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Heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
  • F28F-003/04
출원번호 US-0294830 (1994-08-29)
우선권정보 JP-0281778 (1993-10-15); JP-0319126 (1993-11-24)
발명자 / 주소
  • Ishida Yoshio (Osaka JPX)
출원인 / 주소
  • Diamond Electroic Mfg. Co. Ltd. (Osaka JPX 03)
인용정보 피인용 횟수 : 48  인용 특허 : 0

초록

A heat sink comprising a heat receiving plate and at least one piece of heat radiating fin stacked on the heat receiving plate, wherein slits which penetrate the heat radiating fin from the upper to lower surface are formed on a flat plate surface of the heat radiating fin, and a plurality of fin pr

대표청구항

A heat sink comprising: a heat receiving plate adapted to be mounted on a heat generating body; and at least one heat radiating fin stacked on said heat receiving plate, wherein slits which pass through said heat radiating fin are formed on a first portion of a flat plate surface of said heat radiat

이 특허를 인용한 특허 (48)

  1. Dunn, William; Diaz, Marcos; Azevedo, Kyle, Back to back electronic display assembly.
  2. Dunn, William, Constricted convection cooling system for an electronic display.
  3. Carl Kabrell FI; Reijo Lehtiniemi FI; Jukka Rantala FI; Timo Heikkila FI; Tapio Tuamainen FI, Cooling apparatus based on heat energy bound to working fluid in phase transition.
  4. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion.
  5. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  6. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  7. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  8. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  9. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  10. Dunn, William; Le, Don; Bedell, Ware, Electronic display assembly having thermal cooling plate and optional convective air cooling loop.
  11. Burward-Hoy Trevor, Electronic package cooling system and heat sink with heat transfer assembly.
  12. Dunn, William; Bedell, Ware; Hubbard, Tim, Expanded heat sink for electronic displays.
  13. Smith Dean L. ; Sobresky Edmund J. ; Kerr Roger S., Extruded, tiered high fin density heat sinks and method of manufacture.
  14. Dunn, William; O'Connor, Kevin, Figure eight closed loop cooling system for electronic display.
  15. Parish, Overton L.; Quisenberry, Tony; Havis, Clark R., Geometrically reoriented low-profile phase plane heat pipes.
  16. Liu, HeBen, Heat dissipating apparatus and method for producing same.
  17. Jia Hao Li TW, Heat dissipating apparatus with nest wind duct.
  18. Liu,Hsiang Chao, Heat dissipation device.
  19. Wu,Yi Qiang, Heat dissipation device.
  20. Dunn, William; Hubbard, Tim; O'Connor, Kevin, Heat exchanger assembly for an electronic display.
  21. Dunn, William; Hubbard, Tim, Heat exchanger for an electronic display.
  22. Dunn, William R., Heat exchanger for back to back electronics displays.
  23. Burward-Hoy Trevor, Heat exchanger for electronic equipment.
  24. Quisenberry,Tony; Havis,Clark R., Heat pipe connection system and method.
  25. Meyer, IV, George Anthony; Sun, Chien Hung; Chen, Chieh Ping, Heat sink.
  26. Katsui Tadashi,JPX, Heat sink and information processor using heat sink.
  27. Katsui, Tadashi, Heat sink and information processor using heat sink.
  28. Tadashi Katsui JP, Heat sink and information processor using heat sink.
  29. Boudreaux,Brent A., High surface area heat sink.
  30. Dunn, William; Diaz, Marcos; Azevedo, Kyle, Hybrid rear cover and mounting bracket for electronic display.
  31. Ingalz,Charles J., Interleaved memory heat sink.
  32. Quisenberry, Tony, Method and system for automotive battery cooling.
  33. Quisenberry, Tony, Method for automotive battery cooling.
  34. Burhan Ozmat, Method of cooling an electronic power module using a high performance heat exchanger incorporating metal foam therein.
  35. Parish, Overton L.; Quisenberry, Tony; Havis, Clark R., Method of removing heat utilizing geometrically reoriented low-profile phase plane heat pipes.
  36. Pike, Eric, Power delivery using an integrated heat spreader.
  37. Pike,Eric, Power delivery using an integrated heat spreader.
  38. Mohammad A. Tantoush, Scalable and modular heat sink-heat pipe cooling system.
  39. Tantoush, Mohammad A., Scalable and modular heat sink-heat pipe cooling system.
  40. Jacoby John, Stacked fin heat sink construction and method of manufacturing the same.
  41. Parish, IV,Overton L.; Quisenberry,Tony, Stacked low profile cooling system and method for making same.
  42. Parish, IV,Overton L.; Quisenberry,Tony, Stacked low profile cooling system and method for making same.
  43. Parish, Overton L.; DeVilbiss, Roger S., Stacked low profile cooling system and method for making same.
  44. Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.
  45. Shiaw-Jong S. Chen ; Roger J. Hooey, Top mounted cooling device using heat pipes.
  46. Quisenberry,Tony; Hester,Darren C.; Parish,Overton L., Toroidal low-profile extrusion cooling system and method thereof.
  47. Male, Barry Jon; Hower, Philip L., Vertical thermoelectric structures.
  48. Male, Barry Jon; Hower, Philip L., Vertical thermoelectric structures.
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