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Apparatus for cleaning articles utilizing supercritical and near supercritical fluids 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/10
출원번호 US-0348035 (1994-12-01)
발명자 / 주소
  • Marshall Mary C. (San Antonio TX)
출원인 / 주소
  • Southwest Research Institute (San Antonio TX 02)
인용정보 피인용 횟수 : 51  인용 특허 : 0

초록

Disclosed is an apparatus and method of removing contaminants from an article utilizing a supercritical or near supercritical fluid. The article to be cleaned is first contacted with a fluid in which the contaminant is soluble at a first supercritical or near temperature. The contaminate solubilized

대표청구항

An apparatus for removing contaminants from an article with a supercritical fluid, comprising: (a) a pressure vessel having a cooling zone, heating zone and a cleaning zone; (b) a support means positioned in the cleaning zone for supporting the article to be cleaned; (c) a heating means positioned t

이 특허를 인용한 특허 (51)

  1. Chinn,Joseph Andrew; Casanova,R. Michael, Antibiotic treated implantable medical devices.
  2. Bohnert,George W.; Hand,Thomas E.; DeLaurentiis,Gary M., Apparatus and method for removing solvent from carbon dioxide in resin recycling system.
  3. Mary C. Marshall ; John G. Franjione ; Christopher J. Freitas, Apparatus for contaminant removal using natural convection flow and changes in solubility concentration by temperature.
  4. Marshall, Mary C.; Franjione, John G.; Freitas, Christopher J.; Roberds, William T.; Pollard, Gordon D.; Blake, Jill, Apparatus for contaminant removal using natural convection flow and changes in solubility concentrations by temperature.
  5. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  6. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  7. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  8. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  9. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
  10. Jones, William D., High pressure fourier transform infrared cell.
  11. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  12. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  13. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  14. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  15. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  16. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  17. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  18. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  19. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  20. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  21. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  22. Marshall Mary C. ; Franjione John G. ; Freitas Christopher J., Method for contaminant removal using natural convection flow and changes in solubility concentration by temperature.
  23. McDermott,Wayne Thomas; Parris,Gene Everad; Roth,Dean Van John; Subawalla,Hoshang, Method for removal of flux and other residue in dense fluid systems.
  24. Bohnert,George W.; Hand,Thomas E.; DeLaurentiis,Gary M., Method for removing contaminants from plastic resin.
  25. Bohnert,George W.; Hand,Thomas E.; DeLaurentiis,Gary M., Method for removing contaminants from plastic resin.
  26. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  27. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  28. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  29. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  30. Bohnert,George W.; Hand,Thomas E.; Delaurentiis,Gary M., Method of removing contaminants from plastic resins.
  31. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  32. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  33. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  34. Wuester,Christopher D., Process flow thermocouple.
  35. McDermott,Wayne Thomas; Subawalla,Hoshang; Johnson,Andrew David; Schwarz,Alexander, Processing of semiconductor components with dense processing fluids and ultrasonic energy.
  36. Subawalla,Hoshang; Parris,Gene Everad; Rao,Madhukar Bhaskara; Kretz,Christine Peck, Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols.
  37. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.
  38. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.
  39. Summerfield John W. ; Markiewicz John P. ; Moses John M. ; Barcus Randall L., Removal of contaminants from materials.
  40. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  41. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  42. William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.
  43. Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.
  44. Mullee William H., Removal of resist or residue from semiconductors using supercritical carbon dioxide.
  45. Bohnert,George W.; Hand,Thomas E.; DeLaurentiis,Gary M., Solvent cleaning system and method for removing contaminants from solvent used in resin recycling.
  46. Joyce, Patrick C.; Tipton, Adrianne; Shrinivasan, Krishnan; Hess, Dennis W.; Myneni, Satyanarayana; Levitin, Galit, Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials.
  47. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  48. Bohnert, George W.; Hand, Thomas E.; DeLaurentiis, Gary M., System for removing contaminants from plastic resin.
  49. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  50. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  51. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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