Tokyo JPX), Heat pipe and process for manufacturing the same.
  18. Wahle Harold W. ; Giammaruti Robert J., Heat pipe heat exchanger for cooling or heating high temperature/high-pressure sub-sea well streams.
  19. Wang,Ying Chih; Kao,Yong Chang; Tsai,Chi Nan, Heat sink.
  20. Luo, Chin-Kuang, Heat-dissipating device.
  21. Wang, Chin-Wen, Hydronic pump type heat radiator.
  22. Ghosh, Debashis; Bhatti, Mohinder Singh, Integrated liquid cooled heat sink for electronic components.
  23. Bhatti,Mohinder Singh; Ghosh,Debashis; Reyzin,Ilya, Liquid cooled thermosiphon for electronic components.
  24. Bhatti, Mohinder Singh; Reyzin, Ilya; Joshi, Shrikant Mukund, Liquid cooled thermosiphon with condenser coil running in and out of liquid refrigerant.
  25. Reyzin,Ilya; Bhatti,Mohinder Singh, Liquid cooled thermosiphon with flexible coolant tubes.
  26. Bishop Michael,CAX ; Zapach Trevor,CAX ; Moss John,CAX, Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments.
  27. Roper, Christopher S.; Cumberland, Robert W., Planar heat pipe with architected core and vapor tolerant arterial wick.
  28. Lu, Qiao; Godecker, William, Refrigeration systems and methods for connection with a vehicle's liquid cooling system.
  29. Ching-Bin Lin TW, Self-recirculated heat dissipating means for cooling central processing unit.
  30. Pase ; Sr. Glennwood K., Single shell boiler.
  31. Crocker,Michael T.; Carter,Daniel P., Systems for improved heat exchanger.
  32. Shelnutt, Austin Michael; Curlee, James D., Techniques for controlling vapor pressure in an immersion cooling tank.
  33. Shelnutt, Austin Michael; Curlee, James Don, Techniques for controlling vapor pressure in an immersion cooling tank.
  34. Wang, Hao, Thin film systems and methods for using same.
  35. Lee,Hsieh Kun; Lai,Cheng Tien; Zhou,Alan, Tubular heat dissipation device.
  36. Sauciuc, Ioan; Chrysler, Gregory M., Tunnel-phase change heat exchanger.
  37. Puckett John Christopher, Two-phase constant-pressure closed-loop water cooling system for a heat producing device.
  38. Sehmbey Maninder Singh ; Bowers Morris B., Two-phase thermosyphon including a porous structural material having slots disposed therein.
  39. Siu, Wing Ming, Vapor augmented heatsink with multi-wick structure.
  40. Searls, Damion T.; Dishongh, Terrance J.; Dujari, Prateek J.; Lian, Bin, Vapor chamber active heat sink.
  41. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Vapor condenser with three-dimensional folded structure.
  42. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Vapor condenser with three-dimensional folded structure.
  43. Luo,Chin Kuang, Vapor-liquid separating type heat pipe device.
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